公开(公告)号：WO2009045170A1

公开(公告)日：2009-04-09

申请号：PCT/SG2008/000369

申请日：2008-09-29

Applicant: SILICON MATRIX PTE. LTD. ,  WANG, Zhe ,  CHONG, Ser, Choong

Inventor： WANG, Zhe ,  CHONG, Ser, Choong

IPC: H04R17/02 ,  H04R19/00

CPC classification number: H04R19/04

Abstract: A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm (11) is surrounded by a circular spring (12) having a plurality of slots and perforations to facilitate air damping reduction, release of in- plane stress, and improve out-plane flexibility. Anchored at a substrate (8), the circular spring (12) holds the silicon microphone suspended over a backside hole in the substrate (8) but allows the diaphragm (11 ) to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of "n" bonding pads (16a, 16b) near the outer edge of the circular spring (12) are connected by "n/2" bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.

Abstract translation: 公开了一种无刷硅传声器和用于提高耐冲击性的线保护方法。 圆形隔膜（11）由具有多个槽和穿孔的圆形弹簧（12）围绕，以便于减少空气阻尼，释放面内应力，并提高平面外的柔性。 固定在基板（8）上的圆形弹簧（12）将硅麦克风保持在基板（8）的背面孔上，但允许隔膜（11）垂直于基板振动。 在多孔弹簧和基板之间形成麦克风可变电容器。 槽口尺寸被最小化以防止颗粒进入下面的气隙。 在圆形弹簧（12）的外边缘附近的多个“n”个接合焊盘（16a，16b）通过用作限制器的“n / 2”接合线连接，以限制隔膜的向上运动。 接合线可以彼此交叉以实现较低的回路高度，以更有效地抵抗冲击。

公开(公告)号：WO2008036045A1

公开(公告)日：2008-03-27

申请号：PCT/SG2006/000276

申请日：2006-09-19

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  XIE, Ling ,  PREMACHANDRAN, Chirayarikathuveedu Sankarapillai ,  CHONG, Ser Choong

Inventor： XIE, Ling ,  PREMACHANDRAN, Chirayarikathuveedu Sankarapillai ,  CHONG, Ser Choong

IPC: F15C1/00 ,  F15C1/04

CPC classification number: F15C5/00 ,  Y10T137/218 ,  Y10T137/2213 ,  Y10T137/2218 ,  Y10T137/2224

Abstract: A dispenser arrangement for fluidic dispensing control into a microfluidic component comprising an enclosed fluid holding area having a base portion and a top portion and a valve adapted to be movable between an open position and a closed position and positioned at least partially in the fluid holding area. The valve comprises an elongated hollow portion having a body and two ends adapted for fluid flow from the fluid holding area to the microfluidic component in the open position, a first opening on the body of the hollow portion positioned within the fluid holding area allowing fluid communication from the fluid holding area to the microfluidic component in the open position, a sealing portion connected to a first end of the hollow portion positioned within the fluid holding area adapted for sealing connection with the top portion of the fluid holding area in the closed position and a slant second opening at a second end of the hollow portion positioned outside of the fluid holding area. The slant second opening is adapted to pierce through a sealing layer covering the microfluidic component in the open position and to insert into a first substrate housing the microfluidic component in the closed position. A dispenser unit comprising a dispenser arrangement and an actuator, wherein the actuator is a piston is also disclosed.

Abstract translation: 一种用于流体分配控制到微流体部件的分配器装置，包括具有基部和顶部的封闭流体保持区域和适于在打开位置和关闭位置之间移动并且至少部分地定位在流体保持区域中的阀 。 阀包括细长的中空部分，其具有本体，并且两端适于在打开位置中从流体保持区域流到微流体部件，位于流体保持区域内的中空部分的主体上的第一开口允许流体连通 从所述流体保持区域到所述微流体部件处于所述打开位置，密封部分连接到位于所述流体保持区域内的所述中空部分的第一端，所述第一端适于密封与所述关闭位置中的所述流体保持区域的顶部部分的连接;以及 在位于流体保持区域外部的中空部分的第二端处的倾斜的第二开口。 倾斜的第二开口适于在打开位置刺穿覆盖微流体部件的密封层并插入到处于关闭位置的容纳微流体部件的第一基板。 还公开了一种分配器单元，其包括分配器装置和致动器，其中致动器是活塞。

