公开(公告)号：WO2009055515A1

公开(公告)日：2009-04-30

申请号：PCT/US2008/080851

申请日：2008-10-23

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  GAO, Feng ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  KEYS, Dalen, E. ,  MALAJOVICH, Irina ,  SCHIFFINO, Rinaldo, Soria ,  ZUMSTEG, Fredrick, Claus, JR.

Inventor： GAO, Feng ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  KEYS, Dalen, E. ,  MALAJOVICH, Irina ,  SCHIFFINO, Rinaldo, Soria ,  ZUMSTEG, Fredrick, Claus, JR.

IPC: B41M5/382 ,  B41M5/392 ,  H05K9/00

CPC classification number: B41M5/38207 ,  B41M5/38214 ,  B41M5/392 ,  H05K3/046 ,  H05K3/182 ,  H05K3/207 ,  H05K9/0094 ,  H05K2201/0209 ,  H05K2203/0528 ,  H05K2203/107 ,  Y10T428/24802

Abstract: Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.

Abstract translation: 公开了一种用于制造具有高导电性的金属图案的方法，包括通过热成像方法在基底基板上提供包含图案化催化剂层的图案化衬底，接着进行电镀以提供金属图案。 所提供的金属图案适用于包括电磁干扰屏蔽装置和触摸板传感器的电气装置。

公开(公告)号：WO2008010983A3

公开(公告)日：2008-01-24

申请号：PCT/US2007/016119

申请日：2007-07-16

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  BAILEY, Richard, Kevin ,  BLANCHET, Graciela, Beatriz ,  CATRON, John, W. ,  CHESTERFIELD, Reid, John ,  GAO, Feng ,  GLICKSMAN, Howard, David ,  GOLDFINGER, Marc, B. ,  JAYCOX, Gary, Delmar ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  MALAJOVICH, Irina ,  MENG, Hong ,  METH, Jeffrey, Scott ,  NUNES, Geoffrey ,  O'NEIL, Gerard ,  SHARP, Kenneth, George ,  TASSI, Nancy, G.

Inventor： BAILEY, Richard, Kevin ,  BLANCHET, Graciela, Beatriz ,  CATRON, John, W. ,  CHESTERFIELD, Reid, John ,  GAO, Feng ,  GLICKSMAN, Howard, David ,  GOLDFINGER, Marc, B. ,  JAYCOX, Gary, Delmar ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  MALAJOVICH, Irina ,  MENG, Hong ,  METH, Jeffrey, Scott ,  NUNES, Geoffrey ,  O'NEIL, Gerard ,  SHARP, Kenneth, George ,  TASSI, Nancy, G.

IPC: H01L51/10

Abstract: The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

公开(公告)号：WO2008010981A2

公开(公告)日：2008-01-24

申请号：PCT/US2007016117

申请日：2007-07-16

Applicant: DU PONT ,  ANDREWS GERALD D ,  BAILEY RICHARD KEVIN ,  BLANCHET GRACIELA BEATRIZ ,  CATRON JOHN W ,  GAO FENG ,  JAYCOX GARY DELMAR ,  JOHNSON LYNDA KAYE ,  KEUSSEYAN ROUPEN LEON ,  METH JEFFREY SCOTT ,  PRINCIPE FRANK S ,  SCHIFFINO RINALDO S ,  YOHANNAN ROBERT MAR

Inventor： ANDREWS GERALD D ,  BAILEY RICHARD KEVIN ,  BLANCHET GRACIELA BEATRIZ ,  CATRON JOHN W ,  GAO FENG ,  JAYCOX GARY DELMAR ,  JOHNSON LYNDA KAYE ,  KEUSSEYAN ROUPEN LEON ,  METH JEFFREY SCOTT ,  PRINCIPE FRANK S ,  SCHIFFINO RINALDO S ,  YOHANNAN ROBERT MAR

IPC: G03F7/20 ,  G03F7/34

CPC classification number: B41M5/38207 ,  B41M5/38214 ,  H01L51/0013 ,  H01L51/0052 ,  H01L51/0068 ,  H01L51/052 ,  H01L51/0545 ,  H05K3/046 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/0191 ,  H05K2203/0528 ,  H05K2203/107

Abstract: Provided are processes for improving a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.

