公开(公告)号：WO2007047454A3

公开(公告)日：2008-01-17

申请号：PCT/US2006040123

申请日：2006-10-13

Applicant: APPLIED MATERIALS INC ,  LIU FENG Q ,  DU TIANBAO ,  DUBOUST ALAIN ,  HSU WEI-YUNG ,  ZHAO JUNZI ,  EWALD ROBERT A ,  TIAN YUAN A ,  JIA RENHE ,  WANG YOU ,  WANG ZHIHONG ,  DIAO JIE ,  MAO DAXIN ,  TSAI STAN D ,  KARUPPIAH LAKSH ,  CHEN LIANG-YUH

Inventor： LIU FENG Q ,  DU TIANBAO ,  DUBOUST ALAIN ,  HSU WEI-YUNG ,  ZHAO JUNZI ,  EWALD ROBERT A ,  TIAN YUAN A ,  JIA RENHE ,  WANG YOU ,  WANG ZHIHONG ,  DIAO JIE ,  MAO DAXIN ,  TSAI STAN D ,  KARUPPIAH LAKSH ,  CHEN LIANG-YUH

IPC: H01L21/461 ,  C09K13/00 ,  H01L21/31 ,  H01L21/469

CPC classification number: C25F3/02 ,  B23H5/08

Abstract: Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

Abstract translation: 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。

公开(公告)号：WO2007109501A3

公开(公告)日：2007-09-27

申请号：PCT/US2007/064056

申请日：2007-03-15

Applicant: APPLIED MATERIALS, INC. ,  DU, Tianbao ,  LIU, Feng Q. ,  DUBOUST, Alain ,  SALAS-VERNIS, Jose ,  HSU, Wei-yung ,  ECONOMIKOS, Laertis ,  SAKAMOTO, Akihisa

Inventor： DU, Tianbao ,  LIU, Feng Q. ,  DUBOUST, Alain ,  SALAS-VERNIS, Jose ,  HSU, Wei-yung ,  ECONOMIKOS, Laertis ,  SAKAMOTO, Akihisa

IPC: C11D1/00

Abstract: A composition for rinsing a substrate including deionized water, one or more carboxylate acid containing compounds, one or more surfactants, and one or more corrosion inhibitors and a method of using the same is provided. Also a method for rinsing a substrate between exposure to platens including moving the substrate from a first platen to a second platen and exposing the substrate to a rinse solution comprising one or more carboxylate acid containing compounds, one or more surfactants, and one or more corrosion inhibitors.

公开(公告)号：WO2007047454A2

公开(公告)日：2007-04-26

申请号：PCT/US2006/040123

申请日：2006-10-13

Applicant: APPLIED MATERIALS, INC. ,  LIU, Feng Q. ,  DU, Tianbao ,  DUBOUST, Alain ,  HSU, Wei-Yung ,  ZHAO, Junzi ,  EWALD, Robert A. ,  TIAN, Yuan A. ,  JIA, Renhe ,  WANG, You ,  WANG, Zhihong ,  DIAO, Jie ,  MAO, Daxin ,  TSAI, Stan D. ,  KARUPPIAH, Laksh ,  CHEN, Liang-Yuh

Inventor： LIU, Feng Q. ,  DU, Tianbao ,  DUBOUST, Alain ,  HSU, Wei-Yung ,  ZHAO, Junzi ,  EWALD, Robert A. ,  TIAN, Yuan A. ,  JIA, Renhe ,  WANG, You ,  WANG, Zhihong ,  DIAO, Jie ,  MAO, Daxin ,  TSAI, Stan D. ,  KARUPPIAH, Laksh ,  CHEN, Liang-Yuh

IPC: C09K13/00 ,  B23H9/00 ,  C25F3/00 ,  C09K13/06

CPC classification number: C25F3/02 ,  B23H5/08

Abstract: Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

Abstract translation: 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。

公开(公告)号：WO2007019279A2

公开(公告)日：2007-02-15

申请号：PCT/US2006/030381

申请日：2006-08-03

Applicant: APPLIED MATERIALS, INC. ,  LIU, Feng, Q. ,  DU, Tianbao ,  DUBOUST, Alain ,  WANG, Yan ,  HU, Yongqi ,  TSAI, Stan, D. ,  CHEN, Liang-Yuh ,  TU, Wen-Chiang ,  HSU, Wei-Yung

Inventor： LIU, Feng, Q. ,  DU, Tianbao ,  DUBOUST, Alain ,  WANG, Yan ,  HU, Yongqi ,  TSAI, Stan, D. ,  CHEN, Liang-Yuh ,  TU, Wen-Chiang ,  HSU, Wei-Yung

IPC: B23H5/00

CPC classification number: B23H5/08 ,  B24B37/042 ,  C25F3/02 ,  H01L21/32125 ,  H01L21/6875 ,  H01L21/7684

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.

