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    PLATEN COOLING MECHANISM FOR CRYOGENIC ION IMPLANTING
    1.
    发明申请
    PLATEN COOLING MECHANISM FOR CRYOGENIC ION IMPLANTING 审中-公开

    公开(公告)号：WO2010039672A3

    公开(公告)日：2010-07-15

    申请号：PCT/US2009058710

    申请日：2009-09-29

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ,  FISH ROGER B ,  BARSKY SAMUEL M ,  ANELLA STEVEN M

    Inventor： FISH ROGER B ,  BARSKY SAMUEL M ,  ANELLA STEVEN M

    IPC: H01L21/265 ,  H01L21/683 ,  H01L21/687

    CPC classification number: H01L21/67109

    Abstract: A system and method for altering and maintaining the temperature of a workpiece, especially at cryogenic temperatures, is disclosed. The platen on which the workpiece is located contains at least one inner conduit through which fluid can flow. An apparatus, in communication with a fluid source, is brought into contact with the platen. For example, an inlet and outlet on the platen and the ports of the apparatus may mate. Once the platen and the apparatus are successfully mated, fluid is passed through the apparatus and into the platen. Once the platen (and therefore the attached workpiece) has reached the desired temperature, the apparatus stops the flow of fluid through the platen. The apparatus and the platen then disengage. The platen is then free to move and rotated as required by the ion implantation process. When the platen temperature deviates from the desired temperature, the above process is repeated.

    FLUID DELIVERY MECHANISM FOR VACCUM WAFER PROCESSING SYSTEM
    2.
    发明申请
    FLUID DELIVERY MECHANISM FOR VACCUM WAFER PROCESSING SYSTEM 审中-公开
    VACCUM晶圆加工系统的流体输送机制

    公开(公告)号：WO2010039689A2

    公开(公告)日：2010-04-08

    申请号：PCT/US2009/058744

    申请日：2009-09-29

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES ,  FISH, Roger, B. ,  MITCHELL, Robert, J.

    Inventor： FISH, Roger, B. ,  MITCHELL, Robert, J.

    IPC: H01L21/265

    CPC classification number: H01L21/67213 ,  H01J37/20 ,  H01J37/3171 ,  H01J2237/006 ,  H01J2237/0216 ,  H01J2237/2001 ,  H01L21/67109 ,  Y10T279/23

    Abstract: The fluid delivery mechanism of the present disclosure provides a solution for use in a single axis of motion that allows the connection of one or more fluid flow paths over a wide range of temperatures into a vacuum environment. The mechanism does not employ flexible tubing that is prone to fatigue, especially at very low temperatures. In one embodiment, a tube is axially moved within a sealed piston to allow for fluid delivery. In a second embodiment, bellows are used to provide the required functionality. In another embodiment, it is possible to achieve movement in two or more axis of motion by utilizing two or more appropriateiy configured mechanisms.

    Abstract translation: 本公开的流体输送机构提供了用于单一运动轴线的解决方案，该解决方案允许在宽范围的温度下将一个或多个流体流动路径连接到真空环境中。 该机制不采用容易疲劳的柔性管，特别是在非常低的温度下。 在一个实施例中，管在密封活塞内轴向移动以允许流体输送。 在第二实施例中，波纹管用于提供所需的功能。 在另一个实施例中，可以通过利用两个或更多个适当配置的机构来实现在两个或更多个运动轴线上的运动。

    PLATEN COOLING MECHANISM FOR CRYOGENIC ION IMPLANTING
    5.
    发明申请
    PLATEN COOLING MECHANISM FOR CRYOGENIC ION IMPLANTING 审中-公开
    低温离子注入的平板冷却机理

    公开(公告)号：WO2010039695A3

    公开(公告)日：2010-07-08

    申请号：PCT/US2009058758

    申请日：2009-09-29

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ,  FISH ROGER B ,  BARSKY SAMUEL M ,  ANELLA STEVEN M

    Inventor： FISH ROGER B ,  BARSKY SAMUEL M ,  ANELLA STEVEN M

    IPC: H01L21/265 ,  H01L21/683

    CPC classification number: H01L21/67109

    Abstract: A system and method for altering and maintaining the temperature of a workpiece, especially at cryogenic temperatures, is disclosed. The platen on which the workpiece is located contains at least one inner conduit through which fluid can flow. An apparatus, in communication with a fluid source, is brought into contact with the platen. For example, an inlet and outlet on the platen and the ports of the apparatus may mate. Once the platen and the apparatus are successfully mated, fluid is passed through the apparatus and into the platen. Once the platen (and therefore the attached workpiece) has reached the desired temperature, the apparatus stops the flow of fluid through the platen. The apparatus and the platen then disengage. The platen is then free to move and rotated as required by the ion implantation process. When the platen temperature deviates from the desired temperature, the above process is repeated.

