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    MOVABLE GROUNDING ARRANGEMENTS IN A PLASMA PROCESSING CHAMBER AND METHODS THEREFOR
    1.
    发明申请
    MOVABLE GROUNDING ARRANGEMENTS IN A PLASMA PROCESSING CHAMBER AND METHODS THEREFOR 审中-公开
    等离子体加工室中的可移动接地装置及其方法

    公开(公告)号：WO2013081844A3

    公开(公告)日：2015-06-25

    申请号：PCT/US2012065214

    申请日：2012-11-15

    Applicant: LAM RES CORP ,  DE LA LLERA ANTHONY ,  KELLOG MICHAEL C ,  MARAKHTANOV ALEXEI ,  DHINDSA RAJINDER

    Inventor： DE LA LLERA ANTHONY ,  KELLOG MICHAEL C ,  MARAKHTANOV ALEXEI ,  DHINDSA RAJINDER

    IPC: C23F1/00 ,  H01L21/3065

    CPC classification number: H01J37/32082 ,  H01J37/32577

    Abstract: A plasma processing systems having at least one plasma processing chamber, comprising a movable grounding component, an RF contact component configured to receive RF energy from an RF source when the RF source provides the RF energy to the RF contact component, and a ground contact component coupled to ground. The plasma processing system further includes an actuator operatively coupled to the movable grounding component for disposing the movable grounding component in a first position and a second position. The first position represents a position whereby the movable grounding component is not in contact with at least one of the RF contact component and the ground contact component. The second position represents a position whereby the movable grounding component is in contact with both the RF contact component and the ground contact component.

    Abstract translation: 一种具有至少一个等离子体处理室的等离子体处理系统，包括可移动接地部件，RF接触部件，其被配置为当RF源向RF接触部件提供RF能量时从RF源接收RF能量;以及接地部件 加上地面。 等离子体处理系统还包括可操作地耦合到可移动接地部件的致动器，用于将可移动接地部件设置在第一位置和第二位置。 第一位置表示可移动接地部件不与RF接触部件和接地部件中的至少一个接触的位置。 第二位置表示可移动接地部件与RF接触部件和接地部件接触的位置。

    CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY
    2.
    发明申请
    CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY 审中-公开
    夹紧式淋浴电极组件

    公开(公告)号：WO2010005541A3

    公开(公告)日：2010-04-22

    申请号：PCT/US2009003953

    申请日：2009-07-06

    Applicant: LAM RES CORP ,  KADKHODAYAN BABAK ,  DHINDSA RAJINDER ,  DE LA LLERA ANTHONY ,  KELLOGG MICHAEL C

    Inventor： KADKHODAYAN BABAK ,  DHINDSA RAJINDER ,  DE LA LLERA ANTHONY ,  KELLOGG MICHAEL C

    IPC: H05H1/34 ,  H01L21/3065 ,  H05H1/38

    CPC classification number: H01J37/32532 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32605

    Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.

    Abstract translation: 用于等离子体反应室的电极组件，用于半导体衬底处理。 组件包括上喷头电极，其包括通过夹紧环机械连接到背板的内电极和通过一系列间隔开的凸轮锁附接到背板的外电极。 防护环围绕背板并且可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以用工具旋转以释放从外部的上表面向上延伸的凸轮销 电极。 为了补偿差分热膨胀，夹紧环可以包括在间隔位置处的膨胀接合，这允许夹紧环吸收热应力。

    PLASMA CONFINEMENT RING ASSEMBLY FOR PLASMA PROCESSING CHAMBERS
    4.
    发明申请
    PLASMA CONFINEMENT RING ASSEMBLY FOR PLASMA PROCESSING CHAMBERS 审中-公开
    用于等离子体加工釜的等离子体配料环组件

