公开(公告)号：WO2008007160A2

公开(公告)日：2008-01-17

申请号：PCT/IB2006/001381

申请日：2006-07-11

Applicant: ABB RESEARCH LTD. ,  WIESE, Wilhelm ,  HASAN KHAN, Ahmad

Inventor： WIESE, Wilhelm ,  HASAN KHAN, Ahmad

IPC: G06Q10/00 ,  G05B23/02

CPC classification number: G06Q10/06 ,  Y04S10/54

Abstract: This invention relates to the Life Cycle Management System for distributed Intelligent Electronic Devices (IED) starting from the design phase to the end of service phase. Hence, it caters to the needs from installation via engineering, installation/commissioning phases, until asset management and remote service support of the devices during the operational phase The increasing decentralization of the involved components via networks, especially via the Internet, is a key criterion and needs to be addressed by the life cycle management. The added value for the customer grows disproportionately with the degree of integration of multiple independent software components into a complex and often highly distributed control system. The architecture of today's control systems must be sufficiently flexible to allow customers to regard their plant components from various locations. Additionally, the stability, security and maintainability of such a system is strongly dependent on the homogeneity and interoperability of all involved components.

Abstract translation: 本发明涉及从设计阶段到服务阶段结束的分布式智能电子设备（IED）的生命周期管理系统。 因此，它可以通过工程，安装/调试阶段的安装，到运营阶段的设备的资产管理和远程服务支持来满足需求。通过网络，特别是通过互联网，所涉及的组件的越来越多的分散化是关键的标准 并需要通过生命周期管理来解决。 随着多个独立软件组件集成到一个复杂且经常高度分布的控制系统中，客户的附加值不成比例地增长。 当今的控制系统的架构必须具有足够的灵活性，以便客户能够从各个位置考虑其工厂部件。 此外，这种系统的稳定性，安全性和可维护性在很大程度上取决于所有相关组件的均匀性和互操作性。

公开(公告)号：WO2021006919A1

公开(公告)日：2021-01-14

申请号：PCT/US2019/045307

申请日：2019-08-06

Applicant: JAFFERY, Hasnain Sajjad ,  KHAN, Ahmad, Ali

Inventor： JAFFERY, Hasnain Sajjad ,  KHAN, Ahmad, Ali

IPC: G06Q40/06 ,  G06Q40/04 ,  G06F40/00

Abstract: Screening of entities using multi-level rules and tolerances against entity data. The entity data are screened for multiple entities, including determining if the entity data comply with business activity rules. If a respective entity fails to comply with the business activity rules, investments with the non-compliant entity are added to a list of non-usable investments. If the respective entity complies with the business activity rules, the respective entity is identified as a business-activity-compliant entity. Each respective business-activity-compliant entity is then screened using multiple screening methodologies, which are applied to screen the entity data for the respective business-activity-compliant entity against each of the financial rules in accordance with the respective screening methodology. If the financial rules satisfy at least one tolerance setting, investments with the respective business-activity-compliant entity are added to a list of usable investments; otherwise, investments with the respective business-activity-compliant entity are added to the list of non-usable investments.

公开(公告)号：WO2008007160A4

公开(公告)日：2009-04-16

申请号：PCT/IB2006001381

申请日：2006-07-11

Applicant: ABB RESEARCH LTD ,  WIESE WILHELM ,  HASAN KHAN AHMAD

Inventor： WIESE WILHELM ,  HASAN KHAN AHMAD

IPC: G05B23/02 ,  G06Q10/00

CPC classification number: G06Q10/06 ,  Y04S10/54

Abstract: This invention relates to the Life Cycle Management System for distributed Intelligent Electronic Devices (IED) starting from the design phase to the end of service phase. Hence, it caters to the needs from installation via engineering, installation/commissioning phases, until asset management and remote service support of the devices during the operational phase The increasing decentralization of the involved components via networks, especially via the Internet, is a key criterion and needs to be addressed by the life cycle management. The added value for the customer grows disproportionately with the degree of integration of multiple independent software components into a complex and often highly distributed control system. The architecture of today's control systems must be sufficiently flexible to allow customers to regard their plant components from various locations. Additionally, the stability, security and maintainability of such a system is strongly dependent on the homogeneity and interoperability of all involved components.

