SPUTTERING TARGET AND MEANS FOR COOLING THE TARGET
    4.
    发明申请
    SPUTTERING TARGET AND MEANS FOR COOLING THE TARGET 审中-公开
    溅射目标和冷却目标的手段

    公开(公告)号:WO2007050305A1

    公开(公告)日:2007-05-03

    申请号:PCT/US2006/039856

    申请日:2006-10-13

    CPC classification number: H01J37/3497 H01J37/3405

    Abstract: A sputtering target includes an outer target tube (14), an inner support tube (22) supporting a magnet carrier bar (24) extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling plenum radially between the inner support tube and the outer target tube; and a baffle comprising a substantially flat plate (50) attached to the inner support tube adjacent the opposite end, the plate extending radially within the plenum between the inner support tube and the outer target tube and having an array of flow apertures (56) therein.

    Abstract translation: 溅射靶包括外目标管(14),支撑沿着内支撑管的大致整个长度延伸的磁体承载杆(24)的内支撑管(22) 以及水冷却回路,其包括在所述内支撑管内的至少一个通道,其一端处的入口适于从外部源接收冷却水,所述至少一个出口在其相对端处径向地通向所述冷却室, 内支撑管和外目标管; 以及挡板,其包括附接到相邻端部的内支撑管的基本平坦的板(50),所述板在所述内支撑管和所述外目标管之间的所述增压室内径向延伸并且在其内具有排列的流动孔(56) 。

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