摘要:
An optical connector assembly, and both a cable and a plug for use with such an optical connector assembly, are disclosed. The optical connector assembly includes a cable having laminated therein an optical waveguide and conductive wires, a plug having the cable connected thereto, and a connector housing configured to mount thereon a plug connector. The cable is provided with a wiring portion, arranged so that a core portion of the optical waveguide and the conductive wires do not overlap with each other, and a connection end portion, arranged so that a portion of the core portion of the optical waveguide overlaps with a portion of the conductive wires.
摘要:
본 발명은 광모듈 및 그 제조방법에 관한 것으로, 기판의 하부에 형성되는 광도파로로서, 광 전달 경로 상에 경사면을 갖는 절취부를 구비하는 광도파로와, 상기 경사면에 형성되는 반사기층을 포함하되, 상기 광도파로를 통해 입사된 복수개의 파장을 갖는 광들 중 선택된 파장의 광은 상기 반사기층에 의해 반사되어 상기 기판의 상측으로 전달되며, 나머지 파장의 광은 통과하여 상기 광도파로를 통해 전달됨으로써, 기존의 단일 기판형 광모듈로는 얻을 수 없는 다양한 기능성을 갖으면서 광센서, 광통신소자, 디스플레이 등의 여러 광모듈의 제작에도 활용될 수 있는 효과가 있다.
摘要:
An optical system includes an optical device having waveguides defined in a first light transmitting medium. The optical device includes stops extending upward from a laser platform. The system also includes a laser bar having a plurality of lasers. The laser bar is positioned on the platform such that each laser is aligned with one of the waveguides. The laser bar includes alignment trenches that each includes a secondary stop extending upward from a bottom of the alignment trench. The secondary stop includes layers of material having different composition. The stops each extend into an alignment trenches such that each stop contacts one of the secondary stops.
摘要:
Various embodiments of the present invention are related to photonic- interconnect systems for reading data from and writing data to memory cells (1420) of memory chips (1404) at approximately the same time. In one embodiment of the present invention, a photonic-interconnect system (1200) comprises a photonic interconnect (1402) coupled to a photonic device (1602). The photonic interconnect (1402) is coupled to the memory chip (1404) and is configured to encode a first data set stored in the memory cells into a first set of electromagnetic signals at approximately the same time, decode a second data set encoded in a second set of electromagnetic signals at approximately the same time, and store the second data set in the memory cells. The photonic device (1414-1419) is configured to transmit the first set of electromagnetic signals out from the photonic interconnect and transmit the second set of electromagnetic signals into the photonic interconnect.
摘要:
An optical structure can include a nanocrystal on a surface of an optical waveguide in a manner to couple the nanocrystal to the optical field of light propagating through the optical waveguide to generate an emission from the nanocrystal.
摘要:
A vertical stack of integrated circuits includes at least one CMOS electronic integrated circuit (IC), an SOI-based opto-electronic integrated circuit structure, and an optical input/output coupling element. A plurality of metalized vias may be formed through the thickness of the stack so that electrical connections can be made between each integrated circuit. Various types of optical input/output coupling can be used, such as prism coupling, gratings, inverse tapers, and the like. By separating the optical and electrical functions onto separate ICs, the functionalities of each may be modified without requiring a re-design of the remaining system. By virtue of using SOI-based opto-electronics with the CMOS electronic ICs, a portion of the SOI structure may be exposed to provide access to the waveguiding SOI layer for optical coupling purposes.
摘要:
An improved electro-optical system having a planar waveguide (126, 128, 130) coupled to a photodetector (146, 148) through a transparent substrate (150). The planar waveguide is within a planar optical structure that can be part of an optical communications network. The photodetector is positioned to receive light that passes from the waveguide through the transparent substrate. The photodetector can be electrically coupled to electrical circuitry along the transparent sibstrate for connection to an electrical apparatus. Corresponding methods for forming the electro-optical structure are described. These improved electro-optical systems can be used for terminating an optical transmission system at an end user or a local network associated with a group of end users.