公开(公告)号：WO2008001999A1

公开(公告)日：2008-01-03

申请号：PCT/KR2007/000452

申请日：2007-01-25

Applicant: YUNGJIN PHARMACEUTICAL CO., LTD. ,  MOON, Byung-Kwan ,  KIM, Seung-Ill ,  YOO, Ji-Seok ,  JEUN, Jong-ok

Inventor： MOON, Byung-Kwan ,  KIM, Seung-Ill ,  YOO, Ji-Seok ,  JEUN, Jong-ok

IPC: A23L1/305

CPC classification number: A61K36/48 ,  A23L33/15

Abstract: A water soluble composition containing coenzyme QlO is provided which has excellent acid resistance, salt resistance, heat resistance and transparency, in conjunction with further improved storage stability and freeze-thaw stability. The composition comprises coenzyme QlO, polyglycerol fatty acid ester having an average polymerization degree of 6 to 10 and an HLB value of more than 12, lecithin in the form of fluid and an emulsifying aid.

Abstract translation: 提供含有辅酶Q10的水溶性组合物，其具有优异的耐酸性，耐盐性，耐热性和透明性，并且进一步提高了储存稳定性和冻融稳定性。 该组合物包含平均聚合度为6〜10，HLB值大于12的辅酶Q10，聚甘油脂肪酸酯，液体形式的卵磷脂和乳化助剂。

公开(公告)号：WO2010095899A2

公开(公告)日：2010-08-26

申请号：PCT/KR2010001069

申请日：2010-02-22

Applicant: HANMI SEMICONDUCTOR CO LTD ,  MOON BYUNG KWAN ,  YU SUNG MAN

Inventor： MOON BYUNG KWAN ,  YU SUNG MAN

IPC: H01L23/12

CPC classification number: H01L21/67005 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a system for a laser drilling process on a package to manufacture a PoP (Package on Package). The present invention can: efficiently perform laser drilling on a package, effectively remove contamination caused by the laser drilling from the package, and realize a processing system with a new layout which uses an automatic concept for connecting a laser process with a washing process to increase UPH (Units Per Hour) in order to manufacture a stacked package assembly of a PoP type. Therefore, the present invention provides a semiconductor package processing system which can improve overall productivity.

Abstract translation: 本发明涉及一种用于在封装上进行激光钻孔工艺以制造PoP（封装上封装）的系统。 本发明可以：有效地在包装上进行激光钻孔，有效地去除由激光钻孔从包装引起的污染，并且实现具有新布局的处理系统，其使用自动概念将激光处理与洗涤处理连接以增加 UPH（单位每小时），以便制造PoP类型的堆叠封装组件。 因此，本发明提供了一种可以提高整体生产率的半导体封装处理系统。

公开(公告)号：WO2011049309A3

公开(公告)日：2011-10-13

申请号：PCT/KR2010006910

申请日：2010-10-08

Applicant: YUNGJIN PHARM CO LTD ,  OH DONG-JOON ,  KIM BYOUNG-KI ,  MOON BYUNG-KWAN ,  YOO JI-SEOK ,  SHIN DAE-HEE ,  RYOO BYUNG-HWAN

Inventor： OH DONG-JOON ,  KIM BYOUNG-KI ,  MOON BYUNG-KWAN ,  YOO JI-SEOK ,  SHIN DAE-HEE ,  RYOO BYUNG-HWAN

IPC: A61K9/22 ,  A61K9/20 ,  A61K47/30 ,  A61K47/38

CPC classification number: A61K9/5084

Abstract: The present invention relates to a pharmaceutical composition with both immediate and extended release characteristics, and more specifically, to a pharmaceutical composition comprising: an extended release portion comprising a pharmaceutically active ingredient, a release control material and a pharmaceutically acceptable carrier wherein a water-insoluble polymer is coated on the surface; and an immediate release portion comprising a pharmaceutically active ingredient and a pharmaceutically acceptable carrier. The pharmaceutical composition of the present invention shows independent release characteristics of an immediate release portion and an extended release portion by coating a water-insoluble polymer on the surface of the extended release portion, using a release control material and a pharmaceutically acceptable carrier to separate the extended release portion from the immediate release portion, and which can be prepared by a relatively simple process without limitation to the content or type of pharmaceutical active ingredient.

Abstract translation: 本发明涉及具有立即释放特征和延长释放特征的药物组合物，更具体地涉及药物组合物，其包含：包含药物活性成分，释放控制物质和药学上可接受的载体的缓释部分，其中水不溶性 聚合物被涂覆在表面上; 以及包含药物活性成分和药学上可接受的载体的速释部分。 本发明的药物组合物通过使用释放控制材料和药学上可接受的载体将水不溶性聚合物涂布在缓释部分的表面上而显示立即释放部分和缓释部分的独立释放特征， 缓释部分与速释部分组合，并且可以通过相对简单的方法制备，而不限于药物活性成分的含量或类型。