ADHESIVE STACK HAVING A CENTRAL SHEAR LAYER
    2.
    发明申请
    ADHESIVE STACK HAVING A CENTRAL SHEAR LAYER 审中-公开
    具有中央剪裁层的粘合堆

    公开(公告)号:WO2013019842A1

    公开(公告)日:2013-02-07

    申请号:PCT/US2012/049130

    申请日:2012-08-01

    Abstract: An adhesive stack comprises a shear layer positioned between two adhesive layers. The shear layer, comprised of a weak adhesive sub-layer positioned between substrate sublayers, is designed to fail upon application of a deliberate and appropriate shear force and before the failure of the adhesive layers. The adhesive sub-layer defines a width and/or length less than a width and/or length of another layer or sub-layer of the adhesive stack. The adhesive stack aids in securing components within an electronic device to prevent movement of the component when the device is dropped, hit, or bumped. The adhesive stack may occupy minimal space within the device, and reduce the cost of securing the component within the device's interior. The adhesive stack may allow for replacement of the component by an authorized person applying an appropriate and deliberate force. The adhesive stack may aid in identifying components replaced by an unauthorized person.

    Abstract translation: 粘合剂堆叠包括位于两个粘合剂层之间的剪切层。 设置在位于衬底子层之间的弱粘合剂子层的剪切层被设计为在施加有意和适当的剪切力并且在粘合剂层失效之前失效。 粘合剂子层限定了小于粘合剂叠层的另一层或子层的宽度和/或长度的宽度和/或长度。 粘合剂叠层有助于将元件固定在电子设备内,以防止在设备掉落,撞击或碰撞时组件的移动。 粘合剂堆叠可能占用设备内的最小空间,并降低将部件固定在设备内部的成本。 粘合剂堆可以允许授权的人员使用适当的和故意的力来更换部件。 粘合剂层可以帮助识别由未经授权的人更换的部件。

    FLOW-THROUGH COOLING FOR COMPUTER SYSTEMS
    7.
    发明申请
    FLOW-THROUGH COOLING FOR COMPUTER SYSTEMS 审中-公开
    用于计算机系统的流通式冷却

    公开(公告)号:WO2007149855A2

    公开(公告)日:2007-12-27

    申请号:PCT/US2007071561

    申请日:2007-06-19

    CPC classification number: H05K7/20745 H05K7/20736

    Abstract: Systems and method for cooling computer systems are provided. A rack system for housing a plurality of computers is provided, the rack system including: a rack assembly configured to support a first stack of computers and a second stack of computers; and at least one fan assembly configured to create an airflow through the first stack of computers and into the second stack of computers. A method of cooling a plurality of computers in a rack system is provided, including: supporting a first stack of computers and a second stack of computers in a rack assembly; and effectuating an airflow through the first stack of computers and into the second stack of computers.

    Abstract translation: 提供了冷却计算机系统的系统和方法。 提供了一种用于容纳多个计算机的机架系统,所述机架系统包括:机架组件,其被配置为支撑第一堆计算机和第二堆计算机; 以及至少一个风扇组件,其被配置为产生通过所述第一计算机堆并进入所述第二计算机堆叠的气流。 提供一种冷却机架系统中的多个计算机的方法,包括:在机架组件中支撑第一堆计算机和第二堆计算机; 并且通过第一堆计算机实现气流并进入第二堆计算机。

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