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公开(公告)号：WO2008048207A2
公开(公告)日：2008-04-24
申请号：PCT/US2006/025526
申请日：2006-06-28
Applicant: GENERAL ELECTRIC COMPANY , SIMONE, Davide, Louis , ANGELIU, Thomas, Martin , TONAPI, Sandeep, Shrikant , GIBSON, III., David, Alexander , ZHANG, Jian
Inventor： SIMONE, Davide, Louis , ANGELIU, Thomas, Martin , TONAPI, Sandeep, Shrikant , GIBSON, III., David, Alexander , ZHANG, Jian
CPC classification number: H01B1/22 , B82Y30/00 , C08K3/08 , C08K2201/011 , C08L83/00 , C08L2666/54 , C09J9/02 , C09J11/04 , C09J183/04 , C09J2483/00 , H05K3/321 , H05K2201/0133 , H05K2201/0257 , H05K2201/0266 , H05K2201/0272
Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.
Abstract translation: 本发明提供了一种具有固化的低模量弹性体和冶金结合的微米尺寸金属颗粒和纳米尺寸金属颗粒的导电粘合剂组合物。 低模量弹性体通过减轻产生的应力提供了机械坚固性和可靠性; 并且冶金结合的微米尺寸金属颗粒和纳米尺寸金属颗粒提供了具有最小界面电阻的连续导电路径。 纳米尺寸的金属颗粒的添加降低了熔化温度并且允许冶金结合在可控温度下发生。
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2.发明申请
公开(公告)号：WO2007001803A2
公开(公告)日：2007-01-04
申请号：PCT/US2006022587
申请日：2006-06-09
Applicant: GEN ELECTRIC , RUBINSZTAJN SLAWOMIR , CAMPBELL JOHN ROBERT , MILLS RYAN CHRISTOPHER , TONAPI SANDEEP SHRIKANT , PRABHAKUMAR ANANTH
Inventor： RUBINSZTAJN SLAWOMIR , CAMPBELL JOHN ROBERT , MILLS RYAN CHRISTOPHER , TONAPI SANDEEP SHRIKANT , PRABHAKUMAR ANANTH
CPC classification number: H01L23/293 , B01J31/0237 , B01J31/0244 , B01J31/146 , C08G59/68 , C08G59/70 , H01L21/563 , H01L24/81 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/3025 , H01L2924/00
Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen- containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
Abstract translation: 提供固化催化剂。 固化催化剂可以包括路易斯酸和含氮分子或非叔膦中的一种或两种。 含氮分子可以包括单胺或杂环芳族有机化合物。 可固化组合物可以包含固化催化剂。 电子器件可以包括可固化组合物。 还提供了与前述相关的方法。
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3.发明申请
公开(公告)号：WO2006107660A1
公开(公告)日：2006-10-12
申请号：PCT/US2006/011314
申请日：2006-03-28
Applicant: GENERAL ELECTRIC COMPANY , CAMPBELL, John, Robert , TONAPI, Sandeep, Shrikant , PRABHAKUMAR, Ananth , GIBSON, David, Alexander, III , RUBINSZTAJN, Slawomir
Inventor： CAMPBELL, John, Robert , TONAPI, Sandeep, Shrikant , PRABHAKUMAR, Ananth , GIBSON, David, Alexander, III , RUBINSZTAJN, Slawomir
CPC classification number: H01L23/293 , B82Y30/00 , C01P2004/64 , C01P2006/12 , C01P2006/22 , C08G59/3218 , C08G59/68 , C08K9/06 , C08L63/00 , C09C1/3081 , C09C3/12 , C09J163/00 , H01L24/81 , H01L2224/274 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , Y10T428/12556 , Y10T428/12569 , Y10T428/12771 , Y10T428/12812 , H01L2924/00
Abstract: A finely divided refractory solid and an associated method are provided. The solid may have a surface area that is greater than about 5 square meters per gram. The solid may have a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks. Also, a curable composition, a cured layer, and an electronic device that includes the cured layer are provided.
