Abstract:
The invention is related to thermal imageable dielectric layers and thermal transfer donors and receivers comprising dielectric layers. The thermal transfer donors are useful in making electronic devices by thermal transfer of dielectric layers having excellent resistivity, good transfer properties and good adhesion to a variety of receivers.
Abstract:
Ethylene and allyl- or vinylsilanes are efficiently copolymerized by certain late transition metal complexes containing selected bidentate or tridentate ligands. The resulting novel polymers may be crosslinked by moisture when vinylsilane contains groups bound to silicon which are hydrolyzable. The polymers are useful for wire coating, crosslinked foams, pipes, and other uses.
Abstract:
Polyolefins with unique highly branched structures, and which have unusually low Mark-Houwink constants are described. They are useful for instance as elastomers, viscosity index modifiers and lubricating oil bases.
Abstract:
This invention relates to a process for the synthesis of addition polymers containing branches upon branches and having a polymerizable olefin end group by a convenient one-pot copolymerization of selected vinyl monomers with chain polymerization initiators and a method to provide olefin end groups by chain transfer or termination agents; and polymers produced thereby.
Abstract:
The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.
Abstract:
This invention relates to the preparation of polyamide block copolymers by sequential monomer addition. More particularly, it relates to catalysts capable of copolymerizing not only cyclic amides, but other monomers such as cyclic esters and epoxides as well, using sequential addition so as to produce useful and novel block copolymers.
Abstract:
The invention is related to thermal imageable dielectric layers and thermal transfer donors and receivers comprising dielectric layers. The thermal transfer donors are useful in making electronic devices by thermal transfer of dielectric layers having excellent resistivity, good transfer properties and good adhesion to a variety of receivers.
Abstract:
The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.
Abstract:
This invention relates to the preparation of polyamide block copolymers by sequential monomer addition. More particularly, it relates to catalysts capable of copolymerizing not only cyclic amides, but other monomers such as cyclic esters and epoxides as well, using sequential addition so as to produce useful and novel block copolymers.
Abstract:
Ethylene and allyl- or vinylsilanes are efficiently copolymerized by certain late transition metal complexes containing selected bidentate or tridentate ligands. The resulting novel polymers may be crosslinked by moisture when vinylsilane contains groups bound to silicon which are hydrolyzable. The polymers are useful for wire coating, crosslinked foams, pipes, and other uses.