METHODS AND APPARATUS FOR POLISHING A SEMICONDUCTOR WAFER
    1.
    发明申请
    METHODS AND APPARATUS FOR POLISHING A SEMICONDUCTOR WAFER 审中-公开
    抛光半导体波形的方法和装置

    公开(公告)号:WO2008153782A2

    公开(公告)日:2008-12-18

    申请号:PCT/US2008006690

    申请日:2008-05-27

    CPC classification number: B24B37/005 B24B21/06

    Abstract: Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.

    Abstract translation: 方法和装置提供:基底可以可释放地联接的基底; 相对于基座定位的移动带,使得其接触表面可操作以从基底的顶表面去除材料; 以及多个致动器,其至少两个独立地可控制地相对于基座和移动带定位,使得相应的多个压力区被限定以在移动带与基板的顶表面之间提供压力。

    A BONDING PLATE MECHANISM FOR USE IN ANODIC BONDING

    公开(公告)号:WO2007127079A3

    公开(公告)日:2007-11-08

    申请号:PCT/US2007/009216

    申请日:2007-04-16

    Abstract: A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600 ?C or greater is achieved in less than about one-half hour.

    REAMING TOOL SUITABLE FOR RUNNING ON CASING OR LINER AND METHOD OF REAMING
    4.
    发明申请
    REAMING TOOL SUITABLE FOR RUNNING ON CASING OR LINER AND METHOD OF REAMING 审中-公开
    适用于铸造或内衬运行的注塑工具和注射方法

    公开(公告)号:WO2007133739A3

    公开(公告)日:2008-01-24

    申请号:PCT/US2007011543

    申请日:2007-05-14

    CPC classification number: E21B10/26 E21B7/20 E21B10/43 E21B17/14

    Abstract: A reaming tool (10) includes a tubular body (12) having a nose portion (14) with a concave center. A plurality of blades (20) defining junk slots (24) therebetween extend axially behind the nose (14) and taper outwardly from the exterior of the tubular body. Rotationally leading edges of the blades (20) carry a plurality of cutting elements (30) from the axially leading ends. Selected surfaces and edges of the bear tungsten carbide, which may comprise crushed tungsten carbide. The shell of the nose (14) is configured to ensure drill out from the centerline thereof toward the side wall (16) of the tubular body. A method of drilling out a reaming tool is also disclosed.

    Abstract translation: 扩孔工具(10)包括具有凹入中心的鼻部(14)的管状体(12)。 多个叶片(20)在其间限定了弹性槽(24),其在鼻部(14)之后轴向延伸并且从管状体的外部向外渐缩。 叶片(20)的旋转前缘从轴向前端承载多个切割元件(30)。 承载碳化钨的选定表面和边缘,其可以包括破碎的碳化钨。 鼻部(14)的壳被构造成确保从其中心线向管状体的侧壁(16)钻出。 还公开了一种钻出铰孔工具的方法。

    METHODS AND APPARATUS FOR POLISHING A SEMICONDUCTOR WAFER

    公开(公告)号:WO2008153782A3

    公开(公告)日:2008-12-18

    申请号:PCT/US2008/006690

    申请日:2008-05-27

    Abstract: Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.

    HIGH TEMPERATURE ANODIC BONDING APPARATUS
    7.
    发明申请
    HIGH TEMPERATURE ANODIC BONDING APPARATUS 审中-公开
    高温阳极结合装置

    公开(公告)号:WO2007127111A3

    公开(公告)日:2008-12-11

    申请号:PCT/US2007009423

    申请日:2007-04-18

    Abstract: An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.

    Abstract translation: 阳极接合装置包括:第一接合板机构,其可操作以接合第一材料片,并且提供受控加热,电压和冷却中的至少一个; 第二接合板机构,其可操作以接合第二材料片,并且提供受控制的加热,电压和冷却中的至少一个; 压力机构,其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动,以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元,可操作以产生对第一和第二接合板机构和压力机构的控制信号,以提供足以实现第一和第二材料片之间的阳极接合的加热,电压和压力分布。

    REAMING TOOL SUITABLE FOR RUNNING ON CASING OR LINER AND METHOD OF REAMING
    8.
    发明申请
    REAMING TOOL SUITABLE FOR RUNNING ON CASING OR LINER AND METHOD OF REAMING 审中-公开
    适用于铸造或内衬运行的注塑工具和注射方法

    公开(公告)号:WO2007133739A2

    公开(公告)日:2007-11-22

    申请号:PCT/US2007/011543

    申请日:2007-05-14

    CPC classification number: E21B10/26 E21B7/20 E21B10/43 E21B17/14

    Abstract: A reaming tool includes a tubular body having a nose portion with a concave center. A plurality of blades defining junk slots therebetween extend axially behind the nose and taper outwardly from the exterior of the tubular body. Rotationally leading edges of the blades carry a plurality of cutting elements from the axially leading ends. Selected surfaces and edges of the bear tungsten carbide, which may comprise crushed tungsten carbide. The shell of the nose is configured to ensure drillout from the centerline thereof toward the side wall of the tubular body. A method of drilling out a reaming tool is also disclosed.

    Abstract translation: 扩孔工具包括具有凹部中心的鼻部的管状体。 在其间限定垃圾槽的多个叶片在鼻部之间轴向延伸并且从管状体的外部向外逐渐变细。 叶片的旋转前缘从轴向前端承载多个切割元件。 承载碳化钨的选定表面和边缘,其可以包括破碎的碳化钨。 鼻子的外壳被配置成确保从其中心线朝向管状体的侧壁排出。 还公开了一种钻出铰孔工具的方法。

    HIGH TEMPERATURE ANODIC BONDING APPARATUS
    9.
    发明申请
    HIGH TEMPERATURE ANODIC BONDING APPARATUS 审中-公开
    高温阳极结合装置

    公开(公告)号:WO2007127111A2

    公开(公告)日:2007-11-08

    申请号:PCT/US2007/009423

    申请日:2007-04-18

    Abstract: An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.

    Abstract translation: 阳极接合装置包括:第一接合板机构,其可操作以接合第一材料片,并且提供受控加热,电压和冷却中的至少一个; 第二接合板机构,其可操作以接合第二材料片,并且提供受控制的加热,电压和冷却中的至少一个; 压力机构,其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动,以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元,可操作以产生对第一和第二接合板机构和压力机构的控制信号,以提供足以实现第一和第二材料片之间的阳极接合的加热,电压和压力分布。

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