公开(公告)号：WO2018063686A1

公开(公告)日：2018-04-05

申请号：PCT/US2017/049224

申请日：2017-08-29

Applicant: INTEL CORPORATION

Inventor： SRINIVASAN, Vasudevan ,  BORKOWSKI, Daniel G.

IPC: H01L25/16 ,  H01L25/18 ,  H01L23/66 ,  H01L27/115

CPC classification number: H01L23/5385 ,  G06F1/26 ,  G06F9/4401 ,  G06F12/0246 ,  H01L25/18

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing late fusing of processor features using a non-volatile memory. For instance, there is disclosed in accordance with one embodiment a functional semiconductor package, including: a processor core configurable via a plurality of configuration registers; a non-volatile storage, in which a first portion of the non-volatile storage includes permanently lockable storage that once written cannot be overwritten or modified, and in which a second portion of the non-volatile storage includes the plurality of configuration registers; a first write interface to the non-volatile storage, in which the permanently lockable storage of the non-volatile storage is wirelessly writable externally from the functional semiconductor package via the first write interface; a second write interface to the non-volatile storage through which the plurality of configuration registers are writable; configuration data for the processor core written wirelessly into the permanently lockable storage of the non-volatile storage; and in which the configuration data is distributed into the plurality of configuration registers via the second write interface at every boot of the functional semiconductor package. Other related embodiments are disclosed.

Abstract translation: 根据所公开的实施例，提供了用于使用非易失性存储器来实现处理器特征的后期融合的系统，方法和设备。 例如，根据一个实施例公开了一种功能半导体封装，包括：可通过多个配置寄存器配置的处理器内核; 非易失性存储装置，其中非易失性存储装置的第一部分包括永久可锁定的存储装置，该永久可锁定的存储装置一旦被写入就不能被重写或修改，并且其中非易失性存储装置的第二部分包括多个配置寄存器; 至非易失性存储器的第一写入接口，其中非易失性存储器的永久可锁定存储器经由第一写入接口从功能半导体封装体外部无线写入; 到所述非易失性存储器的第二写入接口，通过所述第二写入接口所述多个配置寄存器是可写的; 处理器核心的配置数据无线地写入非易失性存储器的永久可锁定存储器中; 并且其中在功能半导体封装的每次启动时通过第二写入接口将配置数据分配到多个配置寄存器中。 披露了其他相关的实施例。

公开(公告)号：WO2014105143A1

公开(公告)日：2014-07-03

申请号：PCT/US2013/046580

申请日：2013-06-19

Applicant: INTEL CORPORATION ,  SRINIVASAN, Vasudevan ,  HERMERDING II, James G. ,  SUBRAMANIAN, Ramya

Inventor： SRINIVASAN, Vasudevan ,  HERMERDING II, James G. ,  SUBRAMANIAN, Ramya

IPC: G06F1/26

CPC classification number: G05D23/19 ,  G06F1/206 ,  G06F1/3206 ,  Y02D10/16

Abstract: Methods and apparatus relating to priority based intelligent platform passive thermal management are described. In one embodiment, the power consumption limit of one or more components of a platform is modified based on one or more thermal relationships between one or more power consuming components of the platform and one or more heat generating components of the platform. Furthermore, a first relationship of the one or more thermal relationships indicates an influence priority of a source component of the platform on a target component of the platform. Other embodiments are also claimed and disclosed.

Abstract translation: 描述了基于优先级智能平台被动热管理的方法和设备。 在一个实施例中，基于平台的一个或多个功耗部件与平台的一个或多个发热部件之间的一个或多个热关系来修改平台的一个或多个部件的功耗限制。 此外，一个或多个热关系的第一关系表示平台的源组件对平台的目标组件的影响优先级。 还要求和公开其它实施例。

公开(公告)号：WO2014105133A1

公开(公告)日：2014-07-03

申请号：PCT/US2013/046350

申请日：2013-06-18

Applicant: INTEL CORPORATION ,  HERMERDING II, James G. ,  SUBRAMANIAN, Ramya ,  SRINIVASAN, Vasudevan

Inventor： HERMERDING II, James G. ,  SUBRAMANIAN, Ramya ,  SRINIVASAN, Vasudevan

IPC: G06F1/26

CPC classification number: G06F9/5094 ,  G06F1/206 ,  G06F1/3234 ,  Y02D10/16 ,  Y02D10/22

Abstract: Methods and apparatus relating to table driven multiple passive trip, platform passive thermal management are described. In one embodiment, the power consumption limit of one or more components of a platform is modified based on one or more thermal relationships between one or more power consuming components of the platform and one or more heat generating components of the platform. Furthermore, a first relationship of the one or more thermal relationships indicates a mapping between a plurality of temperature thresholds and a corresponding plurality of performance limits. Other embodiments are also claimed and disclosed.

