公开(公告)号：WO2011028700A3

公开(公告)日：2011-05-26

申请号：PCT/US2010047306

申请日：2010-08-31

Applicant: SAINT GOBAIN ABRASIVES INC ,  SAINT GOBAIN ABRASIFS SA ,  WU JIANHUI ,  HALL RICHARD W J ,  SCHULZ ERIC M ,  RAMANATH SRINIVASAN

Inventor： WU JIANHUI ,  HALL RICHARD W J ,  SCHULZ ERIC M ,  RAMANATH SRINIVASAN

IPC: H01L21/304

CPC classification number: B24B53/007

Abstract: A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

Abstract translation: 化学机械抛光（CMP）调节剂包括具有主表面的陶瓷基底和覆盖主表面的磨料涂层。 主表面可以包括以弯曲图案布置的微突起。 或者，微突起可以以不规则的图案排列。

公开(公告)号：WO2010141464A3

公开(公告)日：2011-05-05

申请号：PCT/US2010036895

申请日：2010-06-01

Applicant: SAINT GOBAIN ABRASIVES INC ,  SAINT GOBAIN ABRASIFS SA ,  WU JIANHUI ,  HWANG TAEWOOK ,  VEDANTHAM RAMANUJAM ,  DINH-NGOC CHARLES ,  PUTHANANGADY THOMAS ,  SCHULZ ERIC M ,  RAMANATH SRINIVASAN

Inventor： WU JIANHUI ,  HWANG TAEWOOK ,  VEDANTHAM RAMANUJAM ,  DINH-NGOC CHARLES ,  PUTHANANGADY THOMAS ,  SCHULZ ERIC M ,  RAMANATH SRINIVASAN

IPC: H01L21/304

CPC classification number: B24B53/017 ,  B24B53/12 ,  B24D3/08 ,  B24D18/00

Abstract: An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Abstract translation: 用于调节CMP垫的研磨工具包括通过金属键和涂层（例如氟掺杂的纳米复合涂层）与基底相连的磨料颗粒。 磨粒可以以自回避的随机分布布置。 在一个实施方案中，研磨工具包括涂覆的板和具有两个研磨表面的涂覆的磨料制品。 涉及用于生产研磨工具的方法的其它实施方式，其包括在其一个或多个表面上的涂层。 还描述了用于修整CMP垫的方法。

公开(公告)号：WO2010141464A2

公开(公告)日：2010-12-09

申请号：PCT/US2010/036895

申请日：2010-06-01

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS ,  WU, Jianhui ,  HWANG, Taewook ,  VEDANTHAM, Ramanujam ,  DINH-NGOC, Charles ,  PUTHANANGADY, Thomas ,  SCHULZ, Eric, M. ,  RAMANATH, Srinivasan

Inventor： WU, Jianhui ,  HWANG, Taewook ,  VEDANTHAM, Ramanujam ,  DINH-NGOC, Charles ,  PUTHANANGADY, Thomas ,  SCHULZ, Eric, M. ,  RAMANATH, Srinivasan

IPC: H01L21/304

CPC classification number: B24B53/017 ,  B24B53/12 ,  B24D3/08 ,  B24D18/00

Abstract: An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Abstract translation: 用于调节CMP垫的研磨工具包括通过金属键和涂层（例如氟掺杂的纳米复合涂层）与基底相连的磨料颗粒。 磨粒可以以自回避的随机分布布置。 在一个实施方案中，研磨工具包括涂覆的板和具有两个研磨表面的涂覆的磨料制品。 涉及用于生产研磨工具的方法的其它实施方式，其包括在其一个或多个表面上的涂层。 还描述了用于修整CMP垫的方法。

公开(公告)号：WO2011028700A2

公开(公告)日：2011-03-10

申请号：PCT/US2010/047306

申请日：2010-08-31

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS ,  WU, Jianhui ,  HALL, Richard W. J. ,  SCHULZ, Eric M. ,  RAMANATH, Srinivasan

Inventor： WU, Jianhui ,  HALL, Richard W. J. ,  SCHULZ, Eric M. ,  RAMANATH, Srinivasan

IPC: H01L21/304

CPC classification number: B24B53/007

Abstract: A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

Abstract translation: 化学机械抛光（CMP）调理剂包括具有主表面的陶瓷基底和覆盖主表面的磨料涂层。 主表面可以包括以弯曲图案布置的微突起。 或者，微突起可以布置成不规则图案。