Abstract translation: 本发明涉及从设计阶段到服务阶段结束的分布式智能电子设备（IED）的生命周期管理系统。 因此，它可以通过工程，安装/调试阶段的安装，到运营阶段的设备的资产管理和远程服务支持来满足需求。通过网络，特别是通过互联网，所涉及的组件的越来越多的分散化是关键的标准 并需要通过生命周期管理来解决。 客户的附加值随着多个独立软件组件集成到复杂且通常高度分布式控制系统的程度而不成比例地增长。 当今控制系统的架构必须足够灵活，以便客户能够从各个地点考虑其工厂部件。 此外，这种系统的稳定性，安全性和可维护性强烈依赖于所有相关组件的均匀性和互操作性。

公开(公告)号：WO2007022538A2

公开(公告)日：2007-02-22

申请号：PCT/US2006/032822

申请日：2006-08-21

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  SHI, Jianou ,  ZHANG, Xiafang ,  PEI, Shiyou ,  HUANG, Shu, Chun ,  YEH, Dennis ,  RZEPIELA, Jeffrey, A. ,  FENG, Yiping ,  KHAN, Ahmad ,  KAGAN, Alexander ,  EDELSTEIN, Sergio

Inventor： SHI, Jianou ,  ZHANG, Xiafang ,  PEI, Shiyou ,  HUANG, Shu, Chun ,  YEH, Dennis ,  RZEPIELA, Jeffrey, A. ,  FENG, Yiping ,  KHAN, Ahmad ,  KAGAN, Alexander ,  EDELSTEIN, Sergio

IPC: G01R31/26

CPC classification number: G01R31/2831 ,  G01R31/2856 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Test pads, methods, and systems for measuring properties of a wafer are provided. One test pad formed on a wafer includes a test structure configured such that one or more electrical properties of the test structure can be measured. The test pad also includes a conductive layer formed between the test structure and the wafer. The conductive layer prevents structures located under the test structure between the conductive layer and the wafer from affecting the one or more electrical properties of the test structure during measurement. One method for assessing plasma damage of a wafer includes measuring one or more electrical properties of a test structure formed on the wafer and determining an index characterizing the plasma damage of the test structure using the one or more electrical properties. In addition, systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.

Abstract translation: 提供了用于测量晶片性能的测试垫，方法和系统。 形成在晶片上的一个测试焊盘包括测试结构，其被配置为使得可以测量测试结构的一个或多个电特性。 测试垫还包括在测试结构和晶片之间形成的导电层。 导电层防止在测量期间位于导电层和晶片之间的测试结构下方的结构影响测试结构的一个或多个电性能。 用于评估晶片的等离子体损伤的一种方法包括测量形成在晶片上的测试结构的一个或多个电特性，并使用一个或多个电性质确定表征测试结构的等离子体损伤的指标。 此外，提供了用于控制晶片上的电荷沉积以测量晶片的一个或多个电性能的系统和方法。 一个系统包括配置成将电荷沉积在晶片上的电晕源和配置成测量电晕源内的一个或多个条件的传感器。 该系统还包括配置为基于一个或多个条件来改变电晕源的一个或多个参数的控制子系统。 另一种系统包括电晕源，其被配置为在电荷沉积期间将电荷沉积在晶片上以及布置在电晕源的放电室内的气体混合物。 气体混合物改变沉积在晶片上的电荷的一个或多个参数。