公开(公告)号：WO2006088427A1

公开(公告)日：2006-08-24

申请号：PCT/SG2005/000038

申请日：2005-02-15

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  NATIONAL UNIVERSITY OF SINGAPORE ,  CHONG, Ser, Choong ,  XIE, Ling ,  JI, Hongmiao ,  LI, Jing ,  CHEN, Yu ,  YOBAS, Levent

Inventor： CHONG, Ser, Choong ,  XIE, Ling ,  JI, Hongmiao ,  LI, Jing ,  CHEN, Yu ,  YOBAS, Levent

IPC: B81B1/00 ,  B01L3/00

CPC classification number: B81B7/0061 ,  B01F5/0603 ,  B01F13/0059 ,  B01L3/502707 ,  B01L3/502715 ,  B01L9/527 ,  B01L2200/028 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B81B2201/051 ,  B81B2201/058

Abstract: A microfluidics package (1) comprising a substrate (6) having a top surface, said top surface comprises at least one fluid channel (11, 12), at least one fluidic chip (2) having a top surface, a bottom surface, at least one side surface, and at least one passage to allow a fluid to traverse from the top surface or any side surface to the bottom surface of the chip; and a sheet (4) of which both sides are adhesive, wherein the first adhesive side of the sheet (4) is secured to the substrate (6), and the at least one fluidic chip (2) is secured by the second adhesive side of the sheet (4), said fluidic chip (2) being arranged such that the at least one passage of the fluidic chip is in fluid communication with the at least one fluid channel (11, 12) of the substrate.

Abstract translation: 一种微流体封装（1），包括具有顶表面的衬底（6），所述顶表面包括至少一个流体通道（11,12），至少一个流体芯片（2），其具有顶表面，底表面 至少一个侧表面和至少一个通道，以允许流体从所述芯片的顶表面或任何侧表面穿过所述底表面; 和其中两侧是粘合剂的片材（4），其中片材（4）的第一粘合剂侧固定到基底（6）上，并且至少一个流体碎片（2）由第二粘合剂侧 所述流体芯片（2）布置成使得流体芯片的至少一个通道与基板的至少一个流体通道（11,12）流体连通。

公开(公告)号：WO2005031333A1

公开(公告)日：2005-04-07

申请号：PCT/SG2004/000293

申请日：2004-09-13

Applicant: AGENCY FOR SCIENCE TECHNOLOGY AND RESEARCH ,  NATIONAL UNIVERSITY OF SINGAPORE ,  CHEN, Yu ,  YE, Jianshan ,  SHEU, Fwu-Shan ,  CUI, Hui Fang ,  CHONG, Ser Choong

Inventor： CHEN, Yu ,  YE, Jianshan ,  SHEU, Fwu-Shan ,  CUI, Hui Fang ,  CHONG, Ser Choong

IPC: G01N27/327

CPC classification number: G01N27/403 ,  B01L3/508

Abstract: A sensor array integrated electrochemical chip is provided wherein the chip has an array of electrodes. The array may be formed on a base plate bonded to a cover plate having an opening. The opening can be a window or a depression. The plates are bounded such that they define a cavity, with the array being within the cavity. Conducting lines for connecting the electrodes to electrochemical instruments may be formed on the same surface of the base plate on which the electrodes are formed. At least one of the electrodes may be covered by a coating doped with a ferrocene compound. The coating may be a supported bilayer lipid membrane doped with benzoylferrocene. The doped ferrocene compound may be oxidized.

Abstract translation: 提供一种传感器阵列集成电化学芯片，其中芯片具有电极阵列。 阵列可以形成在结合到具有开口的盖板的基板上。 开口可以是窗户或凹陷。 板被限制成使得它们限定空腔，阵列在空腔内。 用于将电极连接到电化学仪器的导线可以形成在其上形成有电极的基板的相同表面上。 电极中的至少一个可以被掺杂有二茂铁化合物的涂层覆盖。 涂层可以是掺有苯甲酰基二茂铁的负载双层脂质膜。 掺杂的二茂铁化合物可被氧化。