公开(公告)号：WO1997032460A1

公开(公告)日：1997-09-04

申请号：PCT/CH1996000064

申请日：1996-02-29

Applicant: ALPHASEM AG ,  WIRZ, Gustav ,  FORSTER, Martin

Inventor： ALPHASEM AG

IPC: H05K13/00

CPC classification number: H05K13/0408 ,  H01L21/6838 ,  Y10T29/53178

Abstract: Workpieces (1), e.g. chips, are removed from a locating plane (3) using a transfer unit (2) and transported to a delivery plane (5). The feed path (4) is, consequently, covered in two working phases, each workpiece being deposited on an intermediate station (6) arranged in the region of the feed path. The transfer unit (2) has two working heads (7, 8) which each simultaneously transport a workpiece from the receiving plane to the intermediate station, and from the intermediate station to the delivery plane. The workpiece can optionally be pivoted or rotated to the intermediate station with the result that its lower surface can be grasped by the depositing head (8).

Abstract translation: 工件（1），如 芯片通过转印单元（2）的装置从接收面去除（3）和一个分配平面（5）输送。 进给路径（4）在两个工作周期在这里完成，每个工件在Zustellwegs中间站（6）的区域中发送到一个地布置。 转印单元（2）具有两个工作头（7,8），其中的每一个同时传输从接收平面的工件到中间站和从所述中间站的分配平面。 在中间站中，工件可以被选择性地枢转或旋转，使得它可以与所述沉积头（8）在其下侧被触及。