Abstract translation: 提供了用于改善成像的热转印接收器上的热转印图案的方法，其中成像的热转印接收器包括具有一个或多个热转印层的暴露部分和未曝光部分的表面，包括：（a ）使所述表面与粘合剂层接触接触期以提供层压体; （b）从所述层压体分离所述粘合剂层以提供经处理的热转印接收器，其具有基本上不含一个或多个热转移层的所述未曝光部分的表面。 这些方法在制造包括薄膜晶体管，电路，电磁干扰屏蔽，触摸板传感器和其它电子设备的电子器件中是有用的。

公开(公告)号：WO2009055517A1

公开(公告)日：2009-04-30

申请号：PCT/US2008/080855

申请日：2008-10-23

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  GAO, Feng ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  MALAJOVICH, Irina ,  METH, Jeffrey, Scott ,  SHARP, Kenneth, George ,  ZUMSTEG JR, Fredrick, Claus ,  AGRAWAL, Seema

Inventor： GAO, Feng ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  MALAJOVICH, Irina ,  METH, Jeffrey, Scott ,  SHARP, Kenneth, George ,  ZUMSTEG JR, Fredrick, Claus ,  AGRAWAL, Seema

IPC: H05K3/04 ,  H05K3/18 ,  H05K9/00 ,  B41M5/382 ,  B41M5/392

CPC classification number: B41M5/38207 ,  B41M5/392 ,  H05K3/046 ,  H05K3/182 ,  H05K3/185 ,  H05K2203/0528 ,  H05K2203/107 ,  H05K2203/1105

Abstract: Disclosed is a method negative imaging method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.

Abstract translation: 公开了一种用于制造具有高导电性的金属图案的方法负成像方法，包括通过热成像方法在基底板上提供包含图案化催化剂层的图案化衬底，接着进行电镀以提供金属图案。 所提供的金属图案适用于包括电磁干扰屏蔽装置和触摸板传感器的电气装置。

公开(公告)号：WO2008091285A2

公开(公告)日：2008-07-31

申请号：PCT/US2007/016120

申请日：2007-07-16

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  ANDREWS, Gerald, Donald ,  BAILEY, Richard, Kevin ,  BLANCHET, Graciela, Beatriz ,  CASPAR, Jonathan, V. ,  CATRON, John, W. ,  CHESTERFIELD, Reid, John ,  FELDER, Thomas, C. ,  GAO, Feng ,  GLICKSMAN, Howard, David ,  GOLDFINGER, Marc, B. ,  HARMER, Mark, Andrew ,  JAYCOX, Gary, Delmar ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  KEYS, Dalen, E. ,  MALAJOVICH, Irina ,  MARSHALL, William, J. ,  MCCORD, Elizabeth, Forrester ,  MCEWEN, Charles, Nehemiah ,  METH, Jeffrey, Scott ,  NUNES, Geoffrey ,  SCHIFFINO, Rinaldo, S. ,  SHANNON, Paul, J. ,  SHARP, Kenneth, George ,  TASSI, Nancy, G. ,  VISSCHER, Karyn, B.

