公开(公告)号：WO0163655A8

公开(公告)日：2002-08-22

申请号：PCT/JP0101414

申请日：2001-02-26

Applicant: TOKYO ELECTRON LTD ,  SHIBUKI SHUNICHI

Inventor： SHIBUKI SHUNICHI

IPC: B24B37/20 ,  B24B37/24 ,  B24D9/08 ,  H01L21/304 ,  H01L21/321 ,  H01L21/768 ,  H01L21/88

CPC classification number: B24B37/26 ,  B24D9/08 ,  H01L21/3212 ,  H01L21/7684

Abstract: A chemical-mechanical polishing device wherein an elastic member (16) disposed between a polishing pad (12) and a platen (14) has a hardness of 10 - 40 defined in JIS K6301 (A type) and a thickness of 5 - 30 mm. Further, the polishing process in damascene wiring formation is effected in two steps. The first polishing step uses the elastic member of above-mentioned quality, and the second polishing step uses a material whose hardness defined in JIS K6301 (A type) is 50 or more.

Abstract translation: 一种化学机械抛光装置，其中设置在抛光垫（12）和压板（14）之间的弹性构件（16）具有JIS K6301（A型）中规定的10-40的硬度和5-30mm的厚度 。 此外，镶嵌布线形成中的抛光工艺分两步进行。 第一研磨工序使用上述质量的弹性部件，第二研磨工序使用JIS K6301（A型）中规定的硬度为50以上的材料。