公开(公告)号：WO2013109404A2

公开(公告)日：2013-07-25

申请号：PCT/US2012/072260

申请日：2012-12-31

Applicant: MACDERMID ACUMEN, INC.

Inventor： FENG, Kesheng ,  NABLE, Jun ,  MCCAHERTY, Adam

IPC: C25D5/34 ,  C11D7/60

CPC classification number: C25D5/34 ,  C23G1/103 ,  C25D7/123

Abstract: An aqueous treatment solution for increasing the cleaning capability of a treated copper surface comprising: a) an organic compound selected from the group consisting of organic acids, alcohols, ketone, nitriles and combinations of one or more of the foregoing; and b) an oxidizing agent. The aqueous treatment solution is usable in a process for metallizing the walls of holes within a printed wiring board substrate having metallic and non-metallic regions, wherein the printed wiring board is treated with a reducing agent and then contacted with an aqueous dispersion of carbonaceous particles to form a coating of the dispersion over the substrate. The process comprises the step of contacting the metallic regions of the printed wiring board substrate with the aqueous treatment solution to remove deposited carbonaceous particles therefrom. The aqueous treatment solution provides a clean copper surface while providing a low microetch rate.

Abstract translation: 一种用于提高经处理的铜表面的清洁能力的水性处理溶液，包括：a）选自有机酸，醇，酮，腈以及前述一种或多种的组合的有机化合物; 和b）氧化剂。 该水处理溶液可用于金属化具有金属和非金属区域的印刷线路板基板内的孔壁的方法，其中印刷线路板用还原剂处理，然后与碳质颗粒的水分散体 以在基底上形成分散体的涂层。 该方法包括使印刷线路板基板的金属区域与水处理溶液接触以从其中除去沉积的碳质颗粒的步骤。 水处理溶液提供清洁的铜表面，同时提供低的微蚀刻速率。

公开(公告)号：WO2013078077A2

公开(公告)日：2013-05-30

申请号：PCT/US2012/065419

申请日：2012-11-16

Applicant: MACDERMID ACUMEN, INC.

Inventor： TOSCANO, Lenora, M. ,  LONG, Ernest ,  PAW, Witold ,  KOLOGE, Donna ,  KOYASU, Katsutsugu ,  NISHU, Keisuke

IPC: H01L33/08 ,  B05D3/00 ,  H01L33/40

CPC classification number: B23K1/203 ,  B23K1/0012 ,  B23K2201/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025

Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the ekctroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs).

Abstract translation: 一种用于处理金属表面以减少其上的腐蚀和/或增加处理表面的反射率的方法，所述方法包括：a）用化学镀镍溶液电镀金属表面; 然后b）在无电镀镍表面上浸镀银，从而基本上防止金属表面的腐蚀和/或镀银表面的反射率得到显着改善。 该处理方法对于增加金属表面的可焊性是有用的，例如在电子封装应用和制造发光二极管（LED）中。

公开(公告)号：WO2013028309A1

公开(公告)日：2013-02-28

申请号：PCT/US2012/048228

申请日：2012-07-26

Applicant: MACDERMID ACUMEN, INC. ,  FENG, Kesheng

Inventor： FENG, Kesheng

IPC: C23F11/00

CPC classification number: C09D5/1625 ,  C09D5/086 ,  C23F11/10 ,  C23F11/161 ,  Y10T428/31678

Abstract: An aqueous tarnish inhibiting solution comprising a mercapto carboxylic acid find a corrosion inhibitor to produce an anti-tarnish layer on metal surfaces, such as silver plated copper leadframes and a method of using the same is pro vided. The composition provides an improved anti-tamish layer that does not affect wirebondability or the adhesion of a mold compound to a leadfrarne.

