公开(公告)号：WO2007127079A3

公开(公告)日：2007-11-08

申请号：PCT/US2007/009216

申请日：2007-04-16

Applicant: CORNING INCORPORATED ,  CADY, Raymond C ,  COSTELLO III, John J ,  LAKOTA, Alexander ,  LOCK, William E ,  THOMAS, John C

Inventor： CADY, Raymond C ,  COSTELLO III, John J ,  LAKOTA, Alexander ,  LOCK, William E ,  THOMAS, John C

IPC: H05B3/68

Abstract: A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600 ?C or greater is achieved in less than about one-half hour.

公开(公告)号：WO2005121034A3

公开(公告)日：2007-03-08

申请号：PCT/US2005018666

申请日：2005-05-26

Applicant: CORNING INC ,  COOK GLENN B ,  RHOADS RANDY L ,  BUTTS DENNIS I ,  COSTELLO III JOHN J ,  GODARD HILARY T ,  HELFINSTINE JOHN D ,  SHAY GEORGE C

Inventor： COOK GLENN B ,  RHOADS RANDY L ,  BUTTS DENNIS I ,  COSTELLO III JOHN J ,  GODARD HILARY T ,  HELFINSTINE JOHN D ,  SHAY GEORGE C

IPC: C03B11/08 ,  C03B13/04 ,  C03B15/00 ,  C03B17/00 ,  C03B17/06

CPC classification number: C03B17/068

Abstract: A pull roll assembly is described herein that is used to draw a glass sheet. The pull roll assembly includes a first roll assembly, a second roll assembly and a device (e.g., differential drive, sensor(s)). The device enables one to control the first and/or second roll assemblies based in part on pulling forces (e.g., glass contact normal force and/or required sheet pulling force) associated with a glass sheet while the glass sheet is being drawn between the first and second roll assemblies. A glass manufacturing system and method for using the pull roll assembly are also described herein.

Abstract translation: 本文描述了用于拉制玻璃板的拉辊组件。 拉辊组件包括第一辊组件，第二辊组件和装置（例如，差动驱动器，传感器）。 该装置使得能够部分地基于与玻璃板相关联的拉力（例如，玻璃接触法向力和/或所需的片材拉力）来控制第一和/或第二辊组件，同时玻璃板在第一 和第二辊组件。 本文还描述了使用拉辊组件的玻璃制造系统和方法。

公开(公告)号：WO2007127111A3

公开(公告)日：2008-12-11

申请号：PCT/US2007009423

申请日：2007-04-18

Applicant: CORNING INC ,  CADY RAYMOND C ,  COSTELLO III JOHN J ,  LAKOTA ALEXANDER ,  LOCK WILLIAM E ,  THOMAS JOHN C

Inventor： CADY RAYMOND C ,  COSTELLO III JOHN J ,  LAKOTA ALEXANDER ,  LOCK WILLIAM E ,  THOMAS JOHN C

IPC: B32B41/00

CPC classification number: H01L21/67092 ,  H01L21/67121 ,  H01L21/67144 ,  H01L21/76254

Abstract: An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.

Abstract translation: 阳极接合装置包括：第一接合板机构，其可操作以接合第一材料片，并且提供受控加热，电压和冷却中的至少一个; 第二接合板机构，其可操作以接合第二材料片，并且提供受控制的加热，电压和冷却中的至少一个; 压力机构，其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动，以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元，可操作以产生对第一和第二接合板机构和压力机构的控制信号，以提供足以实现第一和第二材料片之间的阳极接合的加热，电压和压力分布。

公开(公告)号：WO2007127111A2

公开(公告)日：2007-11-08

申请号：PCT/US2007/009423

申请日：2007-04-18

Applicant: CORNING INCORPORATED ,  CADY, Raymond, C. ,  COSTELLO III, John, J. ,  LAKOTA, Alexander ,  LOCK, William, E. ,  THOMAS, John, C.

Inventor： CADY, Raymond, C. ,  COSTELLO III, John, J. ,  LAKOTA, Alexander ,  LOCK, William, E. ,  THOMAS, John, C.

IPC: D06F75/26

CPC classification number: H01L21/67092 ,  H01L21/67121 ,  H01L21/67144 ,  H01L21/76254

Abstract: An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.

Abstract translation: 阳极接合装置包括：第一接合板机构，其可操作以接合第一材料片，并且提供受控加热，电压和冷却中的至少一个; 第二接合板机构，其可操作以接合第二材料片，并且提供受控制的加热，电压和冷却中的至少一个; 压力机构，其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动，以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元，可操作以产生对第一和第二接合板机构和压力机构的控制信号，以提供足以实现第一和第二材料片之间的阳极接合的加热，电压和压力分布。

公开(公告)号：WO2005121034A2

公开(公告)日：2005-12-22

申请号：PCT/US2005/018666

申请日：2005-05-26

Applicant: CORNING INCORPORATED ,  COOK, Glenn, B. ,  RHOADS, Randy, L. ,  BUTTS, Dennis, I. ,  COSTELLO III, John, J. ,  GODARD, Hilary, T. ,  HELFINSTINE, John, D. ,  SHAY, George, C.