    Abstract translation: 公开了一种用于改变和保持工件温度的系统和方法，特别是在低温下。 工件所在的台板包含至少一个流体可以流过的内导管。 与流体源连通的装置与台板接触。 例如，台板上的入口和出口以及设备的端口可以匹配。 一旦台板和设备成功匹配，流体就会通过设备进入台板。 一旦压板（并因此附着的工件）达到所需的温度，该设备就停止通过压板的流体流动。 仪器和台板脱离。 然后平台可以根据离子注入过程的需要自由移动和旋转。 当台板温度偏离期望温度时，重复上述过程。

    TECHNIQUE FOR LIMITING TRANSMISSION OF FAULT CURRENT
    7.
    发明申请
    TECHNIQUE FOR LIMITING TRANSMISSION OF FAULT CURRENT 审中-公开

    公开(公告)号：WO2010151583A3

    公开(公告)日：2010-12-29

    申请号：PCT/US2010/039646

    申请日：2010-06-23

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES ,  TEKLETSADIK, Kasegn, D. ,  FISH, Roger, B. ,  MURPHY, Paul, J.

    Inventor： TEKLETSADIK, Kasegn, D. ,  FISH, Roger, B. ,  MURPHY, Paul, J.

    IPC: H01L39/16 ,  H02H9/02

    Abstract: A new type of superconducting fault current limiter is disclosed, which can advantageously be used with high voltage transmission networks. The circuit is electrically connected to two terminals (144, 146), which connect to the transmission network. The superconducting circuit (120) is located within an enclosure or tank (112), which is electrically isolated from ground. Therefore, the voltage difference between the enclosure and the superconducting circuit, and between the enclosure and the terminals are significantly less than exist in current deployments. In some embodiments, the enclosure is electrically connected to one of the terminals, while in other embodiments, the enclosure is electrically isolated from the terminals. The circuit can be combined with other like circuits to address a wide range of current transmission network configurations.

    FLUID DELIVERY MECHANISM FOR VACCUM WAFER PROCESSING SYSTEM
    8.
    发明申请
    FLUID DELIVERY MECHANISM FOR VACCUM WAFER PROCESSING SYSTEM 审中-公开
    流体加工系统的流体输送机制

    公开(公告)号：WO2010039689A3

    公开(公告)日：2010-07-01

    申请号：PCT/US2009058744

    申请日：2009-09-29

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ,  FISH ROGER B ,  MITCHELL ROBERT J

    Inventor： FISH ROGER B ,  MITCHELL ROBERT J

    IPC: H01L21/265

    CPC classification number: H01L21/67213 ,  H01J37/20 ,  H01J37/3171 ,  H01J2237/006 ,  H01J2237/0216 ,  H01J2237/2001 ,  H01L21/67109 ,  Y10T279/23

    Abstract: The fluid delivery mechanism of the present disclosure provides a solution for use in a single axis of motion that allows the connection of one or more fluid flow paths over a wide range of temperatures into a vacuum environment. The mechanism does not employ flexible tubing that is prone to fatigue, especially at very low temperatures. In one embodiment, a tube is axially moved within a sealed piston to allow for fluid delivery. In a second embodiment, bellows are used to provide the required functionality. In another embodiment, it is possible to achieve movement in two or more axis of motion by utilizing two or more appropriateiy configured mechanisms.

    Abstract translation: 本公开的流体输送机构提供了用于单个运动轴线的解决方案，其允许在宽范围的温度下将一个或多个流体流动路径连接到真空环境中。 该机构不使用容易疲劳的柔性管，特别是在非常低的温度下。 在一个实施例中，管在密封活塞内轴向移动以允许流体输送。 在第二实施例中，波纹管用于提供所需的功能。 在另一个实施例中，可以通过利用两个或多个适当配置的机构来实现两个或更多个运动轴的运动。

    PLATEN COOLING MECHANISM FOR CRYOGENIC ION IMPLANTING
    9.
    发明申请
    PLATEN COOLING MECHANISM FOR CRYOGENIC ION IMPLANTING 审中-公开
    用于低温离子植入的板冷却机构

    公开(公告)号：WO2010039695A2

    公开(公告)日：2010-04-08

    申请号：PCT/US2009/058758

    申请日：2009-09-29

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES ,  FISH, Roger, B. ,  BARSKY, Samuel, M. ,  ANELLA, Steven, M.

    Inventor： FISH, Roger, B. ,  BARSKY, Samuel, M. ,  ANELLA, Steven, M.

    IPC: H01L21/265 ,  H01L21/683

    CPC classification number: H01L21/67109

    Abstract: A system and method for altering and maintaining the temperature of a workpiece, especially at cryogenic temperatures, is disclosed. The platen on which the workpiece is located contains at least one inner conduit through which fluid can flow. An apparatus, in communication with a fluid source, is brought into contact with the platen. For example, an inlet and outlet on the platen and the ports of the apparatus may mate. Once the platen and the apparatus are successfully mated, fluid is passed through the apparatus and into the platen. Once the platen (and therefore the attached workpiece) has reached the desired temperature, the apparatus stops the flow of fluid through the platen. The apparatus and the platen then disengage. The platen is then free to move and rotated as required by the ion implantation process. When the platen temperature deviates from the desired temperature, the above process is repeated.

    Abstract translation: 公开了一种用于改变和保持工件的温度，特别是在低温下的温度的系统和方法。 工件所在的压板包含至少一个内部管道，流体可以通过该管道流动。 与流体源连通的装置与压板接触。 例如，压板上的入口和出口以及设备的端口可以配合。 一旦压板和设备成功配合，流体就会通过设备并进入压板。 一旦压板（并因此附着的工件）已经达到所需的温度，装置停止通过压板的流体流动。 然后，装置和压板脱开。 然后可以根据离子注入工艺的要求自由地移动和旋转压板。 当压板温度偏离所需温度时，重复上述过程。

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