PLASMA PROCESSING CHAMBER WITH DUAL AXIAL GAS INJECTION AND EXHAUST
    1.
    发明申请
    PLASMA PROCESSING CHAMBER WITH DUAL AXIAL GAS INJECTION AND EXHAUST 审中-公开
    具有双轴向气体注射和排气的等离子体处理室

    公开(公告)号:WO2012018448A3

    公开(公告)日:2012-04-05

    申请号:PCT/US2011041522

    申请日:2011-06-22

    Abstract: An electrode is exposed to a plasma generation volume and is defined to transmit radiofrequency power to the plasma generation volume, and includes an upper surface for holding a substrate in exposure to the plasma generation volume. A gas distribution unit is disposed above the plasma generation volume and in a substantially parallel orientation to the electrode. The gas distribution unit includes an arrangement of gas supply ports for directing an input flow of a plasma process gas into the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode. The gas distribution unit also includes an arrangement of through-holes that each extend through the gas distribution unit to fluidly connect the plasma generation volume to an exhaust region. Each of the through-holes directs an exhaust flow from the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode.

    Abstract translation: 电极暴露于等离子体产生体积并且被限定为将射频功率传输至等离子体产生体积,并且包括用于保持暴露于等离子体产生体积的基板的上表面。 气体分配单元设置在等离子体产生容积上方并且与电极基本平行地定向。 气体分配单元包括用于将等离子体处理气体的输入流在基本上垂直于电极的上表面的方向上引导到等离子体产生体积中的气体供给端口的布置。 气体分配单元还包括通孔布置,每个通孔延伸穿过气体分配单元以将等离子体生成体积流体连接到排气区域。 通孔中的每一个引导来自等离子体产生体积的排气流在基本上垂直于电极上表面的方向上。

    DUAL PLASMA VOLUME PROCESSING APPARATUS FOR NEUTRAL/ION FLUX CONTROL
    2.
    发明申请
    DUAL PLASMA VOLUME PROCESSING APPARATUS FOR NEUTRAL/ION FLUX CONTROL 审中-公开
    用于中性/离子通量控制的双等离子体积处理装置

    公开(公告)号:WO2012018449A3

    公开(公告)日:2012-04-12

    申请号:PCT/US2011041524

    申请日:2011-06-22

    Abstract: A semiconductor wafer processing apparatus includes a first electrode exposed to a first plasma generation volume, a second electrode exposed to a second plasma generation volume, and a gas distribution unit disposed between the first and second plasma generation volumes. The first electrode is defined to transmit radio frequency (RF) power to the first plasma generation volume, and distribute a first plasma process gas to the first plasma generation volume. The second electrode is defined to transmit RF power to the second plasma generation volume, and hold a substrate in exposure to the second plasma generation volume. The gas distribution unit includes an arrangement of through-holes defined to fluidly connect the first plasma generation volume to the second plasma generation volume. The gas distribution unit also includes an arrangement of gas supply ports defined to distribute a second plasma process gas to the second plasma generation volume.

    Abstract translation: 半导体晶片处理装置包括暴露于第一等离子体产生体积的第一电极,暴露于第二等离子体产生体积的第二电极和设置在第一和第二等离子体产生体积之间的气体分配单元。 第一电极被定义为将射频(RF)功率传送到第一等离子体产生体积,并且将第一等离子体处理气体分配到第一等离子体产生体积。 第二电极被定义为将RF功率传送到第二等离子体产生体积,并且保持衬底暴露于第二等离子体产生体积。 气体分配单元包括限定为将第一等离子体产生体积流体连接到第二等离子体产生体积的通孔的布置。 气体分配单元还包括被定义为将第二等离子体处理气体分配到第二等离子体产生体积的气体供给端口的布置。

    DUAL PLASMA VOLUME PROCESSING APPARATUS FOR NEUTRAL/ION FLUX CONTROL
    3.
    发明申请
    DUAL PLASMA VOLUME PROCESSING APPARATUS FOR NEUTRAL/ION FLUX CONTROL 审中-公开
    用于中性/离子流量控制的双等离子体处理装置

    公开(公告)号:WO2012018449A2

    公开(公告)日:2012-02-09

    申请号:PCT/US2011/041524

    申请日:2011-06-22

    Abstract: A semiconductor wafer processing apparatus includes a first electrode exposed to a first plasma generation volume, a second electrode exposed to a second plasma generation volume, and a gas distribution unit disposed between the first and second plasma generation volumes. The first electrode is defined to transmit radio frequency (RF) power to the first plasma generation volume, and distribute a first plasma process gas to the first plasma generation volume. The second electrode is defined to transmit RF power to the second plasma generation volume, and hold a substrate in exposure to the second plasma generation volume. The gas distribution unit includes an arrangement of through-holes defined to fluidly connect the first plasma generation volume to the second plasma generation volume. The gas distribution unit also includes an arrangement of gas supply ports defined to distribute a second plasma process gas to the second plasma generation volume.

    Abstract translation: 半导体晶片处理设备包括暴露于第一等离子体产生体积的第一电极,暴露于第二等离子体产生体积的第二电极以及布置在第一和第二等离子体产生体积之间的气体分配单元 。 第一电极被定义为将射频(RF)功率发射到第一等离子体产生体积,并且将第一等离子体过程气体分配到第一等离子体产生体积。 第二电极被限定为将RF功率传输到第二等离子体产生体积,并且保持衬底暴露于第二等离子体产生体积。 气体分配单元包括被限定为将第一等离子体生成体积流体连接到第二等离子体生成体积的通孔的布置。 气体分配单元还包括气体供应端口的布置,其被限定为将第二等离子体处理气体分配到第二等离子体生成体积。

    PLASMA PROCESSING CHAMBER WITH DUAL AXIAL GAS INJECTION AND EXHAUST
    4.
    发明申请
    PLASMA PROCESSING CHAMBER WITH DUAL AXIAL GAS INJECTION AND EXHAUST 审中-公开
    具有双轴向气体注射和排气的等离子体加工室

    公开(公告)号:WO2012018448A2

    公开(公告)日:2012-02-09

    申请号:PCT/US2011/041522

    申请日:2011-06-22

    Abstract: An electrode is exposed to a plasma generation volume and is defined to transmit radiofrequency power to the plasma generation volume, and includes an upper surface for holding a substrate in exposure to the plasma generation volume. A gas distribution unit is disposed above the plasma generation volume and in a substantially parallel orientation to the electrode. The gas distribution unit includes an arrangement of gas supply ports for directing an input flow of a plasma process gas into the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode. The gas distribution unit also includes an arrangement of through-holes that each extend through the gas distribution unit to fluidly connect the plasma generation volume to an exhaust region. Each of the through-holes directs an exhaust flow from the plasma generation volume in a direction substantially perpendicular to the upper surface of the electrode.

    Abstract translation: 电极暴露于等离子体产生体积,并且被定义为将射频功率传递到等离子体产生体积,并且包括用于保持衬底暴露于等离子体产生体积的上表面。 气体分布单元设置在等离子体产生体积之上并且基本上平行于电极的取向。 气体分配单元包括用于将等离子体处理气体的输入流在基本上垂直于电极的上表面的方向引导到等离子体产生体积中的气体供给端口的布置。 气体分配单元还包括通孔的布置,其各自延伸穿过气体分配单元以将等离子体产生体积流体连接到排气区域。 每个通孔在基本上垂直于电极的上表面的方向上引导来自等离子体产生体积的排气流。

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