Abstract:
L'invention concerne un procédé de test d'éléments électriques (2-1) comprenant des étapes consistant à appliquer un premier faisceau de particules (4-1) à un premier emplacement (3- 1) d'un élément électrique, pour libérer des électrons du premier emplacement, appliquer un second faisceau de particules (4-2) à un second emplacement (3-2) d'un élément électrique, avec un décalage temporel (Δt) non nul relativement à l'application du premier faisceau de particules (4-1) , pour libérer des électrons du second emplacement, collecter des électrons libérés sous l'effet des premier et second faisceaux de particules, et mesurer au moins une quantité de charges électriques correspondant à la collecte des électrons libérés sous l'effet du second faisceau de particules, et en déduire quantitativement ou qualitativement une caractéristique électrique de l'élément électrique.
Abstract:
L'invention concerne un procédé de test ou mesure d'éléments électriques, dans lequel un faisceau (6) de particules est appliqué à un emplacement d'un élément électrique (2, 3) , des charges sont libérées sous l'effet de l'application du faisceau (6) de particules, les charges libérées sont collectées par un collecteur (9) , la quantité de charges collectées est mesurée, et une caractéristique électrique est déduite de la mesure de la quantité de charges collectées. L'invention s'applique, en particulier, à la mesure de la résistance et /ou de la capacité de circuits imprimés, ainsi qu'à tout autre type de substrats tels que des écrans plats, circuits équipés de composants, puces à semi- conducteurs .
Abstract:
A backlight block of a vision system for a semiconductor device can align a semiconductor package at an exact position without disturbing a photographing for vision inspection of the semiconductor package. The backlight block includes: a seating block for seating a semiconductor package to be subject to a vision inspection; and an alignment means movably located on the seating block in such a manner that the alignment means can be moved toward or away from the semiconductor package so as to align the semiconductor package.
Abstract:
A system, apparatus, and method for analyzing photon emission data to discriminate between photons emitted by transistors and photons emitted by background sources. The analysis involves spatial and/or temporal correlation of photon emissions. After correlation, the analysis may further involve obtaining a likelihood that the correlated photons were emitted by a transistor. After correlation, the analysis may also further involve assigning a weight to individual photon emissions as a function of the correlation. The weight, in some instances, reflecting a likelihood that the photons were emitted by a transistor. The analysis may further involve automatically identifying transistors in a photon emission image.
Abstract:
A non-contacting capacitive diagnostic device includes a pulsed light source for producing an electric field in a semiconductor or photovoltaic device or material to be evaluated (PV substrate) and a circuit responsive to the electric field. The circuit is not in physical contact with the device or material being evaluated (PV substrate) and produces an electrical signal (Vpv) characteristic of the electric field produced in the device or material (PV substrate). The diagnostic device permits quality control and evaluation of semiconductor or photovoltaic device properties in continuous manufacturing process.
Abstract:
Systems and methods consistent with principles of the present invention allow contactless measuring of various kinds of electrical activity within an integrated circuit. The invention can be used for high-bandwidth, at speed testing of various devices on a wafer during the various stages of device processing, or on packaged parts at the end of the manufacturing cycle. Power is applied to the test circuit using conventional mechanical probes or other means, such as CW laser light applied to a photoreceiver provided on the test circuit. The electrical test signal is introduced into the test circuit by stimulating the circuit using a contactless method, such as by directing the output of one or more modelocked lasers onto high-speed receivers on the circuit, or by using a high-speed pulsed diode laser. The electrical activity within the circuit in response to the test signal is sensed by a receiver element, such as a time-resolved photon counting detector, a static emission camera system, or by an active laser probing system. The collected information is used for a variety of purposes, including manufacturing process monitoring, new process qualification, and model verification.
Abstract:
The probe station (10) includes the chuck (12) that supports the electrical device (14) to be probed by the probe apparatus (16) that extends through an opening in the platen (18), an outer shield box (24) provides sufficient space for the chuck (12) to be moved laterally by positioner (22), because the chuck (12) may freely move within the outer shield box (24), a suspended member (26) electrically interconnected to a guard potential may readily position above the chuck (12).
Abstract:
The present invention discloses a positioning system that includes at least three positioner assemblies. Each positioner assembly includes a housing with a coarse adjustment assembly and a fine adjustment assembly disposed within the housing. The positioner assemblies are releasably coupled to a wafer chuck and operable to selectively position the chuck. More particularly, the fine adjustment assembly includes a piezoelectric actuator that is selectively movable between a retracted position and an extended position.
Abstract:
The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
Abstract:
A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip.