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    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
    1.
    发明申请
    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 审中-公开
    用于检查和/或分类晶片的计算机实施的方法

    公开(公告)号：WO2010011578A2

    公开(公告)日：2010-01-28

    申请号：PCT/US2009/051044

    申请日：2009-07-17

    Applicant: KLA-TENCOR CORPORATION ,  REICH, Juergen ,  VINTRO, Louis ,  DIGHE, Prasanna ,  STEINBACH, Andrew ,  KAVALDJIEV, Daniel ,  BIELLAK, Stephen

    Inventor： REICH, Juergen ,  VINTRO, Louis ,  DIGHE, Prasanna ,  STEINBACH, Andrew ,  KAVALDJIEV, Daniel ,  BIELLAK, Stephen

    IPC: H01L21/66

    CPC classification number: H01L22/12 ,  G01N21/9501 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    Abstract translation: 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的方法包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数基于晶片的非空间局部化特性来确定，所述特性是利用响应于由检查系统产生的从晶片散射的光的输出而确定的。 另一种计算机实现的方法包括基于晶片的非空间局部化特性的组合来对晶片进行分类，所述晶片的非空间局部化特性使用响应于由检查系统产生的晶片散射的光的输出而确定，并且使用输出确定的晶片的空间局部化特性

    METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE
    3.
    发明申请
    METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE 审中-公开
    用于测量基板的形状或厚度信息的方法和装置

    公开(公告)号：WO2010096387A3

    公开(公告)日：2010-11-18

    申请号：PCT/US2010024305

    申请日：2010-02-16

    Applicant: KLA TENCOR CORP ,  TANG SHOUHONG ,  KREN GEORGE ,  MUELLER DIETER ,  HAAS BRIAN ,  KAVALDJIEV DANIEL

    Inventor： TANG SHOUHONG ,  KREN GEORGE ,  MUELLER DIETER ,  HAAS BRIAN ,  KAVALDJIEV DANIEL

    IPC: H01L21/66 ,  G01B11/06

    CPC classification number: G01B9/02021 ,  G01B9/02027 ,  G01B9/02057 ,  G01B9/02072 ,  G01B9/0209 ,  G01B11/306

    Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.

    Abstract translation: 干涉仪系统和方法可用于测量衬底厚度或形状。 该系统可以包括两个间隔开的参考平面，其具有在两个平行参考表面之间形成光腔。 衬底保持器可以被配置为将衬底放置在空腔中，其中第一和第二衬底表面基本上平行于相应的第一和第二参考表面，使得第一或第二衬底表面之间的空间距离相应的一个 参考表面或阻尼表面。 干涉仪装置可以位于空腔的径向相对的两侧并与之光耦合。 干涉仪可以分别通过经由干涉仪装置光耦合到腔体的光的干涉来映射衬底表面和参考表面之间的间隔的变化。

    METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE
    5.
    发明申请
    METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE 审中-公开
    用于测量基片的形状或厚度信息的方法和设备

    公开(公告)号：WO2010096387A2

    公开(公告)日：2010-08-26

    申请号：PCT/US2010/024305

    申请日：2010-02-16

    Applicant: KLA-TENCOR CORPORATION ,  TANG, Shouhong ,  KREN, George ,  MUELLER, Dieter ,  HAAS, Brian ,  KAVALDJIEV, Daniel

    Inventor： TANG, Shouhong ,  KREN, George ,  MUELLER, Dieter ,  HAAS, Brian ,  KAVALDJIEV, Daniel

    IPC: H01L21/66 ,  G01B11/06

    CPC classification number: G01B9/02021 ,  G01B9/02027 ,  G01B9/02057 ,  G01B9/02072 ,  G01B9/0209 ,  G01B11/306

    Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.

    Abstract translation: 可以使用干涉仪系统和方法来测量衬底厚度或形状。 该系统可以包括两个间隔开的参考平面，其具有在两个平行参考表面之间形成光学腔。 衬底保持器可以被构造成将衬底放置在具有基本上平行于对应的第一和第二参考表面的第一和第二衬底表面的空腔中，使得第一或第二衬底表面之间的间隔距相应的一个第三和第二衬底表面 参考表面或阻尼表面。 干涉仪装置可位于空腔的径向相对侧并与其光学耦合。 干涉仪可以分别通过干涉仪装置通过光学耦合到腔体和从腔体发射到腔体的光的干涉来映射衬底表面和参考表面之间的间隔的变化。

    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
    9.
    发明申请
    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 审中-公开
    用于检查和/或分类WAFER的计算机实现方法

    公开(公告)号：WO2010011578A3

    公开(公告)日：2010-04-22

    申请号：PCT/US2009051044

    申请日：2009-07-17

    Applicant: KLA TENCOR CORP ,  REICH JUERGEN ,  VINTRO LOUIS ,  DIGHE PRASANNA ,  STEINBACH ANDREW ,  KAVALDJIEV DANIEL ,  BIELLAK STEPHEN

    Inventor： REICH JUERGEN ,  VINTRO LOUIS ,  DIGHE PRASANNA ,  STEINBACH ANDREW ,  KAVALDJIEV DANIEL ,  BIELLAK STEPHEN

    IPC: H01L21/66

    CPC classification number: H01L22/12 ,  G01N21/9501 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    Abstract translation: 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性的组合，以及使用输出确定的晶片的空间局部化特性 。

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