Abstract translation: 包含巯基羧酸的水性晦暗抑制溶液发现腐蚀抑制剂以在金属表面上产生抗晦暗层，例如镀银铜引线框架，并提供使用它们的方法。 该组合物提供了改善的抗混浊层，其不影响模具化合物对引导剂的引线键合性或粘合性。

公开(公告)号：WO2011093934A8

公开(公告)日：2012-08-23

申请号：PCT/US2010056121

申请日：2010-11-10

Applicant: MACDERMID ACUMEN INC ,  HAMILTON ROBERT ,  LONG ERNEST ,  KROL ANDREW M

Inventor： HAMILTON ROBERT ,  LONG ERNEST ,  KROL ANDREW M

IPC: H01L21/4763 ,  H01L21/44 ,  H01L23/04

CPC classification number: B05D3/06 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/38 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0786 ,  H05K2203/107 ,  H05K2203/122

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylaied alcohol surfactant; and (ill) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract translation: 描述了一种处理其中分散有金属化合物的激光活化热塑性基材的方法。 将底物与含水组合物接触，所述水性组合物包含：（i）硫醇官能的有机化合物; （ii）乙氧基化醇表面活性剂; 和（不）黄原胶。 通过使用处理组合物，当基板随后通过无电镀进行激光激活和电镀时，基本上消除了基板的外部电镀。

公开(公告)号：WO2012067725A1

公开(公告)日：2012-05-24

申请号：PCT/US2011/054695

申请日：2011-10-04

Applicant: MACDERMID ACUMEN, INC. ,  PEARSON, Trevor

Inventor： PEARSON, Trevor

IPC: C25D5/18 ,  C25D3/06

CPC classification number: C25B1/00 ,  C25D3/06 ,  C25D21/18

Abstract: An eleciroiytic cell for replenisHng chromium content of a trivalent chromium electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electiOde and the second electrode, In this manner, trivalent; chromium is eieetrolytically dissolved from the cliromiuni electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.

Abstract translation: 提供一种用于补充三价铬电解质的铬含量的电解槽，以及使用电解槽补充三价铬含量的方法。 该方法包括以下步骤：将铬电极和第二电极浸入三价铬电解质中，并施加交替脉冲电流穿过铬电极和第二电极。 铬从电极电极中被电解溶解，并且富含铬电极的电解质的三价铬含量被富集。

公开(公告)号：WO2012033568A1

公开(公告)日：2012-03-15

申请号：PCT/US2011/044613

申请日：2011-07-20

Applicant: MACDERMID ACUMEN, INC. ,  TOSCANO, Lenora, M. ,  LONG, Emest ,  PAW, Witold ,  KOLOGE, Donna, M. ,  KOYASU, Katsutsugu ,  NISHU, Keisuke

Inventor： TOSCANO, Lenora, M. ,  LONG, Emest ,  PAW, Witold ,  KOLOGE, Donna, M. ,  KOYASU, Katsutsugu ,  NISHU, Keisuke

IPC: B05D3/00

CPC classification number: B23K1/203 ,  B23K1/0012 ,  B23K2201/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025 ,  Y10T428/12896

Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.

Abstract translation: 一种用于处理金属表面以减少其上的腐蚀和/或增加处理表面的反射率的方法，所述方法包括：a）用化学镀镍溶液电镀金属表面; 然后b）在镀镍的化学镀面上浸镀银，从而基本上防止金属表面的腐蚀和/或镀银表面的反射率得到显着提高。 该处理方法可用于增加金属表面的可焊性，例如在电子封装应用中。

公开(公告)号：WO2011093934A1

公开(公告)日：2011-08-04

申请号：PCT/US2010/056121

申请日：2010-11-10

Applicant: MACDERMID ACUMEN, INC. ,  HAMILTON, Robert ,  LONG, Ernest ,  KROL, Andrew, M.

Inventor： HAMILTON, Robert ,  LONG, Ernest ,  KROL, Andrew, M.

IPC: H01L21/4763 ,  H01L21/44 ,  H01L23/04

CPC classification number: B05D3/06 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/38 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0786 ,  H05K2203/107 ,  H05K2203/122

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylaied alcohol surfactant; and (ill) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract translation: 描述了一种处理其中分散有金属化合物的激光活化热塑性基材的方法。 将底物与含水组合物接触，所述水性组合物包含：（i）硫醇官能的有机化合物; （ii）乙氧基化醇表面活性剂; 和（不）黄原胶。 通过使用处理组合物，当基板随后被激光激活并通过无电镀进行电镀时，基本上消除了基板的外部电镀。

公开(公告)号：WO2005039879A3

公开(公告)日：2005-07-07

申请号：PCT/US2004028850

申请日：2004-09-07

Applicant: MACDERMID ACUMEN INC

Inventor： CAMPION KEVIN R ,  BARCLAY AARON G

IPC: B41J2/175

CPC classification number: B41J2/175 ,  B41J2/17513 ,  B41J2/17523 ,  B41J2/17553

