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    AN APPARATUS FOR HANDLING A SUBSTRATE AND A METHOD THEREOF
    2.
    发明申请
    AN APPARATUS FOR HANDLING A SUBSTRATE AND A METHOD THEREOF 审中-公开
    一种处理基板的装置及其方法

    公开(公告)号：WO2009099922A3

    公开(公告)日：2009-11-05

    申请号：PCT/US2009032556

    申请日：2009-01-30

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ,  HOLDEN SCOTT C

    Inventor： HOLDEN SCOTT C

    IPC: H01L21/67 ,  H01L21/265 ,  H01L21/677 ,  H01L21/68

    CPC classification number: H01L21/67259 ,  H01J37/20 ,  H01J37/3171 ,  H01J37/32743 ,  H01J2237/20207 ,  H01J2237/20292 ,  H01J2237/204 ,  H01J2237/24528 ,  H01J2237/2482 ,  H01L21/68742

    Abstract: An apparatus and method of handling substrates is disclosed. A detecting system, capable of determining whether a substrate is tilted in. relation to the platen, is positioned proximate to the substrate. In some embodiments, the detecting system is a distance measuring system. In other embodiments, it is an angle sensor. The detecting system is in communication with a controller, which, in turn, is in communication with a substrate handling robot. If, based on information received from the detecting system, the controller determines that the substrate is tilted beyond an acceptable range, it is assumed that the substrate has remained attached to the platen. In such a case, the substrate handling robot does not attempt to remove it from the platen. In this way, the substrate is not damaged.

    Abstract translation: 公开了一种处理基材的设备和方法。 能够确定衬底是否相对于台板倾斜的检测系统位于衬底附近。 在一些实施例中，检测系统是距离测量系统。 在其他实施例中，它是角度传感器。 检测系统与控制器通信，控制器又与基板处理机器人通信。 如果基于从检测系统接收到的信息，控制器确定衬底倾斜超出可接受的范围，则假定衬底保持附接至台板。 在这种情况下，基板处理机器人不会尝试将其从压板上移除。 这样，基材不会被损坏。

    AN APPARATUS FOR HANDLING A SUBSTRATE AND A METHOD THEREOF
    6.
    发明申请
    AN APPARATUS FOR HANDLING A SUBSTRATE AND A METHOD THEREOF 审中-公开
    一种用于处理基板的装置及其方法

    公开(公告)号：WO2009099922A2

    公开(公告)日：2009-08-13

    申请号：PCT/US2009/032556

    申请日：2009-01-30

    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. ,  HOLDEN, Scott, C.

    Inventor： HOLDEN, Scott, C.

    IPC: H01L21/67 ,  H01L21/68 ,  H01L21/26

    CPC classification number: H01L21/67259 ,  H01J37/20 ,  H01J37/3171 ,  H01J37/32743 ,  H01J2237/20207 ,  H01J2237/20292 ,  H01J2237/204 ,  H01J2237/24528 ,  H01J2237/2482 ,  H01L21/68742

    Abstract: An apparatus and method of handling substrates is disclosed. A detecting system, capable of determining whether a substrate is tilted in. relation to the platen, is positioned proximate to the substrate. In some embodiments, the detecting system is a distance measuring system. In other embodiments, it is an angle sensor. The detecting system is in communication with a controller, which, in turn, is in communication with a substrate handling robot. If, based on information received from the detecting system, the controller determines that the substrate is tilted beyond an acceptable range, it is assumed that the substrate has remained attached to the platen. In such a case, the substrate handling robot does not attempt to remove it from the platen. In this way, the substrate is not damaged.

    Abstract translation: 公开了一种处理衬底的装置和方法。 能够确定衬底是否相对于压板倾斜的检测系统位于靠近衬底的位置。 在一些实施例中，检测系统是距离测量系统。 在其它实施例中，它是角度传感器。 检测系统与控制器通信，控制器又与衬底处理机器人连通。 如果基于从检测系统接收的信息，控制器确定衬底倾斜超过可接受的范围，则假设衬底保持附着在压板上。 在这种情况下，基板处理机器人不会试图将其从压板上移除。 这样就不会损坏基板。

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