Abstract translation: 提供细碎的耐火固体和相关方法。 该固体可具有大于约5平方米/克的表面积。 固体可以具有每平方毫米表面积的活性表面终止位置的密度足够低，使得包含小于约99重量％的固体的可固化树脂的可固化组合物在a以后的稳定比小于约3 期间约两周。 此外，提供了包含固化层的固化性组合物，固化层和电子器件。
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公开(公告)号：WO2005061588A1
公开(公告)日：2005-07-07
申请号：PCT/US2004/038009
申请日：2004-11-15
Applicant: GENERAL ELECTRIC COMPANY (a New York Corporation) , RUBINSZTAJN, Slawomir , CAMPBELL, John , PRABHAKUMAR, Ananth , TONAPI, Sandeep, Shrikant
IPC: C08G77/14
CPC classification number: C08G59/423 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663
Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about I nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
Abstract translation: 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物，其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中，环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂，含羟基单体，粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。
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公开(公告)号：WO2008048207A3
公开(公告)日：2008-12-18
申请号：PCT/US2006025526
申请日：2006-06-28
Applicant: GEN ELECTRIC , SIMONE DAVIDE LOUIS , ANGELIU THOMAS MARTIN , TONAPI SANDEEP SHRIKANT , GIBSON III DAVID ALEXANDER , ZHANG JIAN
Inventor： SIMONE DAVIDE LOUIS , ANGELIU THOMAS MARTIN , TONAPI SANDEEP SHRIKANT , GIBSON III DAVID ALEXANDER , ZHANG JIAN
IPC: C09J9/02 , C09J11/04 , C09J121/00 , H01B1/22
CPC classification number: H01B1/22 , B82Y30/00 , C08K3/08 , C08K2201/011 , C08L83/00 , C08L2666/54 , C09J9/02 , C09J11/04 , C09J183/04 , C09J2483/00 , H05K3/321 , H05K2201/0133 , H05K2201/0257 , H05K2201/0266 , H05K2201/0272
Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.
Abstract translation: 本发明提供一种导电粘合剂组合物，其具有固化的低模量弹性体和冶金结合的微米级金属颗粒和纳米尺寸的金属颗粒。 低弹性弹性体通过减轻产生的应力来提供机械坚固性和可靠性; 并且冶金结合的微米级金属颗粒和纳米级金属颗粒提供具有最小界面电阻的连续导电路径。 纳米尺寸金属颗粒的添加降低了熔化温度，并允许在可控温度下进行冶金结合。
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Patent Agency Ranking
公开(公告)号：WO2007001803A3
公开(公告)日：2007-01-04
申请号：PCT/US2006/022587
申请日：2006-06-09
Applicant: GENERAL ELECTRIC COMPANY( A NEW YORK CORPORATION) , RUBINSZTAJN, Slawomir , CAMPBELL, John, Robert , MILLS, Ryan, Christopher , TONAPI, Sandeep, Shrikant , PRABHAKUMAR, Ananth
Inventor： RUBINSZTAJN, Slawomir , CAMPBELL, John, Robert , MILLS, Ryan, Christopher , TONAPI, Sandeep, Shrikant , PRABHAKUMAR, Ananth
Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen- containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
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公开(公告)号：WO2006132822A2
公开(公告)日：2006-12-14
申请号：PCT/US2006020445
申请日：2006-05-25
Applicant: GEN ELECTRIC , GOWDA ARUN VIRUPAKSHA , TONAPI SANDEEP SHRIKANT , MILLS RYAN CHRISTOPHER , ESLER DAVID RICHARD , LATHAM STEPHEN ANDREW , CAMPBELL JOHN ROBERT
Inventor： GOWDA ARUN VIRUPAKSHA , TONAPI SANDEEP SHRIKANT , MILLS RYAN CHRISTOPHER , ESLER DAVID RICHARD , LATHAM STEPHEN ANDREW , CAMPBELL JOHN ROBERT
IPC: H01L21/60 , H01L21/48 , H01L21/56 , H01L23/373
CPC classification number: H01L21/563 , H01L21/4871 , H01L23/3737 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/01004 , H01L2924/01019 , H01L2924/01021 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/12044 , H01L2924/00
Abstract: Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.
