公开(公告)号：WO2010126901A3

公开(公告)日：2010-11-04

申请号：PCT/US2010/032607

申请日：2010-04-27

Applicant: APPLIED MATERIALS, INC. ,  ZHANG, Jimin ,  DUBOUST, Alain ,  BENNETT, Doyle E.

Inventor： ZHANG, Jimin ,  DUBOUST, Alain ,  BENNETT, Doyle E.

IPC: H01L21/304 ,  H01L21/66

Abstract: A polishing system includes a polishing pad with an aperture that extends through all layers of the polishing pad and a light transmissive film positioned on top of a light-generating or light-guiding element of an optical monitoring system.

公开(公告)号：WO2010045162A2

公开(公告)日：2010-04-22

申请号：PCT/US2009/060397

申请日：2009-10-12

Applicant: APPLIED MATERIALS, INC. ,  BENNETT, Doyle, E. ,  OSTERHELD, Thomas, H.

Inventor： BENNETT, Doyle, E. ,  OSTERHELD, Thomas, H.

IPC: H01L21/304

CPC classification number: B24B37/013 ,  B24B49/105 ,  G01B7/105

Abstract: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.

Abstract translation: 在处理衬底期间的原位监视包括处理半导体处理装置中的衬底上的导电膜并且在处理期间从涡流传感器产生信号。 该信号包括当涡流传感器与基板相邻时产生的第一部分，当涡流传感器与金属体相邻并且不与基板相邻时产生的第二部分，以及当涡流传感器不相邻时产生的第三部分 金属体或衬底。 将信号的第二部分与信号的第三部分进行比较，并且至少基于比较的结果确定增益，并且将信号的第一部分乘以增益以生成调整后的信号。 p>

公开(公告)号：WO2011129959A2

公开(公告)日：2011-10-20

申请号：PCT/US2011/029468

申请日：2011-03-22

Applicant: APPLIED MATERIALS, INC. ,  SWEDEK, Boguslaw A. ,  BENNETT, Doyle E. ,  BENVEGNU, Dominic J.

Inventor： SWEDEK, Boguslaw A. ,  BENNETT, Doyle E. ,  BENVEGNU, Dominic J.

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/205

Abstract: A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.

Abstract translation: 抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。 固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。 固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。

公开(公告)号：WO2010126901A2

公开(公告)日：2010-11-04

申请号：PCT/US2010032607

申请日：2010-04-27

Applicant: APPLIED MATERIALS INC ,  ZHANG JIMIN ,  DUBOUST ALAIN ,  BENNETT DOYLE E

Inventor： ZHANG JIMIN ,  DUBOUST ALAIN ,  BENNETT DOYLE E

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/205 ,  B24B37/013 ,  B24B49/12

Abstract: A polishing system includes a polishing pad with an aperture that extends through all layers of the polishing pad and a light transmissive film positioned on top of a light-generating or light-guiding element of an optical monitoring system.

Abstract translation: 抛光系统包括具有延伸穿过抛光垫的所有层的孔的抛光垫和位于光学监控系统的发光或光导元件顶部的透光膜。

公开(公告)号：WO2010045162A3

公开(公告)日：2010-07-15

申请号：PCT/US2009060397

申请日：2009-10-12

Applicant: APPLIED MATERIALS INC ,  BENNETT DOYLE E ,  OSTERHELD THOMAS H

Inventor： BENNETT DOYLE E ,  OSTERHELD THOMAS H

IPC: H01L21/304

CPC classification number: B24B37/013 ,  B24B49/105 ,  G01B7/105

Abstract: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.

Abstract translation: 在处理衬底期间的原位监测包括在半导体处理设备中的衬底上处理导电膜并且在处理期间产生来自涡流传感器的信号。 信号包括当涡电流传感器邻近衬底时产生的第一部分，当涡流传感器邻近金属体并且不邻近衬底时产生的第二部分，以及当涡电流传感器不邻近衬底时产生的第三部分 金属体也不是基体。 将信号的第二部分与信号的第三部分进行比较，并且至少基于比较的结果确定增益，并且将信号的第一部分乘以增益以产生经调整的信号。

公开(公告)号：WO2011129959A3

公开(公告)日：2012-04-19

申请号：PCT/US2011029468

申请日：2011-03-22

Applicant: APPLIED MATERIALS INC ,  SWEDEK BOGUSLAW A ,  BENNETT DOYLE E ,  BENVEGNU DOMINIC J

Inventor： SWEDEK BOGUSLAW A ,  BENNETT DOYLE E ,  BENVEGNU DOMINIC J

IPC: H01L21/304 ,  H01L21/66

CPC classification number: B24B37/205

Abstract: A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.

Abstract translation: 抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。 固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。 固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。