摘要:
Ultrasonic scanners and methods of manufacturing ultrasonic scanners. One embodiment of a method includes integrating a flexible electronic device (e.g. an IC) and a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with a flexible member. The IC, the transducer, and the flexible member can form a flexible subassembly which is rolled up to form an ultrasonic scanner. The integration of the IC and the transducer can occur at the same time. In the alterative, the integration of the electronic device can occur before the integration of the transducer. Moreover, the integration of the transducer can include using a semiconductor technique. Furthermore, the rolled up subassembly can form a lumen or can be attached to a lumen. The method can include folding a portion of the flexible subassembly to form a forward looking transducer. The flexible member of some subassemblies can include a pair of arms.
摘要:
A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer (300) to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor (310). A dielectric material (320) is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array.
摘要:
A micro-electro-mechanical transducer (such as a cMUT) having two electrodes separated by an insulator with an insulation extension is disclosed. The two electrodes define a transducing gap therebetween. The insulator has an insulating support disposed generally between the two electrodes and an insulation extension extending into at least one of two electrodes to increase the effective insulation without having to increase the transducing gap. Methods for fabricating the micro-electro-mechanical transducer are also disclosed. The methods may be used in both conventional membrane-based cMUTs and cMUTs having embedded springs transporting a rigid top plate.
摘要:
A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a resilient structure therebetween. The resilient structure has multiple connectors distributed over the device element area to vertically transport the top player with distributed support. The resilient structure may be cantilevers formed using a middle spring layer covering cavities on the substrate. Connectors define a transducing space below the top plate. The resilient structure enables a vertical displacement of the connectors, which transports the top plate in a piston-like motion to change the transducing space and to effectuate energy transformation. No separate cells are necessary for each addressable transducer element. Multiple device elements can be made on the same substrate.
摘要:
A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer (500) has a substrate (501), a top plate (540), a middle spring (520) layer therebetween. The substrate (501) and the middle spring layer (520) define cavities therebetween sidewalle standing features. The middle spring layer (520) is anchored by the standing features to create cantilevers over the cavities to enab vertical displacement of connectors placed on the middle spring layer (520). The connectors define a transducing space between th middle spring layer (520) and the top plate (540). The top plate (540) is transported by the vertical displacement of the connectors in piston-like motion to change the transducing space and to effectuate energy transformation. Various configurations of cantilevers including single cantilevers, back-to-back double cantilevers and head-to-head double cantilevers (bridges) are possible.
摘要:
A capacitive micromachined ultrasonic transducer (cMUT) system uses a modulation technique to increase cMUT sensitivity. An AC carrier signal is applied to the cMUT through a modulation signal port to modulate the signal. The higher frequency of the AC carrier signal carries the real signal to a high frequency range to increase the output current signal level. The real signal is later recovered by demodulation. The technique is applicable in both the reception mode and the transmission mode.
摘要:
A capacitive micromachined ultrasonic transducer (cMUT) system uses a modulation technique to increase cMUT sensitivity. An AC carrier signal is applied to the cMUT through a modulation signal port to modulate the signal. The higher frequency of the AC carrier signal carries the real signal to a high frequency range to increase the output current signal level. The real signal is later recovered by demodulation. The technique is applicable in both the reception mode and the transmission mode.
摘要:
A micro-electro-mechanical transducer (such as a cMUT) having a non-flat surface (740-744) is disclosed. The non-flat surface (740-744) may include a variable curve or slope in an area where a spring layer (720) contacts a support (730), thus making a variable spring model as the spring layer (720) vibrates. The non-flat surface (740-744) may be that of a non-flat electrode optimized to compensate the dynamic deformation of the other electrode during operation and thus enhance the uniformity of the dynamic electrode gap during operation. Methods for fabricating the micro-electro-mechanical transducer are also disclosed The methods may be used in both conventional membrane-based cMUTs and cMUTs having embedded springs transportion a rigid top plate.
摘要:
A micro-electro-mechanical transducer (such as a cMUT) that has a movable mechanical part to transform energy. The transducer (511) has a substrate (501), a top plate (540), and a resilient structure (520) therebetween. The resilient structure has multiple connectors (530) distributed over the device element area to vertically transport the top player with distributed support not limited to edges. The resilient structure (520) may be cantilevers, or cantilever-containing structures such as bridges or crossbars, formed using a middle spring layer coveting cavities on the substrate. Connectors (530) define a transducing space below the top plate (540). The resilient structure (520) such as cantilevers enable a vertical displacement of the connectors, which transports the top plate (540) in a piston-like motion to change the transducing space and to effectuate energy transformation. No separate cells are necessary for each addressable transducer element. Multiple device elements can be made on the same substrate.
摘要:
An electrostatic actuator/transducer has a comb driver and can be adapted for a variety of applications, particularly as a capacitive micromachined ultrasonic transducer. The comb driver has two electrodes each connected to a set of comb fingers. The two sets of comb fingers interdigitate with each other, and in one embodiment each has a saw-toothed shape. One electrode is connected to a spring structure and movable along a vertical direction to engage and disengage the two sets of comb fingers. The movable portion is adapted to perform an actuation function and/or a sense of function. Fabrication methods for making the electrostatic actuator/transducer are also disclosed.