公开(公告)号：WO2004060610A2

公开(公告)日：2004-07-22

申请号：PCT/JP2003/017032

申请日：2003-12-26

Applicant: EBARA CORPORATION ,  KABUSHIKI KAISHA TOSHIBA ,  TOGAWA, Tetsuji ,  WATANABE, Toshio ,  YANO, Hiroyuki ,  TOYOTA, Gen ,  IWADE, Kenji ,  TATEYAMA, Yoshikuni

Inventor： TOGAWA, Tetsuji ,  WATANABE, Toshio ,  YANO, Hiroyuki ,  TOYOTA, Gen ,  IWADE, Kenji ,  TATEYAMA, Yoshikuni

IPC: B24B37/04

CPC classification number: B24B37/015 ,  B24B41/061 ,  B24B55/02

Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1) has a mounting flange 2, a support member 6, and a retainer ring 3. A substrate W to be polished is held on the lower side of the support member 6 surrounded by the retainer ring 3, and the substrate W is pressed against a polishing surface. The mounting flange 2 is provided with a flow passage 26 contiguous with at least the retainer ring 3. A temperature-controlled gas is supplied through the flow passage 26 to cool the mounting flange 2, the support member 6 and the retainer ring 3. The retainer ring 3 is provided with a plurality of through-holes 3a communicating with the flow passage 26 to spray the gas flowing through the flow passage 26 onto the polishing surface of a polishing table.

Abstract translation: 衬底保持机构，衬底抛光装置和衬底抛光方法具有能够最小化抛光期间产生的热量的功能，并且有效地冷却衬底保持机构的衬底保持部分 基板保持机构，并且还能够有效地防止抛光液和抛光粉附着到基板保持部的外周部并在其上干燥。 基板保持机构（顶环1）具有安装凸缘2，支撑构件6和挡圈3.待被抛光的基板W保持在由挡圈3围绕的支撑构件6的下侧， 基板W被按压在研磨面上。 安装凸缘2设置有至少与保持环3邻接的流动通道26.通过流动通道26供应温度受控的气体以冷却安装凸缘2，支撑构件6和保持环3。 在保持环3上设有与流路26连通的多个贯通孔3a，以将流过流路26的气体喷射到研磨台的研磨面上。

公开(公告)号：WO2006041196A8

公开(公告)日：2006-06-29

申请号：PCT/JP2005019165

申请日：2005-10-12

Applicant: TOSHIBA KK ,  EBARA CORP ,  KUBOTA TAKEO ,  SHIGETA ATSUSHI ,  TOYOTA GEN ,  TAKAHASHI TAMAMI ,  FUKUOKA DAISAKU ,  ITO KENYA

Inventor： KUBOTA TAKEO ,  SHIGETA ATSUSHI ,  TOYOTA GEN ,  TAKAHASHI TAMAMI ,  FUKUOKA DAISAKU ,  ITO KENYA

IPC: H01L21/304 ,  B24B9/00 ,  B24B21/00

CPC classification number: H01L21/02021 ,  B24B9/065 ,  B24B21/002

Abstract: A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having a guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) to the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).

Abstract translation: 抛光装置具有研磨带（21），用于将研磨带（21）供给到研磨带（21）与切口部（11）接触的接触部（30）的供带盘（22） ）和用于从所述接触部（30）卷绕所述研磨带（21）的卷取卷轴（23）。 抛光装置还具有第一引导部分（24），其具有用于将研磨带（21）直接供应到接触部分（30）的引导表面（241）和具有用于供应的引导表面的第二引导部分（25） 研磨带（21）到卷取卷轴（23）。 第一引导部（24）的引导面（241）和/或第二引导部（25）的引导面具有与基板（10）的切口部（11）的形状对应的形状。

公开(公告)号：WO2006041196A1

公开(公告)日：2006-04-20

申请号：PCT/JP2005/019165

申请日：2005-10-12

Applicant: Kabushiki Kaisha Toshiba ,  EBARA CORPORATION ,  KUBOTA, Takeo ,  SHIGETA, Atsushi ,  TOYOTA, Gen ,  TAKAHASHI, Tamami ,  FUKUOKA, Daisaku ,  ITO, Kenya

Inventor： KUBOTA, Takeo ,  SHIGETA, Atsushi ,  TOYOTA, Gen ,  TAKAHASHI, Tamami ,  FUKUOKA, Daisaku ,  ITO, Kenya

IPC: H01L21/304 ,  B24B9/00 ,  B24B21/00

CPC classification number: H01L21/02021 ,  B24B9/065 ,  B24B21/002

Abstract: A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having a guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) to the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).

Abstract translation: 抛光装置具有抛光带（21），用于将抛光带（21）供应到带有抛光带（21）的接触部分（30）的供应带盘（22） 与基片（10）的切口部分（11）接触;以及卷取卷轴（23），用于从接触部分（30）卷绕抛光带（21）。 该抛光装置还具有第一导向部分（24）和第二导向部分（25），该第一导向部分具有用于将抛光带（21）直接供应到接触部分（30）的导向表面（241） 将研磨带（21）送到卷取卷轴（23）。 第一引导部分（24）的引导表面（241）和/或第二引导部分（25）的引导表面具有与基板（10）的凹口部分（11）的形状相对应的形状。 / p>

公开(公告)号：WO2004060610A3

公开(公告)日：2004-11-25

申请号：PCT/JP0317032

申请日：2003-12-26

Applicant: EBARA CORP ,  TOSHIBA KK ,  TOGAWA TETSUJI ,  WATANABE TOSHIO ,  YANO HIROYUKI ,  TOYOTA GEN ,  IWADE KENJI ,  TATEYAMA YOSHIKUNI

Inventor： TOGAWA TETSUJI ,  WATANABE TOSHIO ,  YANO HIROYUKI ,  TOYOTA GEN ,  IWADE KENJI ,  TATEYAMA YOSHIKUNI

IPC: B24B37/04 ,  B24B37/30 ,  B24B37/32 ,  B24B41/06 ,  B24B49/14 ,  B24B55/02 ,  H01L21/304

CPC classification number: B24B37/015 ,  B24B41/061 ,  B24B55/02

Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1) has a mounting flange 2, a support member 6, and a retainer ring 3. A substrate W to be polished is held on the lower side of the support member 6 surrounded by the retainer ring 3, and the substrate W is pressed against a polishing surface. The mounting flange 2 is provided with a flow passage 26 contiguous with at least the retainer ring 3. A temperature-controlled gas is supplied through the flow passage 26 to cool the mounting flange 2, the support member 6 and the retainer ring 3. The retainer ring 3 is provided with a plurality of through-holes 3a communicating with the flow passage 26 to spray the gas flowing through the flow passage 26 onto the polishing surface of a polishing table.

Abstract translation: 基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地 防止研磨液和研磨粉尘附着在基板保持部的外周部并在其上干燥。 基板保持机构（顶环1）具有安装凸缘2，支撑构件6和保持环3.待被抛光的基板W被保持在由保持环3包围的支撑构件6的下侧， 将基板W压在研磨面上。 安装凸缘2设置有与至少保持环3相邻的流动通道26.通过流动通道26供应温度控制的气体以冷却安装凸缘2，支撑构件6和保持环3。 保持环3设置有与流路26连通的多个通孔3a，以将流过流路26的气体喷射到研磨台的研磨面上。