公开(公告)号：WO1983002487A1

公开(公告)日：1983-07-21

申请号：PCT/AU1982000223

申请日：1982-12-23

Applicant: LEWIS, Elliott, Jameson

IPC: F16K01/36

CPC classification number: F16K1/36

Abstract: A jumper valve (17, 33) for a faucet (10) has a valve stem (23, 24) and a valve disc (24, 35). A valve washer (27, 35) is fitted to, or formed integrally with, the valve disc (24, 35) and has an annular face (30, 36) to engage a valve seat (22), surrounding a substantially frusto-conical or hemi-spherical portion (28, 37) which engages the wall of the bore (21) through the valve seat assembly (16) of the faucet (10). The junction (31, 38) of the annular face (30, 36) and the frusto-conical or hemi-spherical portion (28, 37) engages the junction (32) of the annular seat (22) and bore (21) of the valve seat assembly (16). The jumper valve (17, 33) provides at least two zones of sealing contact between the jumper valve (17, 33) and the valve seat assembly (16) to prevent the faucet (10) from leaking or dripping.

Abstract translation: 用于水龙头（10）的跳针阀（17,33）具有阀杆（23,24）和阀盘（24,35）。 阀门垫圈（27,35）装配到阀盘（24,35）上或与其形成一体，并具有环形面（30,36）以与阀座（22）接合，围绕基本截头圆锥形 或半球形部分（28,37），其通过孔（20）的阀座组件（16）接合孔（21）的壁。 环形面（30,36）的接头（31,38）和截头圆锥形或半球形部分（28,37）接合环形座（22）的接合部（32）和孔（21）的孔 阀座组件（16）。 跳线阀（17,33）提供至少两个跨接阀（17,33）和阀座组件（16）之间的密封接触区域，以防止水龙头（10）泄漏或滴落。

公开(公告)号：WO1997005757A1

公开(公告)日：1997-02-13

申请号：PCT/US1996012574

申请日：1996-07-31

Applicant: CRYSTALLINE MATERIALS CORPORATION ,  LEWIS, Elliott ,  KOBA, Richard ,  WOODIN, Richard, L.

Inventor： CRYSTALLINE MATERIALS CORPORATION

IPC: H05K03/02

CPC classification number: C23C16/276 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/4803 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: The present invention pertains to the packaging of electronic circuit. More particularly, the present invention pertains to methods for adherently bonding metals (4) to diamond (1) (i.e. the formation of a metal-diamond bonded structure) to yield metal-diamond substrates which are suitable for use in the fabrication of electronic packaging. These metal-diamond substrates exhibit both high thermal conductivity and dielectric isolation (where necessary), while being compatible with electronic package fabrication and the attachment of most semiconductor devices. The methods of the present invention include the formation of adherently bonded metal (5) by: the metallization of a bare diamond surface by the deposition of base coat or primer coat comprising certain carbide-forming metals such as molybdenum and tungsten; the metalization of a bare diamond surface using an active braze alloy; and by the growth of a diamond layer on a carbide-forming substrate by chemical vapor deposition (CVD).

Abstract translation: 本发明涉及电子电路的封装。 更具体地说，本发明涉及将金属（4）与金刚石（1）粘合地结合（即，形成金属 - 金刚石键合结构）以产生适合用于制造电子封装的金属 - 金刚石基底的方法 。 这些金属 - 金刚石基底表现出高导热性和介电隔离（必要时），同时兼容电子封装制造和大多数半导体器件的连接。 本发明的方法包括：通过以下方式形成粘合的金属（5）：通过沉积包含某些碳化物形成金属如钼和钨的底涂层或底漆涂层对裸金刚石表面进行金属化; 使用活性钎焊合金对裸钻石表面进行金属化; 以及通过化学气相沉积（CVD）在碳化物形成衬底上生长金刚石层。