    公开(公告)号：WO2012039744A3

    公开(公告)日：2012-08-23

    申请号：PCT/US2011001501

    申请日：2011-08-25

    Applicant: LAM RES CORP ,  DE LA LLERA ANTHONY ,  CARMAN DAVID ,  TAYLOR TRAVIS R ,  ULLAL SAURABH J ,  SINGH HARMEET

    Inventor： DE LA LLERA ANTHONY ,  CARMAN DAVID ,  TAYLOR TRAVIS R ,  ULLAL SAURABH J ,  SINGH HARMEET

    IPC: H01L21/3065

    CPC classification number: H01L21/67069

    Abstract: A plasma confinement ring assembly with a single movable lower ring can be used for controlling wafer area pressure in a capacitively coupled plasma reaction chamber wherein a wafer is supported on a lower electrode assembly and process gas is introduced into the chamber by an upper showerhead electrode assembly. The assembly includes an upper ring, the lower ring, hangers, hanger caps, spacer sleeves and washers. The lower ring is supported by the hangers and is movable towards the upper ring when the washers come into contact with the lower electrode assembly during adjustment of the gap between the upper and lower electrodes. The hanger caps engage upper ends of the hangers and fit in upper portions of hanger bores in the upper ring. The spacer sleeves surround lower sections of the hangers and fit within lower portions of the hanger bores. The washers fit between enlarged heads of the hangers and a lower surface of the lower ring. The spacer sleeves are dimensioned to avoid rubbing against the inner surfaces of the hanger bores during lifting of the lower ring.

    Abstract translation: 可以使用具有单个可移动下环的等离子体约束环组件来控制电容耦合等离子体反应室中的晶片面积压力，其中晶片被支撑在下部电极组件上，并且处理气体通过上部喷头电极组件 。 组件包括上环，下环，吊架，衣架盖，间隔套和垫圈。 下环由吊架支撑，并且当在上下电极之间的间隙调节期间垫圈与下电极组件接触时，可以朝向上环移动。 衣架帽接合衣架的上端，并安装在上环的衣架孔的上部。 间隔套环绕悬挂架的下部并且安装在衣架孔的下部。 垫圈安装在衣架的扩大头部和下环的下表面之间。 间隔套的尺寸被设计成避免在提升下环期间摩擦挂钩孔的内表面。

    SHOWERHEAD ELECTRODE
    5.
    发明申请
    SHOWERHEAD ELECTRODE 审中-公开
    喷头电极

    公开(公告)号：WO2012030382A3

    公开(公告)日：2012-08-23

    申请号：PCT/US2011001500

    申请日：2011-08-25

    Applicant: LAM RES CORP ,  DE LA LLERA ANTHONY ,  MANKIDY PRATIK ,  KELLOGG MICHAEL C ,  DHINDSA RAJINDER

    Inventor： DE LA LLERA ANTHONY ,  MANKIDY PRATIK ,  KELLOGG MICHAEL C ,  DHINDSA RAJINDER

    IPC: H01L21/3065 ,  H01L21/205 ,  H05H1/46

    CPC classification number: H01R13/20

    Abstract: Abstract A showerhead electrode, a gasket set and an assembly thereof in plasma reaction chamber for etching semiconductor substrates are provided with improved a gas injection hole pattern, positioning accuracy and reduced warping, which leads to enhanced uniformity of plasma processing rate. A method of assembling the inner electrode and gasket set to a supporting member includes simultaneous engagement of cam locks.

    Abstract translation: 摘要在等离子体反应室中用于蚀刻半导体衬底的喷头电极，衬垫组件及其组件提供了改进的气体喷射孔图案，定位精度和减少的翘曲，这导致等离子体处理速率的均匀性提高。 将内部电极和垫圈组装到支撑构件上的方法包括同时接合凸轮锁。

    CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY
    6.
    发明申请
    CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY 审中-公开
    夹式淋浴头电极组件

    公开(公告)号：WO2010005541A2

    公开(公告)日：2010-01-14

    申请号：PCT/US2009/003953

    申请日：2009-07-06

    Applicant: LAM RESEARCH CORPORATION ,  KADKHODAYAN, Babak ,  DHINDSA, Rajinder ,  DE LA LLERA, Anthony ,  KELLOGG, Michael, C.

    Inventor： KADKHODAYAN, Babak ,  DHINDSA, Rajinder ,  DE LA LLERA, Anthony ,  KELLOGG, Michael, C.

    IPC: H05H1/34 ,  H05H1/38 ,  H01L21/3065

    CPC classification number: H01J37/32532 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32605

    Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.