Inventor： ANDREWS, Gerald, Donald ,  BAILEY, Richard, Kevin ,  BLANCHET, Graciela, Beatriz ,  CASPAR, Jonathan, V. ,  CATRON, John, W. ,  CHESTERFIELD, Reid, John ,  FELDER, Thomas, C. ,  GAO, Feng ,  GLICKSMAN, Howard, David ,  GOLDFINGER, Marc, B. ,  HARMER, Mark, Andrew ,  JAYCOX, Gary, Delmar ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  KEYS, Dalen, E. ,  MALAJOVICH, Irina ,  MARSHALL, William, J. ,  MCCORD, Elizabeth, Forrester ,  MCEWEN, Charles, Nehemiah ,  METH, Jeffrey, Scott ,  NUNES, Geoffrey ,  SCHIFFINO, Rinaldo, S. ,  SHANNON, Paul, J. ,  SHARP, Kenneth, George ,  TASSI, Nancy, G. ,  VISSCHER, Karyn, B.

IPC: H01L51/05 ,  H01L51/40 ,  H01L51/30

CPC classification number: H01L51/0013 ,  H01L51/0545 ,  H05K1/097 ,  H05K3/046 ,  H05K2203/0528 ,  H05K2203/107 ,  Y10T428/24901

Abstract: The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

Abstract translation: 本发明公开了将纳米颗粒层和载体层的相应近端部分以及可选地附加的转印层一起热转印图案化在热成像接收器上的方法。 本发明可用于干式制造电子器件。 本发明的另外的实施方案包括多层热成像供体，其以分层顺序包括：基膜，载体层和纳米粒子层。 载体层可以是电介质或导电层。 当载体层是介电层时，基膜包含染料或颜料形式的光衰减剂。

公开(公告)号：WO2008010983A2

公开(公告)日：2008-01-24

申请号：PCT/US2007016119

申请日：2007-07-16

Applicant: DU PONT ,  BAILEY RICHARD KEVIN ,  BLANCHET GRACIELA BEATRIZ ,  CATRON JOHN W ,  CHESTERFIELD REID JOHN ,  GAO FENG ,  GLICKSMAN HOWARD DAVID ,  GOLDFINGER MARC B ,  JAYCOX GARY DELMAR ,  JOHNSON LYNDA KAYE ,  KEUSSEYAN ROUPEN LEON ,  MALAJOVICH IRINA ,  MENG HONG ,  METH JEFFREY SCOTT ,  NUNES GEOFFREY ,  O'NEIL GERARD ,  SHARP KENNETH GEORGE ,  TASSI NANCY G

Inventor： BAILEY RICHARD KEVIN ,  BLANCHET GRACIELA BEATRIZ ,  CATRON JOHN W ,  CHESTERFIELD REID JOHN ,  GAO FENG ,  GLICKSMAN HOWARD DAVID ,  GOLDFINGER MARC B ,  JAYCOX GARY DELMAR ,  JOHNSON LYNDA KAYE ,  KEUSSEYAN ROUPEN LEON ,  MALAJOVICH IRINA ,  MENG HONG ,  METH JEFFREY SCOTT ,  NUNES GEOFFREY ,  O'NEIL GERARD ,  SHARP KENNETH GEORGE ,  TASSI NANCY G

IPC: H01L51/10

CPC classification number: H01L51/052 ,  H01L51/0013 ,  H01L51/0035 ,  H01L51/0052 ,  H01L51/0068 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/055 ,  H01L51/102

Abstract: The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

Abstract translation: 本发明涉及包含新型电介质层的薄膜晶体管和包含金属组合物的新型电极，所述金属组合物可通过干式热转印工艺来提供。

公开(公告)号：WO0203766A3

公开(公告)日：2002-04-04

申请号：PCT/US0120252

申请日：2001-06-26

Applicant: DU PONT ,  KEUSSEYAN ROUPEN LEON

Inventor： KEUSSEYAN ROUPEN LEON

IPC: H05K1/09 ,  G03F7/00 ,  G03F7/36 ,  H01B13/00 ,  H05K3/04 ,  H05K3/20 ,  G03F7/34

CPC classification number: H05K3/046 ,  G03F7/00 ,  G03F7/36 ,  H05K3/207 ,  H05K2203/0525 ,  H05K2203/0528

Abstract: A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer (104) is applied onto a substrate surface. The photosensitive layer (104) is imaged with a pattern (106) using actinic radiation, the exposed areas (107) of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet (101 on 102) will cause the thick film (101) to adhere to the remaining tacky areas (104). Upon peeling the sheet (102), a thick film print pattern (101) will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.