Abstract translation: 描述了与桌面驱动多被动跳闸，平台被动热管理有关的方法和设备。 在一个实施例中，基于平台的一个或多个功耗部件与平台的一个或多个发热部件之间的一个或多个热关系来修改平台的一个或多个部件的功耗限制。 此外，一个或多个热关系的第一关系表示多个温度阈值与对应的多个性能极限之间的映射。 还要求和公开其它实施例。

公开(公告)号：WO2022240905A1

公开(公告)日：2022-11-17

申请号：PCT/US2022/028632

申请日：2022-05-10

Applicant: INTEL CORPORATION

Inventor： BARTFAI-WALCOTT, Katalin ,  ORIOL, Mariusz ,  SRINIVASAN, Vasudevan ,  IRELAN, Peggy ,  STEPKA, Mariusz ,  MURPHY, Kaitlin ,  PILLILLI, Bharat ,  BALDWIN, Mark ,  BRONK, Mateusz ,  KARIM, Fariaz ,  BERENT, Arkadiusz ,  CHILUKURI, Vasuki

IPC: G06F21/53 ,  G06F9/455 ,  G06F9/50 ,  G06F21/60 ,  G06F21/62 ,  G06F21/64 ,  G06F21/71 ,  G06F21/73 ,  G06F21/604 ,  G06F21/6218 ,  G06F21/645 ,  G06F2221/2111 ,  G06F9/5088

Abstract: Methods, apparatus, systems and articles of manufacture (e.g., physical storage media) to implement license management solutions for software defined silicon (SDSi) products are disclosed. Example license management solutions disclosed herein include, but are not limited to, virtual resource migration using SDSi, resource configuration management using SDSi, hardware self-configuration using SDSi, reduced footprint agents using SDSi, performing SDSi usage evaluation and corresponding license transfer responsive to detected and/or predicted failures, transferring node locked SDSi licenses, transfer of SDSi licenses without a trusted license server, community license generation, expirable SDSi licenses via a reliable clock, non-node locked licenses via blockchain, and activating hardware features with a pre-generated hardware license.

公开(公告)号：WO2022133778A1

公开(公告)日：2022-06-30

申请号：PCT/CN2020/138531

申请日：2020-12-23

Applicant: INTEL CORPORATION ,  SRINIVASAN, Vasudevan ,  GRIMSRUD, Knut ,  VAN DE GROENENDAAL, Johan ,  ORIOL, Mariusz ,  AHUJA, Nishi ,  ZHOU, Shen ,  ALT, Samantha ,  BARTFAI-WALCOTT, Katalin ,  BERENT, Arkadiusz

Inventor： SRINIVASAN, Vasudevan ,  GRIMSRUD, Knut ,  VAN DE GROENENDAAL, Johan ,  ORIOL, Mariusz ,  AHUJA, Nishi ,  ZHOU, Shen ,  ALT, Samantha ,  BARTFAI-WALCOTT, Katalin ,  BERENT, Arkadiusz

IPC: G06F17/40

Abstract: Methods, apparatus, systems and articles of manufacture (e.g., physical storage media) to implement software defined silicon feature configuration pay-as-you-go licensing are disclosed. A disclosed silicon semiconductor device includes a first counter that increments a first count when a timer expires and, responsive to expiration of the timer, a feature configuration sampler to sample a state of a configuration of a feature of the silicon semiconductor device. In addition, the silicon semiconductor device includes a second counter that increments a second count when the sampled state of the configuration of the feature indicates the feature is active. A feature up-time tracker is also included outputs a value representative of an amount of time the configuration has been active, where the amount of time is based on the first count and the second count.

公开(公告)号：WO2018236543A1

公开(公告)日：2018-12-27

申请号：PCT/US2018/034568

申请日：2018-05-25

Applicant: INTEL CORPORATION

Inventor： AL-RAWI, Asma H. ,  ARDANAZ, Federico ,  EASTEP, Jonathan M. ,  SHAPIRA, Dorit ,  SISTLA, Krishnakanth V. ,  GUPTA, Nikhil ,  SRINIVASAN, Vasudevan ,  MACNAMARA, Chris

IPC: G06F1/32 ,  G06F9/50

CPC classification number: G06F1/06 ,  G06F1/04 ,  G06F1/08 ,  G06F1/324 ,  G06F9/4812 ,  G06F9/5044 ,  G06F9/505 ,  G06F9/5094 ,  G06F2209/5022 ,  G06F2209/504

Abstract: An apparatus system is provided which comprises: a first component and a second component; a first circuitry to assign the first component to a first group of components, and to assign the second component to a second group of components; and a second circuitry to assign a first maximum frequency limit to the first group of components, and to assign a second maximum frequency limit to the second group of components, wherein the first component and the second component are to respectively operate in accordance with the first maximum frequency limit and the second maximum frequency limit.