Abstract: A fluid delivery system of the invention comprises one or more intercoupled cartridge assembles. Each cartridge assembly comprises a plurality of interconnected cartridges, each comprising a reservoir for holding jetting fluid and an ink jet print head operatively connected to the reservoir. Each cartridge assembly is interconnected by a first interconnection assembly and a second interconnection assembly. The first interconnection assembly maintains the plurality of interconnected cartridges at a negative pressure. The second interconnection assembly maintains at least an essentially equal level of jetting fluid within each of the reservoirs of the plurality of cartridges. Jetting fluid is replenished in the plurality of interconnected cartridges by replenishing jetting fluid in a selected cartridge and using the second interconnection assembly to distribute the jetting fluid among the reservoirs of the interconnected cartridges. A sensor is coupled to the selected reservoir to monitor the level of jetting fluid in the cartridge assembly.

Abstract translation: 本发明的流体输送系统包括一个或多个相互连接的药筒组件。 每个盒组件包括多个互连盒，每个盒包括用于保持喷射流体的储存器和可操作地连接到储存器的喷墨打印头。 每个盒组件通过第一互连组件和第二互连组件互连。 第一互连组件将多个互连的盒保持在负压下。 第二互连组件在多个盒的每个贮存器内保持至少基本相等水平的喷射流体。 通过在选定的筒中补充喷射流体并且使用第二互连组件来将喷射流体分配在互连筒的储存器中，喷射流体补充到多个互连筒中。 传感器连接到选定的储存器以监测药筒组件中的喷射流体的液位。

公开(公告)号：WO2005044550A3

公开(公告)日：2005-05-19

申请号：PCT/US2004/030347

申请日：2004-09-16

Applicant: MACDERMID ACUMEN, INC.

Inventor： BALDWIN, Kyle

IPC: B32B3/02

Abstract: The invention relates to a protective U.V. curable or photoimageable cover layer for an optical disk substrate and a method of applying the protective cover layer to an optical substrate. The U.V. curable or photoimageable layer is applied as a dry film and has high clarity and cures to a flexible, scratch resistant, non-shrinking film, which has good adhesion to the underlying substrate.

公开(公告)号：WO2005039879A2

公开(公告)日：2005-05-06

申请号：PCT/US2004/028850

申请日：2004-09-07

Applicant: MACDERMID ACUMEN, INC.

Inventor： CAMPION, Kevin, R. ,  BARCLAY, Aaron, G.

IPC: B41J

CPC classification number: B41J2/175 ,  B41J2/17513 ,  B41J2/17523 ,  B41J2/17553

Abstract: A fluid delivery system of the invention comprises one or more intercoupled cartridge assembles. Each cartridge assembly comprises a plurality of interconnected cartridges, each comprising a reservoir for holding jetting fluid and an ink jet print head operatively connected to the reservoir. Each cartridge assembly is interconnected by a first interconnection assembly and a second interconnection assembly. The first interconnection assembly maintains the plurality of interconnected cartridges at a negative pressure. The second interconnection assembly maintains at least an essentially equal level of jetting fluid within each of the reservoirs of the plurality of cartridges. Jetting fluid is replenished in the plurality of interconnected cartridges by replenishing jetting fluid in a selected cartridge and using the second interconnection assembly to distribute the jetting fluid among the reservoirs of the interconnected cartridges. A sensor is coupled to the selected reservoir to monitor the level of jetting fluid in the cartridge assembly.

Abstract translation: 本发明的流体输送系统包括一个或多个相互连接的料筒组件。 每个墨盒组件包括多个互连的墨盒，每个墨盒包括用于保持喷射流体的储存器和可操作地连接到储存器的喷墨打印头。 每个盒组件通过第一互连组件和第二互连组件互连。 第一互连组件将多个互连的盒保持在负压。 第二互连组件在多个盒的每个储存器内保持至少基本相同水平的喷射流体。 通过在所选择的盒中补充喷射流体并使用第二互连组件将喷射流体分配在互连的盒的储存器中，在多个互连的盒中补充喷射流体。 传感器耦合到所选择的储存器以监测墨盒组件中的喷射流体的水平。