Abstract translation: 使用光敏聚合物层图案化厚膜电功能图案的工艺。 将粘性感光层（104）施加到基材表面上。 感光层（104）使用光化辐射用图案（106）成像，感光层的曝光区域（107）变硬并且非粘性。 随后应用厚膜组合物片（102在102上）将使厚膜（101）粘附到剩余的粘性区域（104）。 在剥离片材（102）时，将生产厚膜印刷图案（101）。 该步骤之后是由所使用的厚膜组合物规定的处理轮廓，其导致具有电功能性质的图案。 本发明还延伸到其中从使用的片材中回收厚膜组合物的方法。

公开(公告)号：WO2008091285A3

公开(公告)日：2008-12-24

申请号：PCT/US2007016120

申请日：2007-07-16

Applicant: DU PONT ,  ANDREWS GERALD DONALD ,  BAILEY RICHARD KEVIN ,  BLANCHET GRACIELA BEATRIZ ,  CASPAR JONATHAN V ,  CATRON JOHN W ,  CHESTERFIELD REID JOHN ,  FELDER THOMAS C ,  GAO FENG ,  GLICKSMAN HOWARD DAVID ,  GOLDFINGER MARC B ,  HARMER MARK ANDREW ,  JAYCOX GARY DELMAR ,  JOHNSON LYNDA KAYE ,  KEUSSEYAN ROUPEN LEON ,  KEYS DALEN E ,  MALAJOVICH IRINA ,  MARSHALL WILLIAM J ,  MCCORD ELIZABETH FORRESTER ,  MCEWEN CHARLES NEHEMIAH ,  METH JEFFREY SCOTT ,  NUNES GEOFFREY ,  SCHIFFINO RINALDO S ,  SHANNON PAUL J ,  SHARP KENNETH GEORGE ,  TASSI NANCY G ,  VISSCHER KARYN B

Inventor： ANDREWS GERALD DONALD ,  BAILEY RICHARD KEVIN ,  BLANCHET GRACIELA BEATRIZ ,  CASPAR JONATHAN V ,  CATRON JOHN W ,  CHESTERFIELD REID JOHN ,  FELDER THOMAS C ,  GAO FENG ,  GLICKSMAN HOWARD DAVID ,  GOLDFINGER MARC B ,  HARMER MARK ANDREW ,  JAYCOX GARY DELMAR ,  JOHNSON LYNDA KAYE ,  KEUSSEYAN ROUPEN LEON ,  KEYS DALEN E ,  MALAJOVICH IRINA ,  MARSHALL WILLIAM J ,  MCCORD ELIZABETH FORRESTER ,  MCEWEN CHARLES NEHEMIAH ,  METH JEFFREY SCOTT ,  NUNES GEOFFREY ,  SCHIFFINO RINALDO S ,  SHANNON PAUL J ,  SHARP KENNETH GEORGE ,  TASSI NANCY G ,  VISSCHER KARYN B

IPC: H01L51/00

CPC classification number: H01L51/0013 ,  H01L51/0545 ,  H05K1/097 ,  H05K3/046 ,  H05K2203/0528 ,  H05K2203/107 ,  Y10T428/24901

Abstract: The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

Abstract translation: 本发明公开了将纳米颗粒层和相应的载体层的近似部分以及任选地附加的转移层一起热图像化到热成像接收器上的方法。 本发明对于电子设备的干法制造是有用的。 本发明的另外的实施方案包括以分层顺序包括的多层热成像供体：基膜，载体层和纳米颗粒层。 载体层可以是介电层或导电层。 当载体层是介电层时，基膜包括染料或颜料形式的光衰减剂。

