公开(公告)号：WO2007127079A3

公开(公告)日：2007-11-08

申请号：PCT/US2007/009216

申请日：2007-04-16

Applicant: CORNING INCORPORATED ,  CADY, Raymond C ,  COSTELLO III, John J ,  LAKOTA, Alexander ,  LOCK, William E ,  THOMAS, John C

Inventor： CADY, Raymond C ,  COSTELLO III, John J ,  LAKOTA, Alexander ,  LOCK, William E ,  THOMAS, John C

IPC: H05B3/68

Abstract: A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600 ?C or greater is achieved in less than about one-half hour.

公开(公告)号：WO2010129732A1

公开(公告)日：2010-11-11

申请号：PCT/US2010/033811

申请日：2010-05-06

Applicant: CORNING INCORPORATED ,  BOOKBINDER, Dana C ,  GAGOV, Atanas V ,  LOCK, William E

Inventor： BOOKBINDER, Dana C ,  GAGOV, Atanas V ,  LOCK, William E

IPC: B32B17/10

CPC classification number: B32B17/10 ,  B29C45/14311 ,  B29C45/14434 ,  B29K2709/08 ,  B32B3/02 ,  G06F1/1656 ,  Y10T428/161

Abstract: Glass articles for use as covers in electronic devices and methods for forming the same are described herein. The glass articles generally include a shaped glass substrate comprising a first face, a second face and a perimeter edge. The shaped glass substrate may be formed from strengthened glass such that the shaped glass substrate has a compressive stress layer which improves the ability of the glass article to withstand surface damage without cracking. A polymer overmold is coupled to the attachment feature of the perimeter edge of the shaped glass substrate thereby protecting the perimeter edge of the shaped glass substrate from damage. In one embodiment, at least a portion of the perimeter edge of the shaped glass substrate comprises an attachment feature offset from the first face. In another embodiment the polymer overmold is integrally formed with at least one connector.

Abstract translation: 本文描述了用作电子设备中的盖的玻璃制品及其形成方法。 玻璃制品通常包括包括第一面，第二面和周边的成形玻璃基板。 成形玻璃基板可以由强化玻璃形成，使得成形玻璃基板具有提高玻璃制品在不破裂的情况下耐受表面损伤的能力的压应力层。 聚合物包覆模制物与成形玻璃基材的周边边缘的附着特征耦合，从而保护成形玻璃基板的周边边缘免受损坏。 在一个实施例中，成形玻璃基板的周边边缘的至少一部分包括从第一面偏移的附着特征。 在另一个实施方案中，聚合物包覆模塑与至少一个连接器一体形成。

公开(公告)号：WO2007127111A3

公开(公告)日：2008-12-11

申请号：PCT/US2007009423

申请日：2007-04-18

Applicant: CORNING INC ,  CADY RAYMOND C ,  COSTELLO III JOHN J ,  LAKOTA ALEXANDER ,  LOCK WILLIAM E ,  THOMAS JOHN C

Inventor： CADY RAYMOND C ,  COSTELLO III JOHN J ,  LAKOTA ALEXANDER ,  LOCK WILLIAM E ,  THOMAS JOHN C

IPC: B32B41/00

CPC classification number: H01L21/67092 ,  H01L21/67121 ,  H01L21/67144 ,  H01L21/76254

Abstract: An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.

Abstract translation: 阳极接合装置包括：第一接合板机构，其可操作以接合第一材料片，并且提供受控加热，电压和冷却中的至少一个; 第二接合板机构，其可操作以接合第二材料片，并且提供受控制的加热，电压和冷却中的至少一个; 压力机构，其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动，以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元，可操作以产生对第一和第二接合板机构和压力机构的控制信号，以提供足以实现第一和第二材料片之间的阳极接合的加热，电压和压力分布。

公开(公告)号：WO2007127111A2

公开(公告)日：2007-11-08

申请号：PCT/US2007/009423

申请日：2007-04-18

Applicant: CORNING INCORPORATED ,  CADY, Raymond, C. ,  COSTELLO III, John, J. ,  LAKOTA, Alexander ,  LOCK, William, E. ,  THOMAS, John, C.

Inventor： CADY, Raymond, C. ,  COSTELLO III, John, J. ,  LAKOTA, Alexander ,  LOCK, William, E. ,  THOMAS, John, C.

IPC: D06F75/26

CPC classification number: H01L21/67092 ,  H01L21/67121 ,  H01L21/67144 ,  H01L21/76254

Abstract: An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.

Abstract translation: 阳极接合装置包括：第一接合板机构，其可操作以接合第一材料片，并且提供受控加热，电压和冷却中的至少一个; 第二接合板机构，其可操作以接合第二材料片，并且提供受控制的加热，电压和冷却中的至少一个; 压力机构，其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动，以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元，可操作以产生对第一和第二接合板机构和压力机构的控制信号，以提供足以实现第一和第二材料片之间的阳极接合的加热，电压和压力分布。

公开(公告)号：WO2010048254A1

公开(公告)日：2010-04-29

申请号：PCT/US2009/061431

申请日：2009-10-21

Applicant: CORNING INCORPORATED ,  LOCK, William, E. ,  NISHIMOTO, Michael, Y.

Inventor： LOCK, William, E. ,  NISHIMOTO, Michael, Y.

IPC: H01L21/00 ,  H01L21/683

CPC classification number: H01L21/6838 ,  H01L21/67092 ,  H01L21/67109 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1928 ,  Y10T156/1939 ,  Y10T156/1944

Abstract: Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature, providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.

Abstract translation: 方法和装置提供了向至少一个伯努利卡盘提供受控的气体供应以提供平衡的抽吸和排斥气体流到材料片材; 以及至少一个：将气体供应温度提升到至少一个伯努利卡盘，使得在升高的温度下提供到材料片材的气体流，向绝缘体基底提供气流以促进分离 来自施主半导体晶片的剥离层，并且向绝缘体基板和任何支撑结构的接合部提供气流以促进绝缘体基板和支撑结构的分离。

公开(公告)号：WO2007127079A2

公开(公告)日：2007-11-08

申请号：PCT/US2007009216

申请日：2007-04-16

Applicant: CORNING INC ,  CADY RAYMOND C ,  COSTELLO III JOHN J ,  LAKOTA ALEXANDER ,  LOCK WILLIAM E ,  THOMAS JOHN C

Inventor： CADY RAYMOND C ,  COSTELLO III JOHN J ,  LAKOTA ALEXANDER ,  LOCK WILLIAM E ,  THOMAS JOHN C

IPC: D06F75/26

CPC classification number: H01L21/67092 ,  H01L21/67121 ,  H01L21/68 ,  H01L21/76254

Abstract: A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600 ?C or greater is achieved in less than about one-half hour.

Abstract translation: 一种用于将第一和第二材料片阳极接合在一起的粘合板机构，所述装置包括：基部，包括第一和第二间隔开的表面; 由所述基座的第二表面支撑并且可操作以阻止对所述基座的热传递的绝热绝缘体; 直接或间接地耦合到所述绝缘体并且可操作以响应于电功率产生热量的加热盘; 以及直接或间接地联接到所述加热盘并且可操作以至少将来自所述加热盘的热传递到所述第一材料片的热扩散器，并且向所述第一材料片施加电压，其中施加到所述第一材料片的热和电压根据相应的 加热和电压分布以帮助第一和第二材料片的阳极接合，并且接合板机构的热惯性相对较低，使得第一材料片材的加热达到约600℃或更高的温度 在不到一个半小时。