Abstract translation: 提供抛光组合物和从基底表面除去导电材料的方法。 在一个方面中，提供了一种用于以比通过电化学机械抛光技术在布置在基板中形成的宽特征定义上的导电材料更高的移除速率处理基板以去除设置在基板中形成的窄特征定义上的导电材料的方法，以及 然后用至少一种化学机械抛光技术抛光基片。

公开(公告)号：WO2006014728A1

公开(公告)日：2006-02-09

申请号：PCT/US2005/025733

申请日：2005-07-19

Applicant: APPLIED MATERIALS, INC. ,  ZHANG, Hanzhong ,  LIU, Feng, Q. ,  TSAI, Stan, D. ,  MAVLIEV, Rashid ,  OLGADO, Donald ,  CHEN, Liang-Yuh

Inventor： ZHANG, Hanzhong ,  LIU, Feng, Q. ,  TSAI, Stan, D. ,  MAVLIEV, Rashid ,  OLGADO, Donald ,  CHEN, Liang-Yuh

IPC: B24B37/04

CPC classification number: B24B37/04 ,  B24B57/02

Abstract: A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.

Abstract translation: 对基板研磨装置和方法进行说明。 基座包括至少一个可移动的压板以接合抛光垫。 在抛光操作期间，至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。 抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。 抛光溶液保持机构附接到基座或承载头组件中的一个。 保持机构接合抛光垫的顶表面，并且在抛光操作期间将抛光液基本保持在抛光区域内。 一些实施方案可以减少抛光溶液消耗并允许增加的角速度。

公开(公告)号：WO2005075711A1

公开(公告)日：2005-08-18

申请号：PCT/US2004/043516

申请日：2004-12-27

Applicant: APPLIED MATERIALS, INC. ,  LIU, Feng Q. ,  TSAI, Stan D. ,  WOHLERT, Martin S. ,  TIAN, Yuan A. ,  JIA, Renhe ,  HU, Yongqi ,  CHEN, Liang-Yuh

Inventor： LIU, Feng Q. ,  TSAI, Stan D. ,  WOHLERT, Martin S. ,  TIAN, Yuan A. ,  JIA, Renhe ,  HU, Yongqi ,  CHEN, Liang-Yuh

IPC: C25F3/26

CPC classification number: H01L21/7684 ,  C25F3/16 ,  C25F3/26 ,  H01L21/32125

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a conductive material from a substrate surface including sulfuric acid or derivative, phosphoric acid or derivative, a first chelating agent including an organic salt, a pH adjusting agent to provide a pH between about 2 and about 10 and a solvent. The composition may further include a second chelating agent. The composition may be used in a single step or two step electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as tungsten, with a reduction in planarization type defects.

Abstract translation: 提供了抛光组合物和从衬底表面去除导电材料的方法。 一方面，提供一种组合物，用于从包括硫酸或衍生物，磷酸或衍生物的底物表面至少去除导电材料，包括有机盐的第一螯合剂，pH调节剂，以提供约2 约10和溶剂。 组合物还可以包括第二螯合剂。 组合物可以用于单步或两步电化学机械平面化工艺。 本文所述的抛光组合物和方法提高了材料从衬底表面（例如钨）的有效去除速率，同时平坦化型缺陷的减少。

公开(公告)号：WO2007095421A3

公开(公告)日：2007-08-23

申请号：PCT/US2007/061401

申请日：2007-01-31

Applicant: APPLIED MATERIALS, INC. ,  DU, Tianbo ,  LIU, Feng, Q. ,  DUBOUST, Alain ,  HSU, Wei-yung ,  CHEN, Liang-yuh

Inventor： DU, Tianbo ,  LIU, Feng, Q. ,  DUBOUST, Alain ,  HSU, Wei-yung ,  CHEN, Liang-yuh

IPC: H01L21/00 ,  B01J19/12

Abstract: Methods are provided for removing conductive materials from a substrate surface. In one aspect, a method includes providing a substrate comprising dielectric feature definitions formed between substrate field regions, a barrier material disposed in the feature definitions and on the substrate field regions, and a conductive material disposed on the barrier material, polishing the substrate to substantially remove a bulk portion of the conductive material with a direct current bias, and polishing the substrate to remove a residual portion of the conductive material with a pulse bias.

