Abstract:
An electrical feedback detection system for detecting electrical contact between a multi-point probe and an electrically conducting material test sample surface. The electrical feedback detection system comprises an electrical detector unit connected to a multitude of electrodes in the multi-point probe, and optionally directly to the test sample surface. The detector unit provides an electrical signal to a multi-point testing apparatus, which can be used to determine if the multi-point probe is in electrical contact with the test sample surface. The detector unit comprises an electrical generator means for generating an electrical signal that is driven through a first multitude of electrodes of the multi-point probe, and a second multitude of switched impedance detection elements. The electrical potential across the impedance detection elements determines the electrical contact to the test sample surface.
Abstract:
Methods, systems and related apparatus are provided to enable an electronic device to operate an external sensor comprising one or more emitters for emitting electromagnetic radiation of two different wavelengths and a detector for generating a response signal based on received electromagnetic radiation of the two different wavelengths connectable to an audio interface by applying a harmonic driving signal to a first contact and a second contact of the audio interface for driving the emitters of the external sensor, receiving the response signal at a third contact of the audio interface, demodulating and demultiplexing the response signal into a first wavelength response signal and a second wavelength response signal, analyzing the first and second wavelength response signals to determine one or more vital signs, and outputting the determined one or more vital signs.
Abstract:
A method for accurately determining the sheet resistance and leakage current density of a shallow implant in a semiconductor surface (520) includes making one or more four-point resistance measurements with an induced current below 100 μA on the semiconductor surface (520) with a plurality of electrode spacing sets, at least one set having an average spacing below 100 μm. The sheet resistance and implant leakage is determined through fitting the measured data to theoretical data to within a predetermined error.
Abstract:
An object of the present invention is to provide a novel testing probe allowing the testing of electronic circuits of a smaller dimension as compared to the prior art testing technique. A particular advantage of the present invention is related to the fact that the novel testing technique involving a novel multi-point probe (12, 14, 16, 18) allows the probe to be utilised for establishing a reliable contact between any testing pin or testing tip and a specific location of a test sample, as the testing probe according to the present invention includes individually bendable or flexible testing pins (14, 18). A particular feature of the present invention relates to the fact that the testing probe according to the present invention may be produced in a process compatible with the production of electronic circuits, allowing measurement electronics to be integrated on the testing probe, and allowing for tests to be performed on any device fabricated by any appropriate circuit technology involving planar technique, CMOS technique, thick-film technique or thin-film technique and also LSI and VLSI production techniques.