公开(公告)号：WO2008010978A3

公开(公告)日：2008-10-30

申请号：PCT/US2007016111

申请日：2007-07-16

Applicant: DU PONT ,  BAILEY RICHARD KEVIN ,  BLANCHET GRACIELA BEATRIZ ,  CASPAR JONATHAN V ,  CATRON JOHN W ,  CHESTERFIELD REID JOHN ,  FELDER THOMAS C ,  GAO FENG ,  JOHNSON LYNDA KAYE ,  KEUSSEYAN ROUPEN LEON ,  KEYS DALEN E ,  MALAJOVICH IRINA ,  METH JEFFREY SCOTT ,  NUNES GEOFFREY ,  O'NEIL GERARD ,  SCHIFFINO RINALDO S ,  TASSI NANCY G

Inventor： BAILEY RICHARD KEVIN ,  BLANCHET GRACIELA BEATRIZ ,  CASPAR JONATHAN V ,  CATRON JOHN W ,  CHESTERFIELD REID JOHN ,  FELDER THOMAS C ,  GAO FENG ,  JOHNSON LYNDA KAYE ,  KEUSSEYAN ROUPEN LEON ,  KEYS DALEN E ,  MALAJOVICH IRINA ,  METH JEFFREY SCOTT ,  NUNES GEOFFREY ,  O'NEIL GERARD ,  SCHIFFINO RINALDO S ,  TASSI NANCY G

IPC: H05K1/02 ,  B41M5/382 ,  C08K3/08 ,  G06F3/041 ,  G06F3/044 ,  H05K1/09 ,  H05K3/04 ,  H05K3/10 ,  H05K3/12

CPC classification number: B41M5/38207 ,  B41M3/006 ,  B41M5/385 ,  B41M5/395 ,  B41M5/41 ,  B41M5/44 ,  B41M5/465 ,  B41M2205/02 ,  B41M2205/38 ,  H01B1/22 ,  H01L51/0013 ,  H01L51/0035 ,  H01L51/0036 ,  H05K1/095 ,  H05K3/046 ,  H05K2201/0329 ,  H05K2203/0528 ,  H05K2203/107 ,  Y10T428/24893 ,  Y10T428/24909 ,  Y10T428/24917

Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract translation: 本发明提供了包含银组合物的金属组合物，以及用该组合物制备的热成像供体。 供体对于金属层的热转印图案化以及可选地附加转印层的相应的接近部分可用于热成像接收器是有用的。 该组合物可用于干式制造电子器件。 还提供了包含一个或多个基底膜和一个或多个图案化金属层（包括EMI屏蔽和触摸板传感器）的图案化多层组合物。

公开(公告)号：WO2008010981A3

公开(公告)日：2008-01-24

申请号：PCT/US2007/016117

申请日：2007-07-16

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY ,  ANDREWS, Gerald, D. ,  BAILEY, Richard, Kevin ,  BLANCHET, Graciela, Beatriz ,  CATRON, John, W. ,  GAO, Feng ,  JAYCOX, Gary, Delmar ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  METH, Jeffrey, Scott ,  PRINCIPE, Frank, S. ,  SCHIFFINO, Rinaldo, S. ,  YOHANNAN, Robert, Mar

Inventor： ANDREWS, Gerald, D. ,  BAILEY, Richard, Kevin ,  BLANCHET, Graciela, Beatriz ,  CATRON, John, W. ,  GAO, Feng ,  JAYCOX, Gary, Delmar ,  JOHNSON, Lynda, Kaye ,  KEUSSEYAN, Roupen, Leon ,  METH, Jeffrey, Scott ,  PRINCIPE, Frank, S. ,  SCHIFFINO, Rinaldo, S. ,  YOHANNAN, Robert, Mar

IPC: G03F7/34 ,  B41M5/382

Abstract: Provided are processes for improving a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.