Abstract:
In order to provide a solution which provides a direct reduced iron product which has an improved performance in respect to its capability to be transported over long distances and in respect to its melting properties in primary metallurgical steel making processes and which is suitable as a scrap substituting material, a method for producing a capsulated pressed reduced iron compound (5) is proposed, which compound (5) is completely encapsulated by a, preferably metallic, covering embodying material (4), wherein the method comprises the steps of reducing iron ore in an iron ore direct reduction shaft furnace and subjecting a certain amount of the thus obtained reduced iron or sponge iron (2) to a cold briquetting or cold forming process executed in a forming device, wherein the certain amount of reduced iron or of sponge iron (2) is delivered to at least one mould arranged in the forming device, is exposed to a compressive force and press-formed to constitute the capsulated pressed reduced iron compound (5) having a shape corresponding to the form provided by the at least one mould arranged in the forming device and having an apparent density of greater than 5.0 g/cm 3 , and wherein the certain amount of reduced iron or sponge iron(2) is completely encapsulated either by means of the covering embodying material (4) being provided before or during the certain amount of reduced iron or sponge iron is exposed to the compressive force or by means of the covering embodying material (4) being provided immediately after the certain amount of reduced iron or sponge iron (2) is press-formed to embody the form of the iron compound (5). During above process certain additives and/or CDRI fines and/or non-contaminant metal chips and/or secondary metallurgy additives in defined ratios could be included in the invented capsulated pressed reduced iron compound (5) CAPRI.
Abstract:
Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.
Abstract:
A light emitting diode chip a support layer having a first face and a second face opposite the first face, a diode region on the first face of the support layer, and a bond pad on the second face of the support layer. The bond pad includes a gold-tin structure having a weight percentage of tin of 50% or more. The light emitting diode chip may include a plurality of active regions that are connected in electrical series on the light emitting diode chip.
Abstract:
A susceptor apparatus for use in a CVD reactor includes a main platter with a central gear. The main platter has opposite first and second sides, a central recess formed in the second side, and a plurality of circumferentially spaced-apart pockets formed in the first side. The central gear is positioned within the central recess and the satellite platters are individually rotatable within the respective pockets. Each pocket has a peripheral wall with an opening in communication with the central recess. The central gear teeth extend into each of the pockets via the respective wall openings and engage a planet gear associated with each satellite platter. Rotation of the main platter about its rotational axis causes the satellite platters to rotate about their individual rotational axes.
Abstract:
A wafer of light emitting diodes (LEDs) is laser scribed to produce a laser scribing cut. Then, the wafer is cleaned, for example by wet etching, to reduce scribe damage. Then, electrical contact layers for the LEDs are formed on the wafer that has been cleaned. Alternatively, the scribing cut may be produced by multiple etches before contact formation. Related LEDs are also described.
Abstract:
The present invention provides a high growth reassortant influenza A virus having at least two gene segments of seasonal or pandemic strain origin, a PB1 gene segment of A/Texas/1/77 strain origin and a PA gene segment of A/Puerto Rico/8/34 (H1N1) origin coding for a PA protein comprising at least one amino acid modification at any one of positions 10, 275, 682, according to SEQ ID No.1. Further provided are vaccine formulations comprising the reassortant influenza A virus of the invention.
Abstract translation:本发明提供了具有至少两个季节性或大流行菌株起源的基因片段,A / Texas / 1/77株源的PB1基因片段和A / Puerto Rico / 8的PA基因片段的高生长重配甲型流感病毒 / 34(H1N1)来源编码PA蛋白,其包含根据SEQ ID No.1的位置10,275,682中的任一个的至少一个氨基酸修饰。 还提供了包含本发明的重配甲型流感病毒的疫苗制剂。
Abstract:
A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some light from the LEDs passes through the conversion material and is converted. The light emission from the LED chips comprises light from the conversion material, typically in combination with LED light. The emission characteristics of at least some of the LED chips is measured and at least some of the conversion material over the LEDs is removed to alter the emission characteristics of the LED chips. The invention is particularly applicable to fabricating LED chips on a wafer where the LED chips have light emission characteristics that are within a range of target emission characteristics. This target range can fall within an emission region on a CIE curve to reduce the need for binning of the LEDs from the wafer. The emission characteristics of the LED chips in the wafer can be tuned to the desired range by micro-machining the conversion material over the LEDs.
Abstract:
The present invention covers a novel replication deficient influenza virus comprising a modified NS1 segment coding for a NS1 protein lacking a functional RNA binding domain and functional effector domain and a heterologous sequence inserted between the splice donor site and the splice acceptor site of the NS gene segment. Further the use of the virus as vector for expression of various proteins like chemokines, cytokines or antigenic structures is covered, methods for producing virus particles using said virus vector as well as its use for production of vaccines. Also a fusion peptide comprising part of the N-terminus of an NS1 protein and a signal sequence fused to the C-terminus of said NS1 peptide is covered.
Abstract:
The present invention provides a linear expression construct free of any conventional amplification and/or selection sequences comprising an RNA polymerase I (poll) promoter and a poll termination signal, inserted between a RNA polymerase Il (polll) promoter and a polyadenylation signal useful for the expression of segments of viral RNA, preferably influenza viruses. The inventive construct is useful for efficient and fast production of viral particles, especially for producing vaccine formulations for the treatment of epidemic and/or pandemic diseases.
Abstract:
A light emitting diode is disclosed that includes an active structure formed of at least p-type and n-type epitaxial layers of Group III nitride on a conductive carrier substrate. A conductive bonding system joins the active structure to the conductive carrier substrate. A first transparent ohmic contact is on the active structure adjacent the conductive carrier substrate, a second transparent ohmic contact is on the active structure opposite the conductive carrier substrate, and a third ohmic contact is on the conductive carrier substrate opposite from the active structure.