公开(公告)号：WO2011093943A2

公开(公告)日：2011-08-04

申请号：PCT/US2010/058312

申请日：2010-11-30

Applicant: MACDERMID ACUMEN, INC. ,  DE WANG, Ming ,  CASTALDI, Steven, A. ,  FENG, Kesheng

Inventor： DE WANG, Ming ,  CASTALDI, Steven, A. ,  FENG, Kesheng

IPC: B32B7/12 ,  C09D5/00 ,  C08K5/32

CPC classification number: B32B7/12 ,  B32B7/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2307/50 ,  B32B2307/732 ,  B32B2457/08 ,  C23C22/63 ,  C23C22/78 ,  C23C22/83 ,  H05K3/385 ,  H05K2203/0315

Abstract: A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound, The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.

Abstract translation: 提高铜或铜合金层与聚合物树脂之间粘合力的方法。 该方法包括以下步骤：a）将预浸组合物施加到铜层; b）向经处理的铜层施加纳米氧化物组合物，c）将浸渍后组合物施加到纳米氧化物处理的表面上，以及d）将树脂粘合到经处理的铜表面。 纳米氧化物组合物包含（i）亚氯酸盐; （ii）苛性碱; （iii）磷酸盐; （ⅳ）有机硝基化合物; 所述浸渍后组合物是碱性溶液，其包含（i）磷酸盐;和（ⅴ）硫化合物。 （ii）钼离子源; 和（iii）噻唑。 本发明的方法可用于改善铜和树脂之间的键合，包括高Tg树脂，无卤素树脂和高速/失去树脂。

公开(公告)号：WO2013109404A2

公开(公告)日：2013-07-25

申请号：PCT/US2012/072260

申请日：2012-12-31

Applicant: MACDERMID ACUMEN, INC.

Inventor： FENG, Kesheng ,  NABLE, Jun ,  MCCAHERTY, Adam

IPC: C25D5/34 ,  C11D7/60

CPC classification number: C25D5/34 ,  C23G1/103 ,  C25D7/123

Abstract: An aqueous treatment solution for increasing the cleaning capability of a treated copper surface comprising: a) an organic compound selected from the group consisting of organic acids, alcohols, ketone, nitriles and combinations of one or more of the foregoing; and b) an oxidizing agent. The aqueous treatment solution is usable in a process for metallizing the walls of holes within a printed wiring board substrate having metallic and non-metallic regions, wherein the printed wiring board is treated with a reducing agent and then contacted with an aqueous dispersion of carbonaceous particles to form a coating of the dispersion over the substrate. The process comprises the step of contacting the metallic regions of the printed wiring board substrate with the aqueous treatment solution to remove deposited carbonaceous particles therefrom. The aqueous treatment solution provides a clean copper surface while providing a low microetch rate.

Abstract translation: 一种用于提高经处理的铜表面的清洁能力的水性处理溶液，包括：a）选自有机酸，醇，酮，腈以及前述一种或多种的组合的有机化合物; 和b）氧化剂。 该水处理溶液可用于金属化具有金属和非金属区域的印刷线路板基板内的孔壁的方法，其中印刷线路板用还原剂处理，然后与碳质颗粒的水分散体 以在基底上形成分散体的涂层。 该方法包括使印刷线路板基板的金属区域与水处理溶液接触以从其中除去沉积的碳质颗粒的步骤。 水处理溶液提供清洁的铜表面，同时提供低的微蚀刻速率。

公开(公告)号：WO2013028309A1

公开(公告)日：2013-02-28

申请号：PCT/US2012/048228

申请日：2012-07-26

Applicant: MACDERMID ACUMEN, INC. ,  FENG, Kesheng

Inventor： FENG, Kesheng

IPC: C23F11/00

CPC classification number: C09D5/1625 ,  C09D5/086 ,  C23F11/10 ,  C23F11/161 ,  Y10T428/31678

Abstract: An aqueous tarnish inhibiting solution comprising a mercapto carboxylic acid find a corrosion inhibitor to produce an anti-tarnish layer on metal surfaces, such as silver plated copper leadframes and a method of using the same is pro vided. The composition provides an improved anti-tamish layer that does not affect wirebondability or the adhesion of a mold compound to a leadfrarne.

Abstract translation: 包含巯基羧酸的水性晦暗抑制溶液发现腐蚀抑制剂以在金属表面上产生抗晦暗层，例如镀银铜引线框架，并提供使用它们的方法。 该组合物提供了改善的抗混浊层，其不影响模具化合物对引导剂的引线键合性或粘合性。