公开(公告)号：WO2004068563A2

公开(公告)日：2004-08-12

申请号：PCT/US2004/002402

申请日：2004-01-27

Applicant: APPLIED MATERIALS, INC. ,  RICE, Michael, R. ,  LOWRANCE, Robert, B. ,  ELLIOTT, Martin, R. ,  HUDGENS, Jeffrey, C. ,  ENGLHARDT, Eric, A.

Inventor： RICE, Michael, R. ,  LOWRANCE, Robert, B. ,  ELLIOTT, Martin, R. ,  HUDGENS, Jeffrey, C. ,  ENGLHARDT, Eric, A.

IPC: H01L21/00

CPC classification number: H01L21/67706 ,  B65G17/20 ,  B65G37/02 ,  B65G2201/0297 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67769 ,  H01L21/67778 ,  Y10S414/135

Abstract: According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

Abstract translation: 根据第一方面，提供了一种适于在半导体器件制造设备内传送衬底载体的第一传送系统。 第一输送机系统包括沿半导体器件制造设备的至少一部分形成闭合回路的带状物。 该带适于（1）在水平面上具有柔性并且在垂直平面中是刚性的; 和（2）在所述半导体器件制造设备的至少一部分内传输多个衬底载体。 还提供了许多其他方面，以及根据这些和其它方面的系统，方法和计算机程序产品。