公开(公告)号：WO2006105150A2

公开(公告)日：2006-10-05

申请号：PCT/US2006/011387

申请日：2006-03-29

Applicant: APPLIED MATERIALS, INC. ,  WANG, Shi-Ping ,  WOHLERT, Martin S. ,  DUBOUST, Alain ,  JIA, Renhe ,  LIU, Feng Q. ,  TIAN, Yuan A. ,  CHEN, Liang-Yuh ,  TSAI, Stan D. ,  HSU, Wei-Yung

Inventor： WANG, Shi-Ping ,  WOHLERT, Martin S. ,  DUBOUST, Alain ,  JIA, Renhe ,  LIU, Feng Q. ,  TIAN, Yuan A. ,  CHEN, Liang-Yuh ,  TSAI, Stan D. ,  HSU, Wei-Yung

IPC: C03C15/00 ,  H01L21/302 ,  B44C1/22 ,  H01L21/461

CPC classification number: H01L21/3212 ,  C09G1/02 ,  C23F3/04 ,  C23F3/06 ,  H01L21/32125 ,  H01L21/7684

Abstract: Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. In one aspect, a full sequence electrochemical mechanical planarization technique is provided. In another aspect, a hybrid planarization technique using combination of at least one chemical mechanical polishing process and at least one electrochemical mechanical polishing process is provided. In addition, a multi-step polishing process for polishing a substrate surface using at least two oxidizers in one or more polishing composition is described. The polishing composition may be used in the full sequence or the hybrid planarization technique. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization defects.

Abstract translation: 提供了抛光组合物和从衬底表面去除导电材料和阻挡材料的方法。 一方面，提供了全序列电化学机械平面化技术。 在另一方面，提供了使用至少一种化学机械抛光工艺和至少一种电化学机械抛光工艺的组合的混合平面化技术。 此外，描述了在一种或多种研磨组合物中使用至少两种氧化剂来研磨衬底表面的多步抛光方法。 抛光组合物可以以全序或混合平面化技术使用。 本文所述的抛光组合物和方法改善了材料从衬底表面的有效去除速率，同时减小了平坦化缺陷。

公开(公告)号：WO2006014728B1

公开(公告)日：2006-03-23

申请号：PCT/US2005025733

申请日：2005-07-19

Applicant: APPLIED MATERIALS INC ,  ZHANG HANZHONG ,  LIU FENG Q ,  TSAI STAN D ,  MAVLIEV RASHID ,  OLGADO DONALD ,  CHEN LIANG-YUH

Inventor： ZHANG HANZHONG ,  LIU FENG Q ,  TSAI STAN D ,  MAVLIEV RASHID ,  OLGADO DONALD ,  CHEN LIANG-YUH

IPC: B24B37/04 ,  B24B57/02

CPC classification number: B24B37/04 ,  B24B57/02

Abstract: A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.

Abstract translation: 描述了一种基底抛光设备和方法。 基座包括至少一个可移动的台板以接合抛光垫。 在抛光操作期间，至少一个承载头组件将衬底基本上在抛光区域内压靠在抛光垫上。 抛光溶液分配器在抛光操作期间基本在抛光区域内将抛光溶液施加到抛光垫。 抛光溶液保持机构连接到基座或承载头组件之一上。 保持机构接合抛光垫的顶表面并且在抛光操作期间将抛光溶液基本保持在抛光区域内。 一些实施可以减少抛光溶液消耗并允许增加角速度。

公开(公告)号：WO2005061177A1

公开(公告)日：2005-07-07

申请号：PCT/US2004/037870

申请日：2004-11-12

Applicant: APPLIED MATERIALS, INC. ,  HU, Yongqi ,  TSAI, Stan D. ,  WANG, Yan ,  LIU, Feng Q. ,  CHANG, Shou-Sung ,  CHEN, Liang-Yuh

Inventor： HU, Yongqi ,  TSAI, Stan D. ,  WANG, Yan ,  LIU, Feng Q. ,  CHANG, Shou-Sung ,  CHEN, Liang-Yuh

IPC: B24B37/04

CPC classification number: B24B37/26 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/042 ,  B24B37/046 ,  B24B37/22 ,  B24B37/24 ,  B24B49/16 ,  B24B53/017 ,  C25D17/14 ,  H01L21/32125

Abstract: Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.

Abstract translation: 提供了用于处理衬底的处理衬垫组件的实施例。 处理垫组件包括具有处理表面的上层和具有联接到上层的顶侧和与顶侧相对的底侧的电极。 通过上层形成第一组孔，用于将电极暴露于处理表面。 通过上层和电极形成至少一个孔。