NONWOVEN POLISHING PADS FOR CHEMICAL MECHANICAL POLISHING
    1.
    发明申请
    NONWOVEN POLISHING PADS FOR CHEMICAL MECHANICAL POLISHING 审中-公开
    非金属抛光垫用于化学机械抛光

    公开(公告)号:WO2007016498A2

    公开(公告)日:2007-02-08

    申请号:PCT/US2006/029770

    申请日:2006-08-01

    CPC classification number: B24B37/205 B24B37/24 B24D18/00

    Abstract: A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with an absorptive property that maintains the slurry chemistry and particles near the surface for effective polishing.

    Abstract translation: 抛光制品及其用作各种基材的抛光制品,特别是用于抛光半导体晶片。 该制品由可分离的混合纤维网和将纤维保持在网中的粘合剂材料组成。 纤维和粘合剂材料为抛光垫提供吸收性能,其将浆料化学和颗粒保持在表面附近以进行有效的抛光。

    NONWOVEN POLISHING PADS FOR CHEMICAL MECHANICAL POLISHING
    2.
    发明申请
    NONWOVEN POLISHING PADS FOR CHEMICAL MECHANICAL POLISHING 审中-公开
    非金属抛光垫用于化学机械抛光

    公开(公告)号:WO2007016498A3

    公开(公告)日:2009-05-28

    申请号:PCT/US2006029770

    申请日:2006-08-01

    CPC classification number: B24B37/205 B24B37/24 B24D18/00

    Abstract: A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with an absorptive property that maintains the slurry chemistry and particles near the surface for effective polishing.

    Abstract translation: 抛光制品及其用作各种基材的抛光制品,特别是用于抛光半导体晶片。 该制品由可分离的混合纤维网和将纤维保持在网中的粘合剂材料组成。 纤维和粘合剂材料为抛光垫提供吸收性能,其将浆料化学和颗粒保持在表面附近以进行有效的抛光。

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