Abstract:
According to one embodiment of the present invention, an integrated assembly is provided. The integrated assembly includes a substrate with an integrated circuit, an interconnect structure disposed above the substrate, wherein the interconnect structure comprises a metallization plane; a first dielectric cavity is formed through the interconnect structure and at least a part of the substrate to accommodate a first optical component; wherein the integrated circuit and the first optical component are provided on the same side of the substrate. A method of manufacturing an integrated assembly is also provided.
Abstract:
A dispenser arrangement for fluidic dispensing control into a microfluidic component comprising an enclosed fluid holding area having a base portion and a top portion and a valve adapted to be movable between an open position and a closed position and positioned at least partially in the fluid holding area. The valve comprises an elongated hollow portion having a body and two ends adapted for fluid flow from the fluid holding area to the microfluidic component in the open position, a first opening on the body of the hollow portion positioned within the fluid holding area allowing fluid communication from the fluid holding area to the microfluidic component in the open position, a sealing portion connected to a first end of the hollow portion positioned within the fluid holding area adapted for sealing connection with the top portion of the fluid holding area in the closed position and a slant second opening at a second end of the hollow portion positioned outside of the fluid holding area. The slant second opening is adapted to pierce through a sealing layer covering the microfluidic component in the open position and to insert into a first substrate housing the microfluidic component in the closed position. A dispenser unit comprising a dispenser arrangement and an actuator, wherein the actuator is a piston is also disclosed.