公开(公告)号：WO2010141464A3

公开(公告)日：2011-05-05

申请号：PCT/US2010036895

申请日：2010-06-01

Applicant: SAINT GOBAIN ABRASIVES INC ,  SAINT GOBAIN ABRASIFS SA ,  WU JIANHUI ,  HWANG TAEWOOK ,  VEDANTHAM RAMANUJAM ,  DINH-NGOC CHARLES ,  PUTHANANGADY THOMAS ,  SCHULZ ERIC M ,  RAMANATH SRINIVASAN

Inventor： WU JIANHUI ,  HWANG TAEWOOK ,  VEDANTHAM RAMANUJAM ,  DINH-NGOC CHARLES ,  PUTHANANGADY THOMAS ,  SCHULZ ERIC M ,  RAMANATH SRINIVASAN

IPC: H01L21/304

CPC classification number: B24B53/017 ,  B24B53/12 ,  B24D3/08 ,  B24D18/00

Abstract: An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Abstract translation: 用于调节CMP垫的研磨工具包括通过金属键和涂层（例如氟掺杂的纳米复合涂层）与基底相连的磨料颗粒。 磨粒可以以自回避的随机分布布置。 在一个实施方案中，研磨工具包括涂覆的板和具有两个研磨表面的涂覆的磨料制品。 涉及用于生产研磨工具的方法的其它实施方式，其包括在其一个或多个表面上的涂层。 还描述了用于修整CMP垫的方法。

公开(公告)号：WO2010141464A2

公开(公告)日：2010-12-09

申请号：PCT/US2010/036895

申请日：2010-06-01

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS ,  WU, Jianhui ,  HWANG, Taewook ,  VEDANTHAM, Ramanujam ,  DINH-NGOC, Charles ,  PUTHANANGADY, Thomas ,  SCHULZ, Eric, M. ,  RAMANATH, Srinivasan

Inventor： WU, Jianhui ,  HWANG, Taewook ,  VEDANTHAM, Ramanujam ,  DINH-NGOC, Charles ,  PUTHANANGADY, Thomas ,  SCHULZ, Eric, M. ,  RAMANATH, Srinivasan

IPC: H01L21/304

CPC classification number: B24B53/017 ,  B24B53/12 ,  B24D3/08 ,  B24D18/00

Abstract: An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Abstract translation: 用于调节CMP垫的研磨工具包括通过金属键和涂层（例如氟掺杂的纳米复合涂层）与基底相连的磨料颗粒。 磨粒可以以自回避的随机分布布置。 在一个实施方案中，研磨工具包括涂覆的板和具有两个研磨表面的涂覆的磨料制品。 涉及用于生产研磨工具的方法的其它实施方式，其包括在其一个或多个表面上的涂层。 还描述了用于修整CMP垫的方法。

公开(公告)号：WO2009045940A1

公开(公告)日：2009-04-09

申请号：PCT/US2008/078071

申请日：2008-09-29

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS ,  RAMANATH, Srinivasan ,  WALIA, Parul

Inventor： RAMANATH, Srinivasan ,  WALIA, Parul

IPC: B24D3/10 ,  B24D18/00

CPC classification number: B24D3/10 ,  B24D18/0009

Abstract: Abrasive articles possessing a highly open (porous) structure and uniform abrasive grit distribution are disclosed. The abrasive articles are fabricated using a metal matrix and the open structure is controlled with a porosity scheme, including interconnected porosity (e.g., formed by leaching dispersoid), closed porosity (e.g., induced by adding hollow micro-spheres and/or sacrificial pore-forming additives), and/or intrinsic porosity (e.g., controlled via matrix component selection to provide desired densification). In some cases, manufacturing process temperatures for achieving near full density of metal bond with fillers and abrasives are below the melting point of the filler used, although sacrificial fillers may be used as well. The abrasive articles are useful in high performance cutting and grinding operations, such as back-grinding silicon, alumina titanium carbide, and silicon carbide wafers to very fine surface finish values. Techniques of use and manufacture are also disclosed.

Abstract translation: 公开了具有高度开放（多孔）结构和均匀的磨料砂粒分布的磨料制品。 使用金属基体制造研磨制品，并且开孔结构由孔隙度方案控制，包括相互连通的孔隙度（例如通过浸出分散体形成），闭孔率（例如通过添加空心微球和/或牺牲孔 - 形成添加剂）和/或固有孔隙率（例如，通过基质组分选择进行控制以提供所需的致密化）。 在某些情况下，尽管可以使用牺牲填料，但用填料和研磨剂实现接近全密度金属粘合的制造工艺温度低于所用填料的熔点。 磨料制品可用于高性能切割和磨削操作，例如后研磨硅，氧化铝碳化钛和碳化硅晶片，以非常精细的表面光洁度值。 还公开了使用和制造技术。

公开(公告)号：WO2009009558A1

公开(公告)日：2009-01-15

申请号：PCT/US2008/069466

申请日：2008-07-09

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS TECHNOLOGIE ET SERVICES, S.A.S. ,  BLOCK, Robert G. ,  RAMANATH, Srinivasan ,  SCHIER, Daniel L.

