公开(公告)号：WO2005084089A1

公开(公告)日：2005-09-09

申请号：PCT/CA2005/000249

申请日：2005-02-24

申请人： BELAIR NETWORKS INC. ,  BRUNETTE, Gilbert, P. ,  JOHNSON, Eric ,  RAYMENT, Stephen, G. ,  SOUL, Colin

发明人： BRUNETTE, Gilbert, P. ,  JOHNSON, Eric ,  RAYMENT, Stephen, G. ,  SOUL, Colin

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2924/1903 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

摘要： An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency modules by mitigating the effects of impedance discontinuities ordinarily present at signal trace-to-via transition regions.

摘要翻译： 提供了用于将第一导电层上的电路互连到第二导电层上的电路的互连结构。 本发明的互连结构包括被多个接地通孔包围的信号导体通路。 多个接地通孔屏蔽信号导体通孔，从而为电路的其余部分提供用于导体通路的电气隔离。 本发明的一个特征是可以改变多个接地通孔，调整它们的直径和相对于信号导体通孔的位置，以便影响互连结构的整体特性阻抗。 当在印刷电路板的不同导电层上的信号迹线之间传播高频信号时，该功能非常有用。 鉴于当今无线通信系统中使用的高频，所提出的互连结构通过减轻通常存在于信号跟踪到通过过渡区域的阻抗不连续性的影响，有助于射频模块的实际实现。