公开(公告)号：WO2009118455A9

公开(公告)日：2010-06-17

申请号：PCT/FI2009050226

申请日：2009-03-25

Applicant: TECNOMAR OY ,  MARTTILA TOM

Inventor： MARTTILA TOM

IPC: B32B38/10 ,  G06K19/077 ,  H05K3/04

CPC classification number: H05K1/115 ,  B32B37/1292 ,  B32B38/10 ,  B32B2310/0843 ,  B32B2457/08 ,  G08B13/244 ,  H05K1/0366 ,  H05K1/0386 ,  H05K3/027 ,  H05K3/046 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0284 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0522 ,  H05K2203/1388 ,  H05K2203/1394 ,  H05K2203/1545 ,  Y10T29/49156

Abstract: 1. A method for manufacturing a circuit board featuring conductive patterns, said method comprising the following steps of: i) affixing a conductive layer, such as a metal foil (3), to a substrate material (1) selectively, such that a part of the conductive layer, such as the metal foil (3), comprising desired areas (3a) for the final product and narrow areas (3c) between the final product's conducting areas, is affixed to the substrate material (1) by means of a bond (2), and removal-intended more extensive areas (3b) of the conductive layer, for example the metal foil (3), are left substantially unattached to the substrate material in such a way that the removable area (3b) is in attachment with the substrate material (1) by not more than its edge portion to be patterned in a subsequent step ii) and possibly by sites which preclude a release of the removable areas prior to a step iii); ii) patterning, by a removal of material, the conductive layer, such as the metal foil (3), from narrow gaps between the desired conducting areas (3a), and from an outer periphery of the area (3b) removable in a solid state, for establishing conductor patterns; iii) removing the removable areas (3b), not affixed to the substrate material (1), from the conductive layer, such as the metal foil (3), in a solid state after the conductive layer's edge area, which was removed from the removable area's outer periphery during the course of step ii), no longer holds the removable areas (3b) attached by their edges to the substrate material.

Abstract translation: 1.一种制造具有导电图案的电路板的方法，所述方法包括以下步骤：i）选择性地将诸如金属箔（3）的导电层固定到基底材料（1）上，使得部件 包括用于最终产品的所需区域（3a）和最终产品的导电区域之间的狭窄区域（3c）的金属箔（3）的导电层通过以下方式固定到基底材料（1）上： 导电层（例如金属箔（3））的导电层（2）和去除预期更广泛的区域（3b）基本上不与衬底材料连接，使得可移除区域（3b）处于 在后续步骤ii）中可能与基底材料（1）的连接不超过其待图案化的边缘部分，并且可能通过排除在步骤iii）之前的可移除区域的释放的位置; ii）通过从所需导电区域（3a）之间的狭窄间隙和从固体中可移除的区域（3b）的外周去除导电层（例如金属箔（3））的图案， 状态，用于建立导体图案; iii）在导电层的边缘区域从固定状态除去导电层的边缘区域之后，从导电层（例如金属箔（3））上去除不附着于基底材料（1）的可移除区域（3b） 在步骤ii）的过程中，可移除区域的外围不再将其边缘附着的可移除区域（3b）保持在衬底材料上。

公开(公告)号：WO2012156590A1

公开(公告)日：2012-11-22

申请号：PCT/FI2012/050475

申请日：2012-05-21

Applicant: TECNOMAR OY ,  MARTTILA, Tom

Inventor： MARTTILA, Tom

IPC: H05K3/46 ,  H01L23/538 ,  H01L21/677 ,  G06K19/077

CPC classification number: H05K3/46 ,  G06K19/07749 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/1028 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A reel to reel manufacturing method of electrical bridges, wherein over a substrate (1) made of electrically insulating material is patterned a conductive pattern (2) from electroconductive material, such as metal foil, and from the said electroconductive material is made at least one strip tongue (3) unattached to the substrate, one side of which is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).

Abstract translation: 电桥的卷轴到卷轴制造方法，其中在由电绝缘材料制成的基板（1）上方由导电材料（例如金属箔）对导电图案（2）图案化，并且从所述导电材料制成至少一个 剥离舌片（3），其未连接到基底，其一侧附接到导电图案（2），并且所述条形舌片（3）在与导电图案（2）电绝缘的区域上折叠，并且条带 舌部（3）电导连接到导电图案（2）的预定的其它部分（5）。

公开(公告)号：WO2015092115A1

公开(公告)日：2015-06-25

申请号：PCT/FI2013/051177

申请日：2013-12-18

Applicant: TECNOMAR OY

Inventor： MARTTILA, Tom

IPC: G10D1/08 ,  G10H3/18

CPC classification number: G10D3/12 ,  G10D3/04 ,  G10D3/14 ,  G10D3/143 ,  G10D3/146 ,  G10H1/32 ,  G10H2210/201

