Abstract:
A multilayer structure (100) comprises a flexible substrate film (102) having a first side and opposite second side, a number of conductive traces (108), optionally defining contact pads and/or conductors, printed on the first side of the substrate film by printed electronics technology for establishing a desired predetermined circuit design, a plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a connector (114) in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side of the substrate film (102), the connector being defined by a portion of the substrate film (102) accommodating at least part of one or more of the printed conductive traces (108) and cut partially loose from the surrounding substrate material so as to establish the flap, the loose end of which is bendable away from the molded plastic layer to facilitate the establishment of said electrical connection with external element (118), such as a wire or connector, via the associated gap. A related method of manufacture is presented.
Abstract:
A sensing device includes a printed circuit board (PCB) having a conductive trace. A micro-controller is attached to the conductive trace and data transmission means is connected to the micro-controller. A sensor is embedded within the PCB and is connected to the micro-controller via the conductive trace. The sensor is configured to sense at least one physiological parameter in a patient.
Abstract:
본 발명의 일실시예는 디스플레이 소자에서 기판 상에 설치된 연성인쇄회로기판의 구조에 관한 것으로, 어느 하나의 연성인쇄회로기판의 단부의 양극 패드 및 음극 패드 상에 어느 하나의 연성인쇄회로기판에 이웃하는 또 하나의 연성인쇄회로기판의 양극 리드 단자 및 음극 리드 단자가 각각 대응하여 겹쳐지고 서로 전도성 물질에 의해 통전되는 것이다.
Abstract:
The inventions relates to a method of manufacturing a circuit incorporating a solid state light emitting component (50), the method comprising providing an insulating layer (8), producing at least one through hole (20) in the insulating layer (8), providing a conductive layer (10), bonding a main surface (24) of the conductive layer (10) to the insulating layer (8), and positioning at least one solid state light emitting component (50,100) in the hole (20) of the insulating layer (8) and connecting this component to the conductive layer (10).
Abstract:
Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application.
Abstract:
Die Erfindung betrifft einen Leiterbahnträger (10), insbesondere ein mit vorzugsweise Kunststoff umspritztes Stanzgitter oder einen starren/flexiblen Schaltungsträger, mit einer oder mehreren Leiterbahnen (12), die zumindest teilweise von einem einstückig ausgebildeten Leiterbahnträgerbauteil (14) aufgenommen und gehalten werden. Erfindungsgemäß ist vorgesehen, dass das Leiterbahnträgerbauteil derart ausgebildet ist, dass es weiterhin zumindest eine Komponente eines oder mehrerer Sensoren (16) aufnimmt und hält. Darüber hinaus bezieht sich die Erfindung auf ein Verfahren zur Herstellung eines solchen Leiterbahnträgers (10).