    Abstract translation: 用于半导体衬底处理中的等离子体反应室的电极组件。 该组件包括上部喷头电极，该上部喷头电极包括通过夹环机械连接到背板的内电极以及通过一系列间隔开的凸轮锁附接到背板的外电极。 保护环包围背板并可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以利用工具旋转以释放从外部的上表面向上延伸的凸轮销 电极。 为了补偿不同的热膨胀，夹环可以包括在间隔位置处的膨胀连接，这允许夹环吸收热应力。

    MOVABLE GROUNDING ARRANGEMENTS IN A PLASMA PROCESSING CHAMBER AND METHODS THEREFOR
    8.
    发明申请
    MOVABLE GROUNDING ARRANGEMENTS IN A PLASMA PROCESSING CHAMBER AND METHODS THEREFOR 审中-公开
    等离子体加工室中的可移动接地装置及其方法

    公开(公告)号：WO2013081844A2

    公开(公告)日：2013-06-06

    申请号：PCT/US2012/065214

    申请日：2012-11-15

    Applicant: LAM RESEARCH CORPORATION ,  DE LA LLERA, Anthony ,  KELLOG, Michael C. ,  MARAKHTANOV, Alexei ,  DHINDSA, Rajinder

    Inventor： DE LA LLERA, Anthony ,  KELLOG, Michael C. ,  MARAKHTANOV, Alexei ,  DHINDSA, Rajinder

    IPC: H05H1/24 ,  H05K13/00

    CPC classification number: H01J37/32082 ,  H01J37/32577

    Abstract: A plasma processing systems having at least one plasma processing chamber, comprising a movable grounding component, an RF contact component configured to receive RF energy from an RF source when the RF source provides the RF energy to the RF contact component, and a ground contact component coupled to ground. The plasma processing system further includes an actuator operatively coupled to the movable grounding component for disposing the movable grounding component in a first position and a second position. The first position represents a position whereby the movable grounding component is not in contact with at least one of the RF contact component and the ground contact component. The second position represents a position whereby the movable grounding component is in contact with both the RF contact component and the ground contact component.

    Abstract translation: 一种具有至少一个等离子体处理室的等离子体处理系统，包括可移动接地部件，RF接触部件，其被配置为当RF源向RF接触部件提供RF能量时从RF源接收RF能量;以及接地部件 加上地面。 等离子体处理系统还包括可操作地耦合到可移动接地部件的致动器，用于将可移动接地部件设置在第一位置和第二位置。 第一位置表示可移动接地部件不与RF接触部件和接地部件中的至少一个接触的位置。 第二位置表示可移动接地部件与RF接触部件和接地部件接触的位置。

    SHOWERHEAD ELECTRODE ASSEMBLIES FOR PLASMA PROCESSING APPARATUSES
    10.
    发明申请
    SHOWERHEAD ELECTRODE ASSEMBLIES FOR PLASMA PROCESSING APPARATUSES 审中-公开
    用于等离子体加工设备的淋浴电极组件

    公开(公告)号：WO2008156562A2

    公开(公告)日：2008-12-24

    申请号：PCT/US2008007089

    申请日：2008-06-05

    Applicant: LAM RES CORP ,  STEVENSON THOMAS R ,  DE LA LLERA ANTHONY ,  ULLAL SAURABH

    Inventor： STEVENSON THOMAS R ,  DE LA LLERA ANTHONY ,  ULLAL SAURABH

    IPC: C23C16/455 ,  C23C16/00

    CPC classification number: H01J37/32449 ,  H01J37/32091 ,  H01J37/32541 ,  H01J37/3255 ,  H01J37/32724

    Abstract: Showerhead electrode assemblies are disclosed, which include a showerhead electrode adapted to be mounted in an interior of a vacuum chamber; an optional backing plate attached to the showerhead electrode; a thermal control plate attached to the backing plate or to the showerhead electrode at multiple contact points across the backing plate; and at least one thermally and electrically conductive gasket separating the backing plate and the thermal control plate, or the backing plate and showerhead electrode, at the contact points. Methods of processing semiconductor substrates using the showerhead electrode assemblies are also disclosed.

    Abstract translation: 公开了一种喷头电极组件，其包括适于安装在真空室内部的喷头电极; 连接到喷头电极的可选背板; 热控制板，在穿过背板的多个接触点处附接到背板或喷头电极; 以及在接触点处分离背板和热控制板，或背板和喷头电极的至少一个导热和导电的衬垫。 还公开了使用喷头电极组件处理半导体衬底的方法。

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