MULTIPOINT TEMPERATURE MONITORING APPARATUS FOR SEMICONDUCTOR WAFERS DURING PROCESSING
    1.
    发明申请
    MULTIPOINT TEMPERATURE MONITORING APPARATUS FOR SEMICONDUCTOR WAFERS DURING PROCESSING 审中-公开
    加工过程中半导体波形的多点温度监测装置

    公开(公告)号:WO1996004534A1

    公开(公告)日:1996-02-15

    申请号:PCT/US1995008521

    申请日:1995-07-12

    CPC classification number: G01J5/0003

    Abstract: An emissivity compensating non-contact system for measuring the temperature of a semiconductor wafer (24). The system includes a semiconductor wafer emissivity compensation station (10) for measuring the reflectivity of the wafer (24) at discrete wavelengths to yield wafer emissivity in specific wavelength bands. The system further includes a measurement probe (13) which is optically coupled to a semiconductor process chamber (12). The probe (13) senses wafer self-emission using one or more optical detectors (40) and a light modulator (42). A background temperature determining mechanism (44) independently senses the temperature of a source (46) of background radiation. Finally, a mechanism (16) calculates the temperature of the semiconductor wafer based on reflectivity and self-emission of the wafer and background temperature.

    Abstract translation: 一种用于测量半导体晶片(24)的温度的发射率补偿非接触系统。 该系统包括半导体晶片发射率补偿站(10),用于以离散波长测量晶片(24)的反射率,以产生特定波长带中的晶片辐射率。 该系统还包括光学耦合到半导体处理室(12)的测量探头(13)。 探头(13)使用一个或多个光学检测器(40)和光调制器(42)感测晶片自发射。 背景温度确定机构(44)独立地感测背景辐射源(46)的温度。 最后,机构(16)基于晶片的反射率和自发射以及背景温度来计算半导体晶片的温度。

    IN-LINE SPECTROSCOPY FOR PROCESS MONITORING
    2.
    发明申请
    IN-LINE SPECTROSCOPY FOR PROCESS MONITORING 审中-公开
    用于过程监控的在线光谱

    公开(公告)号:WO2003041123A2

    公开(公告)日:2003-05-15

    申请号:PCT/IL2002/000882

    申请日:2002-11-06

    IPC: H01L

    Abstract: A method for processing a workpiece and an associated processing chamber and analytic instrument. A layer of a material such as a low-K dielectric is applied to a workpiece such as a semiconductor wafer. During the application, and/or before or during subsequent processing, a property of the layer is measured by steps including exciting a portion of the layer with incident light and monitoring light such as Raman scattered light that is emitted from that portion of the layer in response to the incident light, via a probehead that may be inside or outside the chamber housing. The analytic instrument includes the probehead and two sources of excitation light at two different wavelengths.

    Abstract translation: 一种用于处理工件和相关处理室和分析仪器的方法。 将诸如低K电介质的材料层施加到诸如半导体晶片的工件上。 在施加期间和/或在后续处理期间和/或在后续处理期间和/或之后或之后,层的性质通过以下步骤测量:包括用入射光激发该层的一部分,并监测从该层的该部分发射的拉曼散射光 通过可能在室外或室外的探头来响应入射光。 分析仪器包括两个不同波长的探头和两个激发光源。

    FILM THICKNESS MAPPING USING INTERFEROMETRIC SPECTRAL IMAGING
    3.
    发明申请
    FILM THICKNESS MAPPING USING INTERFEROMETRIC SPECTRAL IMAGING 审中-公开
    使用干涉光谱成像的膜厚度测绘

    公开(公告)号:WO1996003615A1

    公开(公告)日:1996-02-08

    申请号:PCT/US1995008708

    申请日:1995-07-12

    CPC classification number: G01B11/0675 G01J3/26 G01J2003/2866

    Abstract: A method of determining the thickness map of a film (14) overlying a substrate (14). This method includes illuminating (10) the film simultaneously from different angles and analyzing spectral intensity of the radiation reflected by each point on the film (14). The analysis is effected by collecting reflected radiation from the film (14), passing the radiation through an interferometer (16) which outputs modulated radiation corresponding to a predetermined set of linear combinations of the spectral intensity of the radiation emitted from each pixel, simultaneously and separately scanning optical path differences generated in the interferometer (16) for each pixel, focusing the radiation outputted from the interferometer (16) on a detector array, and processing the output of the detector array to determine the spectral intensity of each pixel thereof to obtain a spectral intensity distribution. Finally, the method includes further processing the spectral intensity distribution to determine the spatial distribution of the thickness of the film (16).

    Abstract translation: 一种确定覆盖衬底(14)的膜(14)的厚度图的方法。 该方法包括从不同角度同时照射(10)胶片并分析由胶片(14)上的每个点反射的辐射的光谱强度。 分析是通过收集来自胶片(14)的反射辐射,使辐射通过干涉仪(16),干涉仪(16)同时输出对应于从每个像素发射的辐射的光谱强度的预定的一组线性组合的调制辐射, 分别扫描针对每个像素的干涉仪(16)中产生的光程差,将从干涉仪(16)输出的辐射聚焦在检测器阵列上,并且处理检测器阵列的输出以确定其每个像素获得的光谱强度 光谱强度分布。 最后,该方法包括进一步处理光谱强度分布以确定薄膜(16)的厚度的空间分布。

