Abstract:
A semiconductor device (50) is made by patterning a conductive layer (16) for forming gates (60, 62, 64) of transistors (80, 82, 84). The process for forming the gates (60, 62, 64) has a step of patterning photoresist (54, 56, 58) the overlies the conductive layer (16). The patterned photoresist (54, 56, 58) is trimmed so that its width is reduced. Fluorine, preferably F 2 , is applied to the trimmed photoresist (54, 56, 58) to increase its hardness and its selectivity to the conductive layer. Using the trimmed and fluorinated photoresist (54, 56, 58) as a mask, the conductive layer (16) is etched to form conductive features useful as gates (60, 62, 64). Transistors (80, 82, 84) are formed in which the conductive pillars are gates (60, 62, 64). Other halogens, especially chlorine, may be substituted for the fluorine.
Abstract:
A semiconductor device (50) is made by patterning a conductive layer (16) for forming gates (60, 62, 64) of transistors (80, 82, 84). The process for forming the gates (60, 62, 64) has a step of patterning photoresist (54, 56, 58) the overlies the conductive layer (16). The patterned photoresist (54, 56, 58) is trimmed so that its width is reduced. Fluorine, preferably F