公开(公告)号：WO2016100657A2

公开(公告)日：2016-06-23

申请号：PCT/US2015066362

申请日：2015-12-17

Applicant: GLO AB ,  GARDNER NATHAN F ,  KISH FREDRICK A JR ,  MODRIC MILJENKO ,  POKHRIYAL ANUSHA ,  THOMPSON DANIEL ,  DANESH FARIBA ,  GALLAGHER TIMOTHY

Inventor： GARDNER NATHAN F ,  KISH FREDRICK A JR ,  MODRIC MILJENKO ,  POKHRIYAL ANUSHA ,  THOMPSON DANIEL ,  DANESH FARIBA ,  GALLAGHER TIMOTHY

IPC: H05B37/00 ,  H01L33/00 ,  H05B33/14

CPC classification number: H01L25/0753 ,  H01L27/156 ,  H01L33/0095 ,  H01L33/62 ,  H01L2224/81 ,  H01L2224/81001 ,  H01L2224/95

Abstract: A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate. Additional devices on each additional transfer substrate can be bonded to additional conductive bonding structures on the backplane employing the same method provided that the additional devices are not present in positions that would overlap with pre-existing first light emitting devices or devices on the backplane at a bonding position.

Abstract translation: 提供了可选地具有阶梯式水平表面和任选地嵌入金属互连结构的背板。 第一导电接合结构形成在第一台阶水平表面上。 第一转印衬底上的第一发光器件设置在第一导电接合结构上，并且第一发光器件的第一子集结合到第一导电接合结构。 可以使用激光照射来选择性地将第一发光器件的第一子集与第一转移衬底分离，而第一发光器件的第二子集保持附着到第一转移衬底。 每个附加传输基板上的附加设备可以使用相同的方法与背板上的附加导电接合结构结合，只要附加设备不存在于与先前存在的第一发光设备或背板上的设备重叠的位置 粘接位置。

公开(公告)号：WO2016100657A3

公开(公告)日：2016-06-23

申请号：PCT/US2015/066362

申请日：2015-12-17

Applicant: GLO AB ,  GARDNER, Nathan F. ,  KISH, Fredrick A., JR. ,  MODRIC, Miljenko ,  POKHRIYAL, Anusha ,  THOMPSON, Daniel ,  DANESH, Fariba ,  GALLAGHER, Timothy

Inventor： GARDNER, Nathan F. ,  KISH, Fredrick A., JR. ,  MODRIC, Miljenko ,  POKHRIYAL, Anusha ,  THOMPSON, Daniel ,  DANESH, Fariba ,  GALLAGHER, Timothy

IPC: H05B37/00 ,  H05B33/14 ,  H01L33/00

Abstract: A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate. Additional devices on each additional transfer substrate can be bonded to additional conductive bonding structures on the backplane employing the same method provided that the additional devices are not present in positions that would overlap with pre-existing first light emitting devices or devices on the backplane at a bonding position.

公开(公告)号：WO2016100662A1

公开(公告)日：2016-06-23

申请号：PCT/US2015/066372

申请日：2015-12-17

Applicant: GLO AB ,  GARDNER, Nathan F. ,  KISH, JR., Fredrick A. ,  MODRIC, Miljenko ,  POKHRIYAL, Anusha ,  THOMPSON, Daniel Bryce ,  DANESH, Fariba ,  GALLAGHER, Timothy ,  FARRENS, Sharon N.

Inventor： GARDNER, Nathan F. ,  KISH, JR., Fredrick A. ,  MODRIC, Miljenko ,  POKHRIYAL, Anusha ,  THOMPSON, Daniel Bryce ,  DANESH, Fariba ,  GALLAGHER, Timothy ,  FARRENS, Sharon N.

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/97 ,  H01L25/50 ,  H01L27/156 ,  H01L33/0095 ,  H01L33/62 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/81 ,  H01L2224/81001 ,  H01L2224/95

Abstract: A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate. Additional devices on each additional transfer substrate can be bonded to additional conductive bonding structures on the backplane employing the same method provided that the additional devices are not present in positions that would overlap with pre-existing first light emitting devices or devices on the backplane at a bonding position.

Abstract translation: 提供了可选地具有阶梯式水平表面和任选地嵌入金属互连结构的背板。 第一导电接合结构形成在第一台阶水平表面上。 第一转印衬底上的第一发光器件设置在第一导电接合结构上，并且第一发光器件的第一子集结合到第一导电接合结构。 可以使用激光照射来选择性地将第一发光器件的第一子集与第一转移衬底分离，而第一发光器件的第二子集保持附着到第一转移衬底。 每个附加传输基板上的附加设备可以使用相同的方法与背板上的附加导电接合结构接合，只要附加设备不存在于与先前存在的第一发光设备或背板上的设备重叠的位置处 粘接位置。