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    PROPORTIONAL MICROMECHANICAL DEVICE
    2.
    发明申请
    PROPORTIONAL MICROMECHANICAL DEVICE 审中-公开
    比例微机械装置

    公开(公告)号：WO0014415A3

    公开(公告)日：2000-07-06

    申请号：PCT/US9919971

    申请日：1999-08-31

    Applicant: LUCAS NOVASENSOR ,  MALUF NADIM I ,  WILLIAMS KIRT R ,  DRIEENHUIZEN BERT P VAN ,  FULLER EDWARD NELSON ,  BARRON RICHARD J

    Inventor： MALUF NADIM I ,  WILLIAMS KIRT R ,  VAN DRIEENHUIZEN BERT P ,  FULLER EDWARD NELSON ,  BARRON RICHARD J

    IPC: B60T8/36 ,  B81B3/00 ,  F15C3/00 ,  F15C5/00 ,  F16K31/00 ,  F16K31/02 ,  F16K31/18 ,  F16K99/00

    CPC classification number: F16K99/0001 ,  B81B3/0024 ,  F15C5/00 ,  F16K99/0011 ,  F16K99/0044 ,  F16K2099/0074 ,  F16K2099/008 ,  F16K2099/0098 ,  Y10T137/0396

    Abstract: The present invention provides a proportional microvalve (10) having a first (12), second (14) and third layer (16), and having high aspect ratio geometries. The first layer (12) defines a cavity (24) with inlet (20) and outlet (22) ports. The second layer (14), doped to have a low resistivity and bonded between the first (12) and third (16) layers, defines a cavity (24) having a flow area to permit fluid flow between the inlet (20) and outlet (22) ports. The second layer (14) further defines an actuatable displaceable member (26), and one or more thermal actuators (28, 30) for actuating the displaceable member (26) to a position between and including an open and a closed position to permit or occlude fluid flow. The third layer (16) provides one wall of the cavity (24) and provides electrical contacts (32a, 32b, 34a, 34b) for electrically heating the thermally expandable actuators (28, 30). The thermal actuators (28, 30) and the displaceable member (26) have high aspect ratios and are formed by deep reactive ion etching such that they are displaceable in the plane of the second layer (14) while being very stiff out of the plane. Thus, both actuation and displacement of the displaceable member (26) are in the plane of the layer.

    Abstract translation: 本发明提供了具有第一层（12），第二层（14）和第三层（16）并具有高纵横比几何形状的比例微型阀（10）。 第一层（12）限定了具有入口（20）和出口（22）端口的空腔（24）。 被掺杂为具有低电阻率并且结合在第一层（12）和第三层（16）之间的第二层（14）限定了具有流动区域的空腔（24），以允许流体在入口（20）和出口 （22）端口。 第二层（14）还限定了可致动的可移动构件（26）以及一个或多个热致动器（28,30），用于致动可移动构件（26）至包括打开位置和闭合位置之间的位置，以允许或 阻塞流体流动。 第三层（16）提供空腔（24）的一个壁并且提供用于电加热热膨胀致动器（28,30）的电触点（32a，32b，34a，34b）。 热致动器（28,30）和可位移构件（26）具有高纵横比并且通过深反应离子蚀刻形成，使得它们可以在第二层（14）的平面内移位，同时在平面外非常硬 。 因此，可移动构件（26）的致动和位移都在层的平面中。

    PROPORTIONAL MICROMECHANICAL VALVE
    3.
    发明申请
    PROPORTIONAL MICROMECHANICAL VALVE 审中-公开

    公开(公告)号：WO2003052081A3

    公开(公告)日：2003-06-26

    申请号：PCT/US2002/040595

    申请日：2002-12-18

    Applicant: GE NOVASENSOR, INC. ,  MALUF, Nadim, I. ,  WILLIAMS, Kirt, R. ,  VAN DRIEËHUIZEN, Bert, P. ,  FULLER, Edward, Nelson ,  BARRON, Richard, J.

    Inventor： MALUF, Nadim, I. ,  WILLIAMS, Kirt, R. ,  VAN DRIEËHUIZEN, Bert, P. ,  FULLER, Edward, Nelson ,  BARRON, Richard, J.

    IPC: F16K31/02

    Abstract: The present invention provides a proportional microvalve (10) having a first (12), second (14) and third layer (16), and having high aspect ratio geometries. The first layer defines a cavity with inlet (20) and outlet ports (22). The second layer, doped to have a low resistivity and bonded between the first and third layers, defines a cavity having a flow area to permit fluid flow between the inlet and outlet ports. The second layer further defines an actuatable displaceable member (26), and one or more thermal actuators (28, 30) for actuating the displaceable member to a position between and including an open and a closed position to permit or occlude fluid flow. The third layer provides one wall of the cavity and provides electrical contacts (32a, 32b, 34a, 34b) for electrically heating the thermally expandable actuators. The thermal actuators and the displaceable member have high aspect ratios and are formed by deep reactive ion etching such that they are displaceable in the plane of the second layer while being very stiff out of the plane. Thus, both actuation and displacement of the displaceable member are in the plane of the layer.

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