公开(公告)号：WO2010044746A1

公开(公告)日：2010-04-22

申请号：PCT/SG2008/000398

申请日：2008-10-16

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  RANGANATHAN, Nagarajan ,  KUMAR, Rakesh ,  ZHANG, Qingxin ,  LIAO, Ebin ,  BLIZNETSOV, Vladimir ,  PREMACHANDRAN, Chirayarikathuveedu, Sankarapillai

Inventor： RANGANATHAN, Nagarajan ,  KUMAR, Rakesh ,  ZHANG, Qingxin ,  LIAO, Ebin ,  BLIZNETSOV, Vladimir ,  PREMACHANDRAN, Chirayarikathuveedu, Sankarapillai

IPC: G02B6/12 ,  H01L27/14

CPC classification number: H01L27/144 ,  G02B6/12004 ,  G02B6/305 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4232 ,  G02B2006/12061 ,  G02B2006/12123 ,  G02B2006/12142

Abstract: According to one embodiment of the present invention, an integrated assembly is provided. The integrated assembly includes a substrate with an integrated circuit, an interconnect structure disposed above the substrate, wherein the interconnect structure comprises a metallization plane; a first dielectric cavity is formed through the interconnect structure and at least a part of the substrate to accommodate a first optical component; wherein the integrated circuit and the first optical component are provided on the same side of the substrate. A method of manufacturing an integrated assembly is also provided.

Abstract translation: 根据本发明的一个实施例，提供了一种集成组件。 集成组件包括具有集成电路的衬底，布置在衬底上方的互连结构，其中互连结构包括金属化平面; 通过所述互连结构形成第一介电腔，并且至少部分所述衬底以容纳第一光学部件; 其中所述集成电路和所述第一光学部件设置在所述基板的同一侧。 还提供了一种制造集成组件的方法。

公开(公告)号：WO2009002271A1

公开(公告)日：2008-12-31

申请号：PCT/SG2007/000243

申请日：2007-08-08

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  ZHANG, Qingxin ,  LO, Guo-Qiang Patrick ,  YU, Mingbin ,  KWONG, Dim-Lee

Inventor： ZHANG, Qingxin ,  LO, Guo-Qiang Patrick ,  YU, Mingbin ,  KWONG, Dim-Lee

IPC: H01L23/52 ,  B81B7/02 ,  H01L21/00

CPC classification number: B81C3/002 ,  B81C2203/051

Abstract: The wafer arrangement (100) provided comprises a first wafer (101), which comprises an integrated circuit and a recess (105). The wafer arrangement further comprises a portion of a second wafer (103), which comprises a carrier portion and a protrusion (107), the protrusion comprising an active component or actively controlled component (109) such as a MEMS component, wherein the portion of the second wafer (103) is coupled to the first wafer (101) such that the protrusion (107) is received in the recess (105). The invention provides a mechanism for accurately aligning an active component (109) on the second wafer (103) with components on the first wafer (101), such as photonic, electronic or optical components.

Abstract translation: 提供的晶片装置（100）包括第一晶片（101），其包括集成电路和凹部（105）。 晶片装置还包括第二晶片（103）的一部分，其包括载体部分和突起（107），所述突起包括有源部件或诸如MEMS部件的主动控制部件（109），其中，部分 第二晶片（103）耦合到第一晶片（101），使得突起（107）被容纳在凹部（105）中。 本发明提供了用于将第二晶片（103）上的有源部件（109）精确对准第一晶片（101）上的部件（诸如光子，电子或光学部件）的机构。

公开(公告)号：WO2010144051A1

公开(公告)日：2010-12-16

申请号：PCT/SG2009/000210

申请日：2009-06-11

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  ZHANG, Qingxin ,  DU, Yu ,  TAN, Chee Wei

Inventor： ZHANG, Qingxin ,  DU, Yu ,  TAN, Chee Wei

IPC: B81B5/00 ,  G02B6/36 ,  G02B26/00

CPC classification number: B81B3/0054 ,  B81B2201/033 ,  B81B2201/047 ,  G02B6/4204 ,  G02B6/4226 ,  G02B6/4236 ,  G02B26/0833 ,  G02B26/0866