Abstract: The invention relates to an attachment arrangement (1) for the strings (S) of a stringed instrument, especially a guitar. To the body (100) of the stringed instrument is attached a bridge body (2), first restraining means for restraining the strings (S) from the first end area, second restraining means (3), which are arranged in conjunction with the bridge body (2) for restraining the strings from the second end area. Lever means (5) are arranged in conjunction with the bridge body (2) in order to move the second restraining means (3) for temporarily loosening and/or tightening the strings by means of a lever part (5') included in the lever means (5). The lever means (5) are provided with moving means (6, 7) comprising at least one moving mechanism (7), which is a mechanism separate from the lever means (5). One or more second restraining means (3) are arranged to move with respect to the bridge body (2). The moving means (6, 7) are arranged to transmit the movement of the lever means (5) into the desired movement of one or more restraining means (3).

Abstract translation: 本发明涉及一种用于弦乐器（尤其是吉他）的琴弦（S）的附接装置（1）。 弦乐器的主体（100）附接有桥体（2），用于约束弦（S）的第一限制装置（S）从第一端区域，第二限制装置（3）与桥架 本体（2）用于限制弦从第二端区域。 杠杆装置（5）与桥体（2）结合设置，以便移动第二限制装置（3），用于通过杠杆部件（5'）临时松开和/或紧固绳索 （5）。 杠杆装置（5）设置有移动装置（6,7），该移动装置包括至少一个与杠杆装置（5）分开的机构的移动机构（7）。 一个或多个第二限制装置（3）布置成相对于桥体（2）移动。 移动装置（6,7）被布置成将杠杆装置（5）的移动传递到一个或多个限制装置（3）的期望运动中。

公开(公告)号：WO2009118455A1

公开(公告)日：2009-10-01

申请号：PCT/FI2009/050226

申请日：2009-03-25

Applicant: TECNOMAR OY ,  MARTTILA, Tom

Inventor： MARTTILA, Tom

IPC: B32B38/10 ,  H05K3/04 ,  G06K19/077

CPC classification number: H05K1/115 ,  B32B37/1292 ,  B32B38/10 ,  B32B2310/0843 ,  B32B2457/08 ,  G08B13/244 ,  H05K1/0366 ,  H05K1/0386 ,  H05K3/027 ,  H05K3/046 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0284 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0522 ,  H05K2203/1388 ,  H05K2203/1394 ,  H05K2203/1545 ,  Y10T29/49156

Abstract: 1. A method for manufacturing a circuit board featuring conductive patterns, said method comprising the following steps of: i) affixing a conductive layer, such as a metal foil (3), to a substrate material (1) selectively, such that a part of the conductive layer, such as the metal foil (3), comprising desired areas (3a) for the final product and narrow areas (3c) between the final product's conducting areas, is affixed to the substrate material (1) by means of a bond (2), and removal-intended more extensive areas (3b) of the conductive layer, for example the metal foil (3), are left substantially unattached to the substrate material in such a way that the removable area (3b) is in attachment with the substrate material (1) by not more than its edge portion to be patterned in a subsequent step ii) and possibly by sites which preclude a release of the removable areas prior to a step iii); ii) patterning, by a removal of material, the conductive layer, such as the metal foil (3), from narrow gaps between the desired conducting areas (3a), and from an outer periphery of the area (3b) removable in a solid state, for establishing conductor patterns; iii) removing the removable areas (3b), not affixed to the substrate material (1), from the conductive layer, such as the metal foil (3), in a solid state after the conductive layer's edge area, which was removed from the removable area's outer periphery during the course of step ii), no longer holds the removable areas (3b) attached by their edges to the substrate material.

Abstract translation: 1.一种制造具有导电图案的电路板的方法，所述方法包括以下步骤：i）选择性地将诸如金属箔（3）的导电层固定到基底材料（1）上，使得部件 包括用于最终产品的所需区域（3a）和最终产品的导电区域之间的狭窄区域（3c）的金属箔（3）的导电层通过以下方式固定到基底材料（1）上： 导电层（例如金属箔（3））的导电层（2）和去除预期更广泛的区域（3b）基本上不与衬底材料连接，使得可移除区域（3b）处于 在后续步骤ii）中可能与基底材料（1）的连接不超过其待图案化的边缘部分，并且可能通过排除在步骤iii）之前的可移除区域的释放的位置; ii）通过从所需导电区域（3a）之间的狭窄间隙和从固体中可移除的区域（3b）的外周去除导电层（例如金属箔（3））的图案， 状态，用于建立导体图案; iii）在导电层的边缘区域从固定状态除去导电层的边缘区域之后，从导电层（例如金属箔（3））上去除不附着于基底材料（1）的可移除区域（3b） 在步骤ii）的过程中，可移除区域的外围不再将其边缘附着的可移除区域（3b）保持在衬底材料上。