Abstract:
An illustrative wire processing machine includes at least one blade configured for at least one of cutting a conductor or at least piercing an insulation layer on the conductor. At least one gripper assembly includes a gripper configured to at least temporarily grasp a portion of a conductor during a wire processing operation. A generator, which is part of the gripper assembly, is configured to radiate a field toward a conductor. The gripper assembly also includes a detector that is configured to detect at least some of the field propagated along the conductor. A processor is configured to determine when a change in the propagated field detected by the detector indicates contact between a conductor and the blade.
Abstract:
An illustrative example conductor monitoring device includes a generator configured to radiate a field into a conductor. A detector is configured to detect at least some of the field propagated along the conductor. A processor is configured to determine when a change in the propagated field detected by the detector indicates contact between the conductor and a conductive blade of a wire processing machine. The example conductor monitoring device is capable of providing information regarding the condition of a conductor that has gone through a wire handling process that involves cutting the wire and stripping insulation from near the end of the cut wire, for example. The information regarding the condition of the wire is obtained without making contact with the wire and without interfering with or requiring any alteration of the wire handling process or machine.
Abstract:
An example container includes a plurality of package segments, each having a respective conductive lead that is interrupted when its package segment is opened. The container includes a signaling source configured to provide two signals that are distinguishable from each other. A presence of one or both of the signals on a shared return line indicates whether one of the package segments has been opened.
Abstract:
A sensor device includes at least one piezoelectric polymer film supported on a plate that is positioned relative to a machine such that a force used during a manufacturing process involving the machine is incident on the plate. The piezoelectric polymer film provides an electrical output indicative of the incident force. In a disclosed example, a single piezoelectric polymer film extends across a substantial portion of a surface area of the plate. In another disclosed example, a plurality of piezoelectric polymer film sensor elements area are arranged symmetrically about a location where the incident force is expected to be most prominent.