Abstract: A microelectromechanical system (MEMS) device, method of operating the MEMS device, and a method of forming the MEMS device are provided. The MEMS device includes a positioning mechanism and a locking mechanism. The positioning mechanism includes a first arm structure having a first surface and a second surface; a second arm structure having a first surface and a second surface; wherein the first surface of the first arm structure faces the first surface of the second arm structure. The positioning mechanism also includes a first actuator disposed adjacent to the second surface of the first arm structure facing away from the second arm structure; and a second actuator disposed adjacent to the second surface of the second arm structure facing away from the first arm structure. The locking mechanism includes a first pair of locking elements arranged such that each locking element is disposed at two opposite side surfaces of the first arm structure between the first and second surfaces of the first arm structure; and a second pair of locking elements arranged such that each locking element is disposed at two opposite side surfaces of the second arm structure between the first and second surfaces of the second arm structure. The first and second pairs of locking elements are configured to engage with and disengage from the first and second arm structures respectively.

Abstract translation: 提供了微机电系统（MEMS）装置，操作MEMS装置的方法以及形成MEMS器件的方法。 MEMS装置包括定位机构和锁定机构。 定位机构包括具有第一表面和第二表面的第一臂结构; 具有第一表面和第二表面的第二臂结构; 其中第一臂结构的第一表面面向第二臂结构的第一表面。 所述定位机构还包括第一致动器，所述第一致动器邻近所述第一臂结构的所述第二表面邻近所述第二臂结构设置; 以及第二致动器，其邻近所述第二臂结构的所述第二表面邻近所述第一臂结构设置。 锁定机构包括第一对锁定元件，其布置成使得每个锁定元件设置在第一臂结构的第一和第二表面之间的第二臂结构的两个相对的侧表面处; 以及第二对锁定元件，其布置成使得每个锁定元件设置在第二臂结构的第二和第二表面之间的第二臂结构的两个相对的侧表面处。 第一和第二对锁定元件构造成分别与第一和第二臂结构接合和分离。

公开(公告)号：WO2008036052A1

公开(公告)日：2008-03-27

申请号：PCT/SG2007/000320

申请日：2007-09-21

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  PINJALA, Damaruganath ,  ORATTI KALANDAR, Navas Khan ,  ZHANG, Hengyun ,  LIAO, Ebin ,  ZHANG, Qingxin ,  RANGANATHAN, Nagarajan ,  KRIPESH, Vaidyanathan

Inventor： PINJALA, Damaruganath ,  ORATTI KALANDAR, Navas Khan ,  ZHANG, Hengyun ,  LIAO, Ebin ,  ZHANG, Qingxin ,  RANGANATHAN, Nagarajan ,  KRIPESH, Vaidyanathan

IPC: H01L23/46

CPC classification number: H01L23/473 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/0652 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/1627 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic package (200) comprises a substrate (201), a first carrier layer arrangement (211) adapted to dissipate heat from at least one chip (217) mounted thereon, and a heat exchanger (221) mounted on the first carrier layer arrangement. The first carrier layer arrangement comprises at least one internal microchannel (213), which is fluidically interconnected with the heat exchanger (221) though an inlet (215) and an outlet (219). The heat exchange further comprises a pump (223) controlling fluid flow through the microchannel (213). The package may further comprise a stack of carrier layer arrangements (211), each of which may have one or more chips (217) mounted thereon.

Abstract translation: 电子封装（200）包括衬底（201），适于从安装在其上的至少一个芯片（217）散发热量的第一载体层布置（211）和安装在第一载体层布置上的热交换器（221） 。 第一载体层布置包括至少一个内部微通道（213），其通过入口（215）和出口（219）与热交换器（221）流体地互连。 热交换器还包括控制流过微通道（213）的流体的泵（223）。 包装件还可以包括一叠载体层布置（211），每个载体层布置可以具有安装在其上的一个或多个芯片（217）。