    METHOD FOR REMOTE SENSING ANALYSIS BY DECORRELATION STATISTICAL ANALYSIS AND HARDWARE THEREFOR
    4.
    发明申请
    METHOD FOR REMOTE SENSING ANALYSIS BY DECORRELATION STATISTICAL ANALYSIS AND HARDWARE THEREFOR 审中-公开
    通过装饰统计分析及其硬件进行远程感测分析的方法

    公开(公告)号:WO9901843A9

    公开(公告)日:1999-04-15

    申请号:PCT/US9813524

    申请日:1998-06-29

    Inventor: CABIB DARIO

    Abstract: A method for remote scenes classification comprising the steps of (a) preparing a reference template for classification of the remote scenes via (i) classifying a set of reference scenes via a conventional classification technique for obtaining a set of preclassified reference scenes; (ii) using a first spectral imager for measuring a spectral cube of the preclassified reference scenes; (iii) employing a principal component analysis for extracting the spectral cube for decorrelated spectral data characterizing the reference scenes; and (iv) using at least a part of the decorrelated spectral data for the preparation of the reference template for remote scenes classification; (b) using a second spectral imager for measuring a spectral cube of analyzed remote scenes, such that a spectrum of each pixel in the remote scenes is obtained; (c) employing a decorrelation statistical method for extracting decorrelated spectral data characterizing the pixels; and (d) comparing at least a part of the decorrelated spectral data extracted from the pixels of the remote scenes with the reference template.

    Abstract translation: 一种用于远程场景分类的方法,包括以下步骤:(a)通过(i)通过用于获得一组预分类参考场景的常规分类技术对一组参考场景进行分类,准备用于远程场景分类的参考模板; (ii)使用第一光谱成像仪来测量预分类参考场景的光谱立方体; (iii)采用主成分分析来提取表征参考场景的去相关光谱数据的光谱立方体; 和(iv)使用至少一部分去相关的光谱数据来准备用于远程场景分类的参考模板; (b)使用第二光谱成像仪来测量分析的远程场景的光谱立方体,使得获得远程场景中每个像素的光谱; (c)采用解相关统计方法来提取表征像素的去相关光谱数据; 和(d)将从远程场景的像素提取的去相关光谱数据的至少一部分与参考模板进行比较。

    METHOD AND APPARATUS FOR SPECTRAL ANALYSIS OF IMAGES
    5.
    发明申请
    METHOD AND APPARATUS FOR SPECTRAL ANALYSIS OF IMAGES 审中-公开
    用于图像分析的方法和装置

    公开(公告)号:WO2004074767A1

    公开(公告)日:2004-09-02

    申请号:PCT/US1992/001171

    申请日:1992-02-19

    Abstract: A method and apparatus for analyzing an optical image of a scene to determine the spectral intensity of each pixel thereof, by: collecting incident light from the scene (20); scanning the incident light (22); passing the scanned light through an interferometer (24) which outputs modulated light corresponding to a predetermined set of linear combinations of the spectral intensity of the light emitted from each pixel; focussing the light outputted from the interferometer on a detector array (26), and processing the output of the detector array (28) to determine the spectral intensity of each pixel thereof.

    Abstract translation: 一种用于分析场景的光学图像以通过以下方式来确定其每个像素的光谱强度的方法和装置:收集来自场景(20)的入射光; 扫描入射光(22); 将扫描的光通过干涉仪(24),所述干涉仪(24)输出对应于从每个像素发射的光的光谱强度的预定的一组线性组合的调制光; 将从干涉仪输出的光聚焦在检测器阵列(26)上,以及处理检测器阵列(28)的输出以确定其每个像素的光谱强度。

    IN-LINE SPECTROSCOPY FOR PROCESS MONITORING
    8.
    发明申请

    公开(公告)号:WO2003041123A3

    公开(公告)日:2003-05-15

    申请号:PCT/IL2002/000882

    申请日:2002-11-06

    Abstract: A method for processing a workpiece and an associated processing chamber (fig. 10) and analytic instrument. A layer of a material such as a low-K dielectric is applied to a workpiece such as a semiconductor wafer. During the application, and/or before or during subsequent processing, a property of the layer is measured by steps including exciting a portion of the layer with incident light and monitoring light such as Raman scattered light that is emitted from that portion of the layer in response to the incident light, via a probehead (fig. 20) that may be inside or outside the chamber housing. The analytic instrument includes the probehead and two sources of excitation light at two different wavelengths.

    METHOD FOR INTERFEROMETER BASED SPECTRAL IMAGING OF MOVING OBJECTS
    9.
    发明申请
    METHOD FOR INTERFEROMETER BASED SPECTRAL IMAGING OF MOVING OBJECTS 审中-公开
    基于干涉仪的移动物体的光谱成像方法

    公开(公告)号:WO1998019293A1

    公开(公告)日:1998-05-07

    申请号:PCT/US1997008153

    申请日:1997-05-12

    CPC classification number: G01J3/45

    Abstract: A method for spatial registration and spectral correction for interferometer based spectral imaging which can be used to obtain spectral images of a moving object, the method comprising the steps of (a) using an interferometer based spectral imager for acquiring spatial and spectral information of the moving object; and (b) correcting the spatial and spectral information for movements of the moving object via a spatial registration and spectral correction procedures for obtaining corrected spatial and spectral information.

    Abstract translation: 一种用于基于干涉仪的光谱成像的空间配准和光谱校正方法,其可用于获得移动物体的光谱图像,所述方法包括以下步骤:(a)使用基于干涉仪的光谱成像器来获取移动的空间和光谱信息 目的; 以及(b)经由用于获得校正的空间和频谱信息的空间配准和频谱校正程序来校正用于移动物体的移动的空间和频谱信息。

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