Inventor： BLOCK, Robert G. ,  RAMANATH, Srinivasan ,  SCHIER, Daniel L.

IPC: B24B9/10 ,  B24D5/02 ,  B24D18/00

CPC classification number: B24B9/10 ,  B24D5/02 ,  B24D18/00

Abstract: A single-use grinding tool includes a wheel portion having a profiled recess (e.g., such as a U, V, or bowl shape) extending circumferentially along the wheel portion's periphery. A multi-layered bonded abrasive (e.g., 3-dimensional matrix of abrasive grains and bond material, or multiple layers of abrasive tape) is conformably coated or otherwise applied in a uniform thickness along the profiled recess. The bonded abrasive in one particular case includes a metal bond with diamonds. However, organic, resinous, vitrified, and hybrid bonds, as well as other abrasive grit types, can be used. The wheel portion is supported by an arbor portion which may be removably coupled to the wheel portion, or formed integrally with the wheel portion. The tool is useful, for example, in edge grinding a workpiece, such as sheet glass. Methods of tool use and tool manufacture are disclosed as well.

Abstract translation: 一次性研磨工具包括具有沿着轮部分周边沿周向延伸的成型凹部（例如U，V或碗状）的轮部分。 多层粘合磨料（例如，磨粒和粘合材料的三维基质，或多层研磨带）沿着轮廓凹槽被均匀地涂覆或以其它方式施加在均匀的厚度上。 在特定情况下，粘合磨料包括与金刚石的金属键。 然而，可以使用有机，树脂，玻璃化和混合粘合以及其它研磨砂粒类型。 车轮部分由心轴部分支撑，心轴部分可拆卸地联接到车轮部分，或者与车轮部分一体地形成。 该工具是有用的，例如，边缘研磨工件，如平板玻璃。 还公开了工具使用和工具制造的方法。

公开(公告)号：WO2012016120A2

公开(公告)日：2012-02-02

申请号：PCT/US2011/045853

申请日：2011-07-29

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  HART, Ken, J. ,  RAMANATH, Srinivasan ,  GERSTNER, Daniel ,  SIMMERS, Matthew, B.

Inventor： HART, Ken, J. ,  RAMANATH, Srinivasan ,  GERSTNER, Daniel ,  SIMMERS, Matthew, B.

IPC: B24D7/02 ,  B24D18/00 ,  B24B23/02

CPC classification number: B24D11/001 ,  B24D11/02

Abstract: Flexible abrasive articles and related methods are presented.

Abstract translation: 介绍柔性磨料制品和相关方法。

公开(公告)号：WO2010002832A3

公开(公告)日：2010-05-06

申请号：PCT/US2009049158

申请日：2009-06-30

Applicant: SAINT GOBAIN ABRASIVES INC ,  SAINT GOBAIN ABRASIFS SA ,  WALIA PARUL ,  RAMANATH SRINIVASAN ,  HALL RICHARD W

Inventor： WALIA PARUL ,  RAMANATH SRINIVASAN ,  HALL RICHARD W

IPC: B24D3/04 ,  B24D3/06 ,  B24D3/10

CPC classification number: B24D3/06 ,  B24D5/12

Abstract: A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.

Abstract translation: 用于金属粘合研磨工具的粘结基质包括金属粘结体系，孔隙度和任选的填料。 根据本发明的实施例的工具显示出长的刀具寿命，产生可接受的切割质量并且可具有自修饰性能。 键合矩阵可以用于例如为电子工业配置的磨料工具，例如用于切割球栅阵列（BGA）的1A8轮和其它这样的切片操作。

公开(公告)号：WO2010002832A2

公开(公告)日：2010-01-07

申请号：PCT/US2009/049158

申请日：2009-06-30

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS ,  WALIA, Parul ,  RAMANATH, Srinivasan ,  HALL, Richard, W.

Inventor： WALIA, Parul ,  RAMANATH, Srinivasan ,  HALL, Richard, W.

IPC: B24D3/04 ,  B24D3/06 ,  B24D3/10

CPC classification number: B24D3/06 ,  B24D5/12

Abstract: A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.