公开(公告)号：WO2016105798A1

公开(公告)日：2016-06-30

申请号：PCT/US2015/062291

申请日：2015-11-24

Applicant: INTEL CORPORATION

Inventor： VALAVI, John, J. ,  TRETHEWEY, James, R. ,  SRINIVASAN, Vasudevan ,  HEGGE, Doug

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/203 ,  G06F3/0202

Abstract: In one example a electronic device comprises at least one heat generating component, a thermal management module comprising logic, at least partly including hardware logic, to receive a signal from the sensor indicating that the electronic device is coupled to an external device, receive thermal dissipation capability data from the external device, and update a thermal management platform for the electronic device to accommodate the thermal dissipation capability data received from the external device. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括至少一个发热部件，热管理模块，其包括至少部分地包括硬件逻辑的逻辑，以从传感器接收指示电子设备耦合到外部设备的信号，接收散热 并且更新用于电子设备的热管理平台以适应从外部设备接收的散热能力数据。 可以描述其他示例。

公开(公告)号：WO2014209720A1

公开(公告)日：2014-12-31

申请号：PCT/US2014/042971

申请日：2014-06-18

Applicant: INTEL CORPORATION

Inventor： MILENKOVIC, Milan ,  HANEBUTTE, Ulf R. ,  SRINIVASAN, Vasudevan

IPC: H02J3/12 ,  H02J3/38

CPC classification number: H02J13/0079 ,  H02J3/38 ,  Y02E40/72 ,  Y04S10/12

Abstract: Techniques for adaptive demand/response power management. Power consumption and battery charge level of a platform having a battery with a smart power module are monitored. Information indicating the power consumption and battery charge level for the platform is provided to a remote demand/response management device. The remote demand/response management device and the smart power module receive a command to modify one or more power consumption characteristics of the platform. The one or more power consumption characteristics of the platform are to be changed in response to the command.

Abstract translation: 自适应需求/响应电源管理技术。 监视具有智能电源模块的电池的平台的功耗和电池充电量。 向远程需求/响应管理装置提供表示该平台的功率消耗和电池充电量的信息。 远程需求/响应管理设备和智能功率模块接收到修改平台的一个或多个功耗特性的命令。 响应于该命令，平台的一个或多个功耗特性将被改变。

公开(公告)号：WO2012087598A3

公开(公告)日：2012-06-28

申请号：PCT/US2011/064042

申请日：2011-12-08

Applicant: INTEL CORPORATION ,  DISTEFANO, Eric ,  THERIEN, Guy M. ,  SRINIVASAN, Vasudevan ,  RAMANI, Venkatesh ,  WELLS, Ryan D. ,  GUNTHER, Steven H. ,  SHRALL, Jeremy ,  HERMERDING II, James ,  RAHAL-ARABI, Tawfik

Inventor： DISTEFANO, Eric ,  THERIEN, Guy M. ,  SRINIVASAN, Vasudevan ,  RAMANI, Venkatesh ,  WELLS, Ryan D. ,  GUNTHER, Steven H. ,  SHRALL, Jeremy ,  HERMERDING II, James ,  RAHAL-ARABI, Tawfik

IPC: G06F1/00 ,  G06F1/32

Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.

公开(公告)号：WO2012003239A2

公开(公告)日：2012-01-05

申请号：PCT/US2011/042449

申请日：2011-06-29

Applicant: INTEL CORPORATION ,  HERMERDING II, James, G. ,  RODRIGUEZ, Jorge, P. ,  SRINIVASAN, Vasudevan

Inventor： HERMERDING II, James, G. ,  RODRIGUEZ, Jorge, P. ,  SRINIVASAN, Vasudevan

IPC: G06F1/32 ,  G06F1/26 ,  H02J7/00

CPC classification number: H02J7/34 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3234 ,  H02J7/0068 ,  Y02D10/16 ,  Y10T307/625

Abstract: Systems and methods of managing platform power consumption may involve determining a power consumption level of a platform based on at least in part a current supplied by an AC adaptor. A power limit of an integrated circuit in the platform can be determined based on at least in part the power consumption level of the platform, wherein the power level may be applied to the integrated circuit.

Abstract translation: 管理平台功耗的系统和方法可涉及至少部分地基于由AC适配器提供的电流来确定平台的功耗级别。 平台中集成电路的功率限制可以至少部分地基于平台的功耗级别来确定，其中功率级别可以被应用于集成电路。