WAFER FURNACE WITH VARIABLE FLOW GAS JETS
    4.
    发明申请
    WAFER FURNACE WITH VARIABLE FLOW GAS JETS 审中-公开
    具有可变流量气体喷射器的波炉

    公开(公告)号:WO2012116202A2

    公开(公告)日:2012-08-30

    申请号:PCT/US2012026352

    申请日:2012-02-23

    CPC classification number: C30B15/007 C30B15/005 C30B29/06

    Abstract: A method of forming a sheet wafer 1) passes at least two filaments through a molten material to produce a partially formed sheet wafer, 2) directs a cooling fluid at a flow rate toward the partially formed sheet wafer to convectively cool a given portion of the partially formed sheet wafer, and 3) monitors the thickness of the given portion of the partially formed sheet wafer. To ensure appropriate thicknesses of the wafer, the method controls the flow rate of the cooling fluid as a function of the thickness of the given portion of the partially formed sheet wafer.

    Abstract translation: 一种形成片状晶片的方法1)使至少两根细丝通过熔融材料,以产生部分成形的片状晶片,2)以朝向部分成形片状晶片的流速引导冷却流体对流地冷却 部分形成的片状晶片,以及3)监视部分成形的片状晶片的给定部分的厚度。 为了确保晶片的适当厚度,该方法控制冷却流体的流量作为部分成形的薄片晶片的给定部分的厚度的函数。

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