Abstract translation: 公开了用于形成电子装置的方法，该电子装置包括同时用作底部填充材料的材料以及热界面材料。 此处还给出了包括散热元件，半导体芯片，基板和导热材料的电子组件，其中导热材料同时用作底部填充材料以及热界面材料。
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公开(公告)号：WO2006135556A3
公开(公告)日：2007-04-19
申请号：PCT/US2006020685
申请日：2006-05-30
Applicant: GEN ELECTRIC , TONAPI SANDEEP SHRIKANT , CAMPBELL JOHN ROBERT , MILLS RYAN CHRISTOPHER , ZHANG JIAN , LATHAM STEPHEN ANDREW
Inventor： TONAPI SANDEEP SHRIKANT , CAMPBELL JOHN ROBERT , MILLS RYAN CHRISTOPHER , ZHANG JIAN , LATHAM STEPHEN ANDREW
IPC: H01L23/373 , C09J7/00 , C09K5/00
CPC classification number: H01L23/3737 , C09J7/10 , H01L23/42 , H01L2924/0002 , H01L2924/3011 , Y10T428/31511 , H01L2924/00
Abstract: A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well as a device that incorporates the film.
Abstract translation: 提供了包括热界面材料的可B阶段的膜。 该膜可以将发热装置固定到散热部件，可以进一步交联，并且可以将热能从发热装置传导到散热部件。 提供了制造和使用该膜的方法，以及包含该膜的装置。
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公开(公告)号：WO2006132822A3
公开(公告)日：2006-12-14
申请号：PCT/US2006/020445
申请日：2006-05-25
Applicant: GENERAL ELECTRIC COMPANY( A NEW YORK CORPORATION) , GOWDA, Arun, Virupaksha , TONAPI, Sandeep, Shrikant , MILLS, Ryan, Christopher , ESLER, David, Richard , LATHAM, Stephen, Andrew , CAMPBELL, John, Robert
Inventor： GOWDA, Arun, Virupaksha , TONAPI, Sandeep, Shrikant , MILLS, Ryan, Christopher , ESLER, David, Richard , LATHAM, Stephen, Andrew , CAMPBELL, John, Robert
IPC: H01L21/60 , H01L21/56 , H01L23/373 , H01L21/48
Abstract: Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.
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公开(公告)号：WO2006107659A1
公开(公告)日：2006-10-12
申请号：PCT/US2006/011313
申请日：2006-03-28
Applicant: GENERAL ELECTRIC COMPANY , CAMPBELL, John, Robert , RUBINSZTAJN, Siawomir , GIBSON, David, Alexander, III , TONAPI, Sandeep, Shrikant , MILLS, Ryan, Christopher , PRABHAKUMAR, Ananth
Inventor： CAMPBELL, John, Robert , RUBINSZTAJN, Siawomir , GIBSON, David, Alexander, III , TONAPI, Sandeep, Shrikant , MILLS, Ryan, Christopher , PRABHAKUMAR, Ananth
CPC classification number: C08G59/3218 , C08G59/24 , C08G59/4215 , C08G59/68 , C08K3/36 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , Y10T428/31511 , C08L63/00 , H01L2924/00
Abstract: A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
Abstract translation: 组合物包含第一可固化树脂组合物，其包含至少一种与溶剂组合的芳族环氧树脂，官能化胶态二氧化硅分散体和至少一种选自脂环族单体，脂族环氧单体，羟基芳族化合物 化合物，其组合，及其混合物。 组合物可以包括单独的第二可固化助熔组合物，其包含至少一种环氧树脂。 第一可固化树脂或两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。
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