公开(公告)号：WO2008048207A2

公开(公告)日：2008-04-24

申请号：PCT/US2006/025526

申请日：2006-06-28

Applicant: GENERAL ELECTRIC COMPANY ,  SIMONE, Davide, Louis ,  ANGELIU, Thomas, Martin ,  TONAPI, Sandeep, Shrikant ,  GIBSON, III., David, Alexander ,  ZHANG, Jian

Inventor： SIMONE, Davide, Louis ,  ANGELIU, Thomas, Martin ,  TONAPI, Sandeep, Shrikant ,  GIBSON, III., David, Alexander ,  ZHANG, Jian

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C08K3/08 ,  C08K2201/011 ,  C08L83/00 ,  C08L2666/54 ,  C09J9/02 ,  C09J11/04 ,  C09J183/04 ,  C09J2483/00 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272

Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

Abstract translation: 本发明提供了一种具有固化的低模量弹性体和冶金结合的微米尺寸金属颗粒和纳米尺寸金属颗粒的导电粘合剂组合物。 低模量弹性体通过减轻产生的应力提供了机械坚固性和可靠性; 并且冶金结合的微米尺寸金属颗粒和纳米尺寸金属颗粒提供了具有最小界面电阻的连续导电路径。 纳米尺寸的金属颗粒的添加降低了熔化温度并且允许冶金结合在可控温度下发生。

公开(公告)号：WO2008048207A3

公开(公告)日：2008-12-18

申请号：PCT/US2006025526

申请日：2006-06-28

Applicant: GEN ELECTRIC ,  SIMONE DAVIDE LOUIS ,  ANGELIU THOMAS MARTIN ,  TONAPI SANDEEP SHRIKANT ,  GIBSON III DAVID ALEXANDER ,  ZHANG JIAN

Inventor： SIMONE DAVIDE LOUIS ,  ANGELIU THOMAS MARTIN ,  TONAPI SANDEEP SHRIKANT ,  GIBSON III DAVID ALEXANDER ,  ZHANG JIAN

IPC: C09J9/02 ,  C09J11/04 ,  C09J121/00 ,  H01B1/22

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C08K3/08 ,  C08K2201/011 ,  C08L83/00 ,  C08L2666/54 ,  C09J9/02 ,  C09J11/04 ,  C09J183/04 ,  C09J2483/00 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272

Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

Abstract translation: 本发明提供一种导电粘合剂组合物，其具有固化的低模量弹性体和冶金结合的微米级金属颗粒和纳米尺寸的金属颗粒。 低弹性弹性体通过减轻产生的应力来提供机械坚固性和可靠性; 并且冶金结合的微米级金属颗粒和纳米级金属颗粒提供具有最小界面电阻的连续导电路径。 纳米尺寸金属颗粒的添加降低了熔化温度，并允许在可控温度下进行冶金结合。