Inventor： COOK, Glenn, B. ,  RHOADS, Randy, L. ,  BUTTS, Dennis, I. ,  COSTELLO III, John, J. ,  GODARD, Hilary, T. ,  HELFINSTINE, John, D. ,  SHAY, George, C.

IPC: C03B15/00

CPC classification number: C03B17/068

Abstract: A pull roll assembly is described herein that is used to draw a glass sheet. The pull roll assembly includes a first roll assembly, a second roll assembly and a device (e.g., differential drive, sensor(s)). The device enables one to control the first and/or second roll assemblies based in part on pulling forces (e.g., glass contact normal force and/or required sheet pulling force) associated with a glass sheet while the glass sheet is being drawn between the first and second roll assemblies. A glass manufacturing system and method for using the pull roll assembly are also described herein.

Abstract translation: 本文描述了用于拉制玻璃板的拉辊组件。 拉辊组件包括第一辊组件，第二辊组件和装置（例如，差动驱动器，传感器）。 该装置使得能够部分地基于与玻璃板相关联的拉力（例如，玻璃接触法向力和/或所需的片材拉力）来控制第一和/或第二辊组件，同时玻璃板在第一 和第二辊组件。 本文还描述了使用拉辊组件的玻璃制造系统和方法。

公开(公告)号：WO2007127079A2

公开(公告)日：2007-11-08

申请号：PCT/US2007009216

申请日：2007-04-16

Applicant: CORNING INC ,  CADY RAYMOND C ,  COSTELLO III JOHN J ,  LAKOTA ALEXANDER ,  LOCK WILLIAM E ,  THOMAS JOHN C

Inventor： CADY RAYMOND C ,  COSTELLO III JOHN J ,  LAKOTA ALEXANDER ,  LOCK WILLIAM E ,  THOMAS JOHN C

IPC: D06F75/26

CPC classification number: H01L21/67092 ,  H01L21/67121 ,  H01L21/68 ,  H01L21/76254

Abstract: A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600 ?C or greater is achieved in less than about one-half hour.

Abstract translation: 一种用于将第一和第二材料片阳极接合在一起的粘合板机构，所述装置包括：基部，包括第一和第二间隔开的表面; 由所述基座的第二表面支撑并且可操作以阻止对所述基座的热传递的绝热绝缘体; 直接或间接地耦合到所述绝缘体并且可操作以响应于电功率产生热量的加热盘; 以及直接或间接地联接到所述加热盘并且可操作以至少将来自所述加热盘的热传递到所述第一材料片的热扩散器，并且向所述第一材料片施加电压，其中施加到所述第一材料片的热和电压根据相应的 加热和电压分布以帮助第一和第二材料片的阳极接合，并且接合板机构的热惯性相对较低，使得第一材料片材的加热达到约600℃或更高的温度 在不到一个半小时。

公开(公告)号：WO2007018855A1

公开(公告)日：2007-02-15

申请号：PCT/US2006/026357

申请日：2006-07-06

Applicant: CORNING INCORPORATED ,  COSTELLO III, John J ,  POPOLOSKI, Martin J ,  THOMAS, John C

Inventor： COSTELLO III, John J ,  POPOLOSKI, Martin J ,  THOMAS, John C

IPC: G01N35/02 ,  B01L9/00

CPC classification number: B01L9/523 ,  B01L2200/025 ,  B01L2300/0829 ,  G01N35/028 ,  G01N2035/0425

Abstract: A mechanism for positionally restraining a microplate is disclosed. The mechanism is defined by a base having at least one surface with a receptacle for the insertion of a microplate into the base. Supports and/or positioning structures on a surface of the base have point contacts to restrain movement of the microplate in a stable position for repeatable optical detection measurements. The supports and/or positioning structures permit insertion of the microplate for an initial measurement, removal of the microplate for analytical manipulation, and re-insertion of the microplate to an exact position so as to allow analysis of precise comparative measurements by an optical reader.

Abstract translation: 公开了一种用于定位微孔板的机构。 该机构由具有至少一个具有用于将微孔板插入基座的容器的至少一个表面的底座限定。 基座表面上的支撑和/或定位结构具有点接触以限制微孔板在稳定位置的运动，用于可重复的光学检测测量。 支撑和/或定位结构允许插入微孔板进行初步测量，移除微孔板用于分析操作，以及将微孔板重新插入精确位置，以便允许通过光学读取器分析精确的比较测量结果。