Abstract:
Embodiments of the present disclosure generally relate to a process chamber for conformal oxidation of high aspect ratio structures. The process chamber includes a liner assembly located in a first side of a chamber body and two pumping ports located in a substrate support portion adjacent a second side of the chamber body opposite the first side. The liner assembly includes a flow divider to direct fluid flow away from a center of a substrate disposed in a processing region of the process chamber. The liner assembly may be fabricated from quartz minimize interaction with process gases, such as radicals. The liner assembly is designed to reduce flow constriction of the radicals, leading to increased radical concentration and flux. The two pumping ports can be individually controlled to tune the flow of the radicals through the processing region of the process chamber.
Abstract:
본 발명은 DNA-기반 전도성 나노선을 이용한 바이오 센서 및 이의 제조방법에 관한 것으로, 보다 상세하게는 자발적으로 양전하를 띠는 전도성 나노입자의 코팅에 의해 형성되는 DNA 기반 전도성 나노선과 상기 DNA 기반 전도성 나노선과 정전기적 인력에 의해 결합하는 단백질 검출 수용체를 포함하여 고감도로 질병 여부를 판단할 수 있는 DNA-기반 전도성 나노선을 이용한 바이오 센서 및 이의 제조방법에 관한 것이다. 본 발명에 따른 DNA-기반 전도성 나노선을 이용한 바이오 센서는 기판상에 DNA를 선택적으로 정렬하는 DNA 정렬단계(S100)와, 정렬된 DNA 상에 양전하로 대전된 전도성 나노입자를 결합시켜 자발적 양전하를 띠는 DNA 기반 전도성 나노선을 제작하는 DNA 기반 전도성 나노선 제조단계(S200)와, 상기 DNA 기반 전도성 나노선에 단백질 검출을 위한 수용체를 고정하는 단백질 검출 수용체 고정단계(S300)를 포함하는 제조방법에 의해 제조되는 것을 특징으로 한다.
Abstract:
The invention relates to an apparatus (1) for applying a deposition onto a substrate (2) by a deposition process, wherein the apparatus (1) comprises a first vacuum chamber (3) which can be evacuated by means of a first evacuation pump (4). To improve the deposition process the invention is characterized in that a second vacuum chamber (5) for receiving the substrate (2) is arranged within the first vacuum chamber (3). Furthermore, the invention relates to a method for carrying out a deposition process for applying a deposition onto a substrate by use of such an apparatus.
Abstract:
The present techniques generally relate to an improved CEM switching device (350) and methods for its manufacture. In this device, a conductive substrate (370) and/or conductive overlay (380) each comprises a primary layer (370a, 380a) of a conductive material and a secondary layer (370b, 380b) of a conductive material. The primary layer (370a, 380a) contacting the CEM layer (360) is substantially inert to the CEM layer and/or acts an oxygen barrier for the secondary layer at temperatures used for the manufacture of the device.
Abstract:
Described herein are techniques for forming an epitaxial III-V layer on a substrate. In a pre-clean chamber, a native oxygen layer may be replaced with a passivation layer bytreating the substrate with a hydrogen plasma (or products of a plasma decomposition). In a deposition chamber, the temperature of the substrate may beelevated to a temperature less than 700°C. While the substrate temperature is elevated, a group V precursor may beflowed into the deposition chamber in order to transform the hydrogen terminated (Si-H) surface of the passivation layer into an Arsenic terminated (Si-As) surface. After the substrate has been cooled, a group III precursor and the group V precursor may beflowed in order to form a nucleation layer. Finally, at an elevated temperature, the group III precursor and group V precursor may beflowed in order to form a bulk III-V layer.
Abstract:
Techniques herein include systems and methods for fine control of temperature distribution across a substrate. Such techniques can be used to provide uniform spatial temperature distribution, or a biased spatial temperature distribution to improve plasma processing of substrates and/or correct characteristics of a given substrate. Embodiments include a plasma processing system with temperature control. Temperature control systems herein include a primary heating mechanism to heat a substrate, and a secondary heating mechanism that precisely modifies spatial temperature distribution across a substrate being processed. At least one heating mechanism includes a digital projection system configured to project a pattern of electromagnetic radiation onto or into a substrate, or through the substrate and onto a substrate support assembly. The digital projection system is configured to spatially and dynamically adjust the pattern of electromagnetic radiation and selectively augment heating of the substrate by each projected point location.
Abstract:
Plasma source assembly (1) within a plasma enhanced chemical vapor deposition (PECVD) device and method of providing a flow of particles to a substrate. A plasma treatment outlet of a housing (8) forms a plasma process zone for depositing a layer on the surface (2) by relative movement of the surface (2) along the plasma treatment outlet. The housing (8) hasan upstream elongated edge (6) and a downstream elongated edge (7). A plasma creation zone (3) is present within the housing (8), as well as one or more input ports (9-11) positioned in the plasma process zone for providing a process gas to the plasma creation zone (3). The plasma source assembly (1) is further arranged to provide a gradient in the concentration of particles in the flow as measured from the upstream elongated edge(6) to the downstream elongated edge (7).
Abstract:
Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.