Abstract:
A system to apply ultrasound energy to a region surrounding blood flow in a blood vessel from a position outside a patient includes: a therapeutic ultrasound transducer comprising a plurality of transducer elements; and a processor configured to control the plurality of transducer elements; wherein the processor is configured to change phase inputs to the transducer elements to move a focus of the transducer at least 1 cm in a first plane which is substantially along a plane of the transducer elements of the therapeutic ultrasound transducer and at least 1 cm in a second plane orthogonal to the first plane; and wherein the processor is further configured to position the focus of the transducer in sequential positions offset from the blood flow in the blood vessel according to a pattern pre-determined by an operator of the system.
Abstract:
A method of controlling polishing includes storing a plurality libraries, each library including a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching first reference spectrum from a first library from the plurality of libraries and finding a best matching second reference spectrum from a different second library from the plurality of libraries, determining a first value associated with the best matching first reference spectrum and determining a second value from the best matching second reference spectrum, and calculating a third value from the first value and the second value to generate a sequence of calculated third values. At least one of a polishing endpoint or an adjustment for a polishing rate can be determined based on the sequence of calculated third values.
Abstract:
A plurality of substrates are polished simultaneously on the same polishing pad. A sequence of spectra is measured from each zone of each substrate, and for each measured spectrum in the sequence of spectra for each zone of each substrate, a best matching reference spectrum is determined from a library of reference spectra. For each zone of each substrate, a linear function is fit to a sequence of index values associated with the best matching reference spectra. For at least one zone, a projected time at which the zone will reach a target index value is determined based on the linear function, and the polishing parameter for at least one zone on at least one substrate is adjusted such that the at least one zone of the at least one substrate has closer to the target index at the projected time than without such adjustment.
Abstract:
A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
Abstract:
Members of the TGF- ß superfamily and peptide fragments based on member proteins are employed to purify solutions containing member proteins or as therapeutics.
Abstract:
A polishing pad has an opaque polishing layer with an aperture therethrough and a polishing surface, and a solid light-transmissive window in the aperture. The solid light-transmissive window includes an outer portion secured to the polishing layer and an inner portion secured to the outer portion. The outer portion has a upper surface recessed relative to the polishing surface, whereas the inner portion has an upper surface that is substantially co-planar with the polishing surface.
Abstract:
Systems and methods for sealing a vascular opening such as an arteriotomy formed during a femoral artery catheterization procedure are described. Included are methods for locating the arteriotomy, aligning the therapeutic applicator to the arteriotomy, transiently occluding the blood vessel, and a station keeping procedure for maintaining alignment. Locating the arteriotomy and aligning the applicator may be performed using a targeting catheter having one or more targeting aids, such as an inflatable balloon or sensor (e.g., Doppler or temperature sensor), and an ultrasonic beacon. Station keeping may be performed using overlapping ultrasound signals that are sent to a target tissue site and the echo detected. An algorithm is described for detecting tissue movement relative to the applicator based on comparison of the echo with a previously stored echo.
Abstract:
The present invention provides compositions and methods useful for purifying recombinant myelin-associated glycoprotein (MAG) and fragments thereof. In particular, the invention provides a one-step purification method for MAG and MAG fragments. Novel forms of human recombinant MAG protein are also disclosed in addition to methods of reliably producing and storing stable recombinant MAG proteins.
Abstract:
Methods for chemical mechanical polishing (CMP) of semiconductor substrates, and more particularly to temperature control during such chemical mechanical polishing are provided. In one aspect, the method comprises polishing the substrate with a polishing surface during a polishing process to remove a portion of the conductive material, repeatedly monitoring a temperature of the polishing surface during the polishing process, and exposing the polishing surface to a rate quench process in response to the monitored temperature so as to achieve a target value for the monitored temperature during the polishing process.
Abstract:
A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first prepolish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.