公开(公告)号：WO2008007160A3

公开(公告)日：2009-02-26

申请号：PCT/IB2006001381

申请日：2006-07-11

Applicant: ABB RESEARCH LTD ,  WIESE WILHELM ,  HASAN KHAN AHMAD

Inventor： WIESE WILHELM ,  HASAN KHAN AHMAD

IPC: G05B23/02 ,  G06Q10/00

CPC classification number: G06Q10/06 ,  Y04S10/54

Abstract: This invention relates to the Life Cycle Management System for distributed Intelligent Electronic Devices (IED) starting from the design phase to the end of service phase. Hence, it caters to the needs from installation via engineering, installation/commissioning phases, until asset management and remote service support of the devices during the operational phase The increasing decentralization of the involved components via networks, especially via the Internet, is a key criterion and needs to be addressed by the life cycle management. The added value for the customer grows disproportionately with the degree of integration of multiple independent software components into a complex and often highly distributed control system. The architecture of today's control systems must be sufficiently flexible to allow customers to regard their plant components from various locations. Additionally, the stability, security and maintainability of such a system is strongly dependent on the homogeneity and interoperability of all involved components.

Abstract translation: 本发明涉及用于分布式智能电子设备（IED）的生命周期管理系统，从设计阶段到服务阶段结束。 因此，它满足了从安装到工程，安装/调试阶段的需求，直到运营阶段的设备资产管理和远程服务支持。通过网络，尤其是通过互联网增加相关组件的分散化是一个关键标准 并且需要通过生命周期管理来解决。 客户的附加价值随着多个独立软件组件集成到一个复杂且通常高度分布的控制系统的程度而不成比例地增长。 当今控制系统的架构必须具有足够的灵活性，以允许客户从不同地点查看其工厂组件。 此外，这种系统的稳定性，安全性和可维护性强烈依赖于所有相关组件的同质性和互操作性。

公开(公告)号：WO2007022538A3

公开(公告)日：2009-04-23

申请号：PCT/US2006032822

申请日：2006-08-21

Applicant: KLA TENCOR TECH CORP ,  SHI JIANOU ,  ZHANG XIAFANG ,  PEI SHIYOU ,  HUANG SHU CHUN ,  YEH DENNIS ,  RZEPIELA JEFFREY A ,  FENG YIPING ,  KHAN AHMAD ,  KAGAN ALEXANDER ,  EDELSTEIN SERGIO

Inventor： SHI JIANOU ,  ZHANG XIAFANG ,  PEI SHIYOU ,  HUANG SHU CHUN ,  YEH DENNIS ,  RZEPIELA JEFFREY A ,  FENG YIPING ,  KHAN AHMAD ,  KAGAN ALEXANDER ,  EDELSTEIN SERGIO

IPC: G01R31/02

CPC classification number: G01R31/2831 ,  G01R31/2856 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Test pads, methods, and systems for measuring properties of a wafer are provided. One test pad formed on a wafer includes a test structure configured such that one or more electrical properties of the test structure can be measured. The test pad also includes a conductive layer formed between the test structure and the wafer. The conductive layer prevents structures located under the test structure between the conductive layer and the wafer from affecting the one or more electrical properties of the test structure during measurement. One method for assessing plasma damage of a wafer includes measuring one or more electrical properties of a test structure formed on the wafer and determining an index characterizing the plasma damage of the test structure using the one or more electrical properties. In addition, systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.

Abstract translation: 提供了用于测量晶片性能的测试垫，方法和系统。 形成在晶片上的一个测试焊盘包括测试结构，其被配置为使得可以测量测试结构的一个或多个电特性。 测试垫还包括在测试结构和晶片之间形成的导电层。 导电层防止在测量期间位于导电层和晶片之间的测试结构下方的结构影响测试结构的一个或多个电性能。 用于评估晶片的等离子体损伤的一种方法包括测量形成在晶片上的测试结构的一个或多个电特性，并使用一个或多个电性质确定表征测试结构的等离子体损伤的指标。 此外，提供了用于控制晶片上的电荷沉积以测量晶片的一个或多个电性能的系统和方法。 一个系统包括配置成将电荷沉积在晶片上的电晕源和配置成测量电晕源内的一个或多个条件的传感器。 该系统还包括配置为基于一个或多个条件来改变电晕源的一个或多个参数的控制子系统。 另一种系统包括电晕源，其被配置为在电荷沉积期间将电荷沉积在晶片上以及布置在电晕源的放电室内的气体混合物。 气体混合物改变沉积在晶片上的电荷的一个或多个参数。