Abstract:
A method for forming a photodetector device includes forming an insulator layer on a substrate, forming a germanium (Ge) layer on the insulator layer and a portion of the substrate, forming a second insulator layer on the Ge layer, implanting n-type ions in the Ge layer, patterning the n-type Ge layer, forming a capping insulator layer on the second insulator layer and a portion of the first insulator layer, heating the device to crystallize the Ge layer resulting in an single crystalline n-type Ge layer, and forming electrodes electrically connected to the single crystalline n-type Ge layer.
Abstract:
The present invention is directed toward a detector structure, detector arrays, and a method of detecting incident radiation. The present invention comprises a photodiode array and method of manufacturing a photodiode array that provides for reduced radiation damage susceptibility, decreased affects of crosstalk, reduced dark current (current leakage) and increased flexibility in application.
Abstract:
A photon detector comprising a plurality of quantum dots, a sensing region and measurement means for measuring an electrical characteristic of the sensing region, said sensing region being located such that a change in the charged state of said quantum dots causes a change in the electrical characteristics of said sensing region, the detector further comprising photon counting means for determining the number of photons detected in a pulse of radiation from changes in the electrical characteristics of the sensing region.
Abstract:
A photodiode includes an anode (1202, 1302, 1402) and a cathode (1306, 1406) formed on a semiconductor substrate (402). A vertical electrode (702, 1314, 1414) is in operative electrical communication with a buried component (502, 1312, 1412) of the photodiode. In one implementation, the photodiode is an avalanche photodiode of a silicon photomultiplier. The substrate may also include integrated CMOS readout circuitry (1102).
Abstract:
An electronic switching component (1) with gallium arsenide-based field effect transistors has its own housing (2) with at least one transparent section (3). An electronic microwave circuit (10) has at least one electronic switching component (1) with gallium arsenide-based field effect transistors and its own housing (2) with at least one transparent section (3). The at least one electronic switching component (1) can be illuminated by means of at least one light source (6, 11).
Abstract:
An integrated circuit may include at least one active optical device including a superlattice including a plurality of stacked groups of layers. Each group of layers of the superlattice may include a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and an energy band-modifying layer thereon. The energy-band modifying layer may include at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The integrated circuit may further include a waveguide coupled to the at least one active optical device.
Abstract:
The use of an always-depleted photodiode in a Time-of-Flight, ToF, depth image sensor is disclosed. One example provides a method of operating a pixel (400) of a depth image sensor, the method comprising receiving photons in a photocharge generation region (410, 412) of the pixel (400), the photocharge generation region (410, 412) of the pixel comprising an always-depleted photodiode formed by a doped first region (410) comprising one of p-doping or n-doping and a more lightly-doped second region (412) comprising the other of p-doping or n-doping. The method further comprises, during an integration phase, energizing a clock gate for a pixel tap, thereby directing photocharge generated in the photocharge generation region (410), 412) to an in-pixel storage comprising a capacitor, and in a readout phase, reading charge out from the in-pixel storage. Pixel (400) further comprises shallow trench isolation, STI, regions (414a, 414b) disposed at the transistor side of pixel (400), and/or a divider region (416) disposed within second region (412) and between clock gates (404a, 404b). Divider region (416) comprises a different doping than more lightly-doped second region (412). The depth image sensor also includes deep trench isolation, DTI, regions (420) comprising a dielectric material disposed between pixels. An always- depleted region is created by P-N junction (402) extending through the thickness of the pixel. As a result, a permanent electric field is created that extends substantially or completely through the depth of the pixel.
Abstract:
A photodetector comprises a graphene layer formed on a substrate, and a photoactive structure formed on the graphene layer. The photoactive structure comprises quantum dots and a ferroelectric polymer layer, and configured to generate carrier holes when illuminated. The ferroelectric polymer layer has an internal electric field that extends into the graphene layer to facilitate transport of photoinduced carrier holes from the photoactive structure into the graphene layer, thereby improving photoresponse of the photodetector.