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    SYSTEMS AND METHODS FOR UNPRECEDENTED CRYSTALLINE QUALITY IN PHYSICAL VAPOR DEPOSITION-BASED ULTRA-THIN ALUMINUM NITRIDE FILMS
    4.
    发明申请
    SYSTEMS AND METHODS FOR UNPRECEDENTED CRYSTALLINE QUALITY IN PHYSICAL VAPOR DEPOSITION-BASED ULTRA-THIN ALUMINUM NITRIDE FILMS 审中-公开

    公开(公告)号：WO2022081373A1

    公开(公告)日：2022-04-21

    申请号：PCT/US2021/053413

    申请日：2021-10-04

    Applicant: OEM GROUP, LLC

    Inventor： LARIVIERE, Marc-Andre ,  RIOS REYES, Juan ,  CHOUDHARY, Nitin ,  LI, Chao ,  TRANG, Brendan V.

    IPC: H01J37/32 ,  C23C14/35 ,  H01J37/34

    Abstract: The present invention provides a method for depositing an ultra-thin film onto a wafer. The method comprising the following steps. A sputtering chamber is provided wherein the sputtering chamber is collectively defined by a wafer handling apparatus and a magnetron. The wafer is placed onto a wafer chuck of the wafer handling apparatus. The wafer chuck is moved to a first distance to the magnetron. A gas is introduced into the sputtering chamber such that the gas is separated into a plasma, wherein the plasma includes gas ions. A first negative potential is applied to at least one sputtering target of the magnetron while the wafer chuck with the wafer is at the first distance to the magnetron. The wafer chuck is moved to a second distance to the magnetron. A second negative potential is applied to at least one sputtering target of the magnetron while the wafer chuck with the wafer is at the second distance to the magnetron. The wafer is removed from the wafer chuck after the application of the second negative potential to at least one sputtering target of the magnetron.

    SYSTEMS AND METHODS FOR AN IMPROVED MAGNETRON ELECTROMAGNETIC ASSEMBLY
    5.
    发明申请
    SYSTEMS AND METHODS FOR AN IMPROVED MAGNETRON ELECTROMAGNETIC ASSEMBLY 审中-公开

    公开(公告)号：WO2022051125A1

    公开(公告)日：2022-03-10

    申请号：PCT/US2021/047130

    申请日：2021-08-23

    Applicant: OEM GROUP, LLC

    Inventor： LARIVIERE, Marc-Andre ,  RIOS REYES, Juan ,  CHOUDHARY, Nitin ,  LI, Chao ,  TRANG, Brendan V. ,  FORGEY, Christian K. ,  CORRERA, Michael S. ,  SENSEMAN, William

    IPC: H01J37/34

    Abstract: The present invention provides a magnetron system, comprising a baseplate assembly. The baseplate assembly defining a housing portion and a power feedthrough. A sputtering target is disposed within the housing portion of the baseplate assembly. An electromagnetic assembly is disposed within the housing portion of the baseplate assembly. The electromagnetic assembly comprising a plurality of electromagnet pairs and a plurality of magnet pairs, wherein the plurality of electromagnet pairs and the plurality of magnet pairs are arranged in an alternating order such that at least one electromagnet pair of the plurality of electromagnet pairs is juxtapositioned between two magnet pairs of the plurality of magnet pairs, and at least one magnet pair of the plurality of magnet pairs is juxtapositioned between two electromagnet pairs of the plurality of electromagnet pairs.

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