Abstract translation: 用于金属粘结研磨工具的粘结基质包括金属粘结体系，孔隙率和任选的填料。 根据本发明的实施例的工具表现出长的工具寿命，产生可接受的切割质量并且可以具有自修整特性。 例如，可以在为电子工业配置的研磨工具中使用该粘结基体，例如用于切割球栅阵列（BGA）的1A8轮和其他这种切片操作。

公开(公告)号：WO2008036892A1

公开(公告)日：2008-03-27

申请号：PCT/US2007/079154

申请日：2007-09-21

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS TECHNOLOGIE ET SERVICES, S.A.S. ,  PUTHANANGADY, Thomas ,  HWANG, Taewook ,  RAMANATH, Srinivasan ,  SCHULZ, Eric ,  BALDONI, J. Gary ,  BULJAN, Sergej-tomislav ,  DINH-NGOC, Charles

Inventor： PUTHANANGADY, Thomas ,  HWANG, Taewook ,  RAMANATH, Srinivasan ,  SCHULZ, Eric ,  BALDONI, J. Gary ,  BULJAN, Sergej-tomislav ,  DINH-NGOC, Charles

IPC: B24B37/04 ,  B24B53/12 ,  B24D3/06

CPC classification number: B24B53/017 ,  B24B53/12 ,  B24D3/06 ,  B24D18/00

Abstract: Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particles and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.

Abstract translation: 用于调理化学机械平面化（CMP）衬垫的工具包括具有与至少一个表面耦合的磨料颗粒的衬底。 这些工具可以具有各种颗粒和粘结结构。 例如，磨料颗粒可以结合（例如钎焊或其他金属粘合技术）到一侧或前后两侧。 或者，磨料颗粒结合到前侧，并且填料颗粒连接到背面。 研磨颗粒可以形成图案（例如六边形），并且具有足够小的粒度以在调理期间穿透CMP垫的孔，导致用经调节的CMP垫抛光的晶片上的缺陷较少。 可以使用钎焊膜来实现晶粒结合，尽管也可以使用其它金属键。 此外，平衡粘合材料（例如，两侧上钎焊）允许低的平坦度值。

公开(公告)号：WO2011028700A3

公开(公告)日：2011-05-26

申请号：PCT/US2010047306

申请日：2010-08-31

Applicant: SAINT GOBAIN ABRASIVES INC ,  SAINT GOBAIN ABRASIFS SA ,  WU JIANHUI ,  HALL RICHARD W J ,  SCHULZ ERIC M ,  RAMANATH SRINIVASAN

Inventor： WU JIANHUI ,  HALL RICHARD W J ,  SCHULZ ERIC M ,  RAMANATH SRINIVASAN

IPC: H01L21/304

CPC classification number: B24B53/007

Abstract: A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

Abstract translation: 化学机械抛光（CMP）调节剂包括具有主表面的陶瓷基底和覆盖主表面的磨料涂层。 主表面可以包括以弯曲图案布置的微突起。 或者，微突起可以以不规则的图案排列。

公开(公告)号：WO2009075775A1

公开(公告)日：2009-06-18

申请号：PCT/US2008/013393

申请日：2008-12-05

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS ,  UPADHYAY, Rachana, D. ,  RAMANATH, Srinivasan ,  CORCORAN, Robert, F., Jr. ,  PUTHANANGADY, Thomas, K. ,  HALL, Richard, W. J. ,  HARLEY, Lynn, L.

Inventor： UPADHYAY, Rachana, D. ,  RAMANATH, Srinivasan ,  CORCORAN, Robert, F., Jr. ,  PUTHANANGADY, Thomas, K. ,  HALL, Richard, W. J. ,  HARLEY, Lynn, L.

IPC: B24D3/02 ,  B24D5/12 ,  B24D18/00

CPC classification number: B24D3/02 ,  B23D61/028 ,  B24D5/12 ,  B24D18/0009

Abstract: Abrasive tools and techniques are disclosed that can cut hard, brittle materials to relatively precise dimensions. The tools, which can include a hybrid bond of metal or metal alloy and a resin matrix together with fine abrasive grits, can be employed, for example, in mirror finish cutting applications, thereby enabling '1X' or 'single-pass' multi-function abrasive processes. The specific selection of resin and metal or metal alloy types is such that the tool is sufficiently brittle for the purpose of manufacture and durability, but ductile enough to withstand the grinding and handling stresses (an exemplary hybrid bond includes bronze and polyimide). Numerous tool types and applications will be apparent in light of this disclosure, including abrasive products for electronic device manufacturing such as thin 1A8 blades (single blade or multi-blade configuration).

Abstract translation: 公开了研磨工具和技术，其可以将硬的脆性材料切割成相对精确的尺寸。 可以使用可以包括金属或金属合金的混合结合的工具以及树脂基质和细磨料砂粒，例如在镜面切割应用中，从而使“1X”或“单程” 功能研磨工艺。 树脂和金属或金属合金类型的具体选择使得该工具为了制造和耐久性而足够脆，但是足够坚固以承受研磨和处理应力（示例性的混合键包括青铜和聚酰亚胺）。 根据本公开内容，许多工具类型和应用将是显而易见的，包括用于电子设备制造的磨料产品，例如薄1A8